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公开(公告)号：US20100001304A1
公开(公告)日：2010-01-07
申请号：US12560934
申请日：2009-09-16
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L33/505 , H01L33/62 , H01L33/647 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/15787 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the substrate.
摘要翻译： 发光二极管包括LED元件，设置为覆盖LED元件的荧光材料，LED元件安装在其上的陶瓷或硅制成的基板以及与LED电连接的一对电极焊盘 元件。
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公开(公告)号：US07622317B2
公开(公告)日：2009-11-24
申请号：US11469026
申请日：2006-08-31
IPC分类号： H01L21/00
CPC分类号： H01L33/504 , H01L24/97 , H01L33/505 , H01L33/62 , H01L33/647 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/15787 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the substrate.
摘要翻译： 发光二极管包括LED元件，设置为覆盖LED元件的荧光材料，LED元件安装在其上的陶瓷或硅制成的基板以及与LED电连接的一对电极焊盘 元件。
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公开(公告)号：US08100555B2
公开(公告)日：2012-01-24
申请号：US12851722
申请日：2010-08-06
IPC分类号： F21V1/00
CPC分类号： F21V11/16 , F21K9/00 , F21Y2115/10 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2924/16195
摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.
摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。
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74.发明授权Electronic component device, method of manufacturing the same and wiring substrate 有权电子部件装置及其制造方法以及配线基板公开(公告)号：US08878357B2
公开(公告)日：2014-11-04
申请号：US13221064
申请日：2011-08-30
IPC分类号： H01L23/04 , H01L21/50 , H01L21/683 , H01L23/10 , B81B7/00 , H01L23/055 , H01L23/00 , H01L23/13
CPC分类号： H01L23/10 , B81B7/0048 , B81C2203/019 , H01L21/50 , H01L21/6835 , H01L23/055 , H01L23/13 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68372 , H01L2224/0401 , H01L2224/05644 , H01L2224/13109 , H01L2224/81191 , H01L2224/81192 , H01L2224/81203 , H01L2224/81409 , H01L2224/81444 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1461 , H01L2924/15788 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.
摘要翻译： 一种电子部件装置，包括：基板，由金属材料制成的电极柱，设置在基板上，以及连接电极与电极柱连接的电子部件，其中，电子部件的连接电极和电极柱 通过包含与电极柱的金属材料不同的金属的合金层连接。
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公开(公告)号：US08039967B2
公开(公告)日：2011-10-18
申请号：US12686590
申请日：2010-01-13
CPC分类号： B81B7/0074 , H01L24/16 , H01L24/45 , H01L24/85 , H01L2224/16 , H01L2224/16235 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H05K3/328 , H05K2201/10287 , H05K2201/10454 , H05K2201/10727 , H05K2201/10946 , H01L2924/00 , H01L2224/48
摘要： A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.
摘要翻译： 布线基板包括硅基板，形成为在厚度方向上穿透硅基板的通孔，形成在硅基板的两个表面和侧表面上的绝缘层和通孔的内表面，形成在 所述通孔，形成在所述硅衬底的至少一个表面上并连接到所述穿透电极的布线层和连接到所述布线层并形成为从所述硅衬底的一个表面延伸到其侧表面的金属线端子 。 电子装置的侧面上的金属线端子与安装基板连接，使得其中电子部件安装在布线基板上的电子装置的基板方向与安装基板的基板方向正交地交叉。
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公开(公告)号：US20070015315A1
公开(公告)日：2007-01-18
申请号：US11484039
申请日：2006-07-11
IPC分类号： H01L21/00
CPC分类号： H01L33/50 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/19107 , H01L2933/0041 , H05K1/183 , H05K2201/10106 , H01L2924/00 , H01L2924/00014
摘要： A manufacturing method of a semiconductor device is disclosed. The manufacturing method includes a first step that mounts plural semiconductor elements on a first substrate, a second step that inspects each of the semiconductor elements mounted on the first substrate, a third step that divides the first substrate by dicing so that a divided first substrate includes at least one semiconductor element, and a fourth step that mounts the divided first substrate in which at least one semiconductor element is mounted on a second substrate.
摘要翻译： 公开了一种半导体器件的制造方法。 该制造方法包括在第一基板上安装多个半导体元件的第一工序，检查安装在第一基板上的各半导体元件的第二工序，第三工序，通过切割分割第一基板，使得分割的第一基板包括 至少一个半导体元件，以及第四步骤，其将安装有至少一个半导体元件的分割的第一基板安装在第二基板上。
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77.发明授权公开(公告)号：US08212355B2
公开(公告)日：2012-07-03
申请号：US12760419
申请日：2010-04-14
申请人： Masahiro Sunohara , Yuichi Taguchi
发明人： Masahiro Sunohara , Yuichi Taguchi
IPC分类号： H01L23/488 , H01L21/60 , H01L21/768 , H01L23/48
CPC分类号： H01L23/481 , H01L21/6835 , H01L21/7682 , H01L21/76898 , H01L23/3114 , H01L23/3185 , H01L23/49811 , H01L23/49822 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2221/6835 , H01L2224/05001 , H01L2224/05009 , H01L2224/05023 , H01L2224/05025 , H01L2224/05568 , H01L2224/13009 , H01L2224/13016 , H01L2224/13019 , H01L2224/13021 , H01L2224/13025 , H01L2224/13076 , H01L2224/13111 , H01L2224/13116 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10157 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099
摘要： A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.
摘要翻译： 半导体封装包括半导体器件和安装半导体器件的布线板。 半导体器件包括半导体衬底，穿孔电极，其被构造成穿透半导体衬底并电连接布线板和半导体器件;以及环形凹部，其设置成围绕穿刺电极，环形凹部 被配置为向半导体衬底的布线板侧开口。
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78.发明授权公开(公告)号：US08532457B2
公开(公告)日：2013-09-10
申请号：US12969832
申请日：2010-12-16
申请人： Akinori Shiraishi , Yuichi Taguchi
发明人： Akinori Shiraishi , Yuichi Taguchi
IPC分类号： G02B6/10
CPC分类号： B29D11/00663 , G02B6/43
摘要： A method for manufacturing an optical waveguide which includes a core configured to transmit an optical signal, and a mirror portion configured to reflect the optical signal, the method includes: forming a mask layer patterned in a predetermined shape, on a first crystal plane of a substrate made of a crystalline material; etching the first crystal plane by a wet-etching using the mask layer to form a groove having a plurality of crystal planes; providing a metallic reflection film on at least one of the plurality of crystal planes to form the mirror portion; and providing the groove with a core material to form the core.
摘要翻译： 一种制造光波导的方法，该光波导包括被配置为透射光信号的芯体和被配置为反射光信号的反射镜部分，所述方法包括：形成图案化为预定形状的掩模层， 由结晶材料制成的基材; 通过使用掩模层的湿蚀刻蚀刻第一晶体面以形成具有多个晶面的凹槽; 在所述多个晶面中的至少一个上提供金属反射膜以形成所述镜部分; 以及为所述槽提供芯材以形成所述芯。
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公开(公告)号：US20070108591A1
公开(公告)日：2007-05-17
申请号：US11505899
申请日：2006-08-18
申请人： Masahiro Sunohara , Yuichi Taguchi
发明人： Masahiro Sunohara , Yuichi Taguchi
IPC分类号： H01L23/12
CPC分类号： H05K3/445 , H01L21/486 , H01L21/4867 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/005 , H05K3/4053 , H05K2203/0108 , H01L2924/00
摘要： An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring, the upper wiring and the lower wiring are respectively formed on preliminary wiring patterns that are additionally simultaneously or sequentially formed on layers made of an insulating material applied to at least wiring forming parts of the substrate, and are formed with a metal mold itself used for forming the preliminary wiring patterns or layers made of a wiring material applied by a printing operation, a plating operation or a deposition on the preliminary wiring patterns formed on the layers of the insulating material by transferring a fine structure pattern of the metal mold.
摘要翻译： 插入件包括由无机材料制成的基板; 包括嵌入通孔中的导体的贯通布线; 以及上部布线和（或）下部布线。 通过布线，上布线和下布线分别形成在预先布线图案上，该布线图案另外同时或顺序地形成在由施加到基板的布线形成部分的绝缘材料制成的层上，并且形成有金属模具 其本身用于通过转印金属模具的精细结构图案来形成由通过印刷操作，电镀操作或沉积施加的布线材料制成的初步布线图案或层叠在形成在绝缘材料层上的预备布线图案上 。
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80.发明申请公开(公告)号：US20110150405A1
公开(公告)日：2011-06-23
申请号：US12969832
申请日：2010-12-16
申请人： Akinori SHIRAISHI , Yuichi Taguchi
发明人： Akinori SHIRAISHI , Yuichi Taguchi
CPC分类号： B29D11/00663 , G02B6/43
摘要： A method for manufacturing an optical waveguide which includes a core configured to transmit an optical signal, and a mirror portion configured to reflect the optical signal, the method includes: forming a mask layer patterned in a predetermined shape, on a first crystal plane of a substrate made of a crystalline material; etching the first crystal plane by a wet-etching using the mask layer to form a groove having a plurality of crystal planes; providing a metallic reflection film on at least one of the plurality of crystal planes to form the mirror portion; and providing the groove with a core material to form the core.
摘要翻译： 一种制造光波导的方法，该光波导包括被配置为透射光信号的芯体和被配置为反射光信号的反射镜部分，所述方法包括：形成图案化为预定形状的掩模层， 由结晶材料制成的基材; 通过使用掩模层的湿蚀刻蚀刻第一晶体面以形成具有多个晶面的凹槽; 在所述多个晶面中的至少一个上提供金属反射膜以形成所述镜部分; 以及为所述槽提供芯材以形成所述芯。
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