公开(公告)号：US20050029666A1

公开(公告)日：2005-02-10

申请号：US10487990

申请日：2002-08-27

申请人： Yasutoshi Kurihara ,  Yoshimasa Takahashi ,  Tsuneo Endoh ,  Mikio Negishi ,  Masashi Yamaura ,  Hirokazu Nakajima ,  Yosuke Sakurai ,  Hironori Kodama

发明人： Yasutoshi Kurihara ,  Yoshimasa Takahashi ,  Tsuneo Endoh ,  Mikio Negishi ,  Masashi Yamaura ,  Hirokazu Nakajima ,  Yosuke Sakurai ,  Hironori Kodama

IPC分类号： B23K35/02 ,  B23K35/26 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/85 ,  B23K35/0244 ,  B23K35/262 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/552 ,  H01L23/642 ,  H01L24/01 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29223 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29249 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29266 ,  H01L2224/2927 ,  H01L2224/29272 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/35121 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01029

摘要： A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.

摘要翻译： 公开了一种半导体器件，其中将粘合芯片部件和布线部件的焊料层封装在树脂层中，并且焊料层由金属粉末分布在基体金属中的复合体构成。 当将其中芯片部件与焊料一起安装在布线部件中的半导体器件时，将树脂密封的焊接部件二次安装在外部布线部件上，由于流出而导致焊料的流出和短路， 可以防止切断部件和芯片部件的位移。

公开(公告)号：US07468294B2

公开(公告)日：2008-12-23

申请号：US10985049

申请日：2004-11-10

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US20050082683A1

公开(公告)日：2005-04-21

申请号：US10985049

申请日：2004-11-10

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H05K3/28 ,  H01L23/48

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US06831360B2

公开(公告)日：2004-12-14

申请号：US10021173

申请日：2001-12-19

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L2334

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US07995984B2

公开(公告)日：2011-08-09

申请号：US12244908

申请日：2008-10-03

申请人： Tomoaki Kudaishi ,  Satoshi Sakurai ,  Takayuki Tsutsui ,  Masashi Yamaura ,  Reiichi Arai ,  Takayuki Maehara

发明人： Tomoaki Kudaishi ,  Satoshi Sakurai ,  Takayuki Tsutsui ,  Masashi Yamaura ,  Reiichi Arai ,  Takayuki Maehara

IPC分类号： H04B1/28

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention aims to reduce an exclusively-possessed area of each of bonding wires mounted over a wiring board, for coupling a power amplifying unit of a semiconductor chip and an antenna switch of a second semiconductor chip in a semiconductor device that configures an RF module. In the RF module, the first semiconductor chip and the second semiconductor chip are mounted side by side in a central area of the wiring board. The first semiconductor chip is formed with amplifier circuits and a control circuit and comprises a silicon substrate or a compound semiconductor substrate. On the other hand, the second semiconductor chip is formed with an antenna switch and comprises the silicon substrate or compound semiconductor substrate. Pads of the first semiconductor chip and pads of the second semiconductor chip are respectively electrically coupled to one another. This coupling is carried out by the bonding wires formed in the surface of the wiring board and the bonding wires formed inside the wiring board.

摘要翻译： 本发明的目的在于减少安装在布线板上的各引线的独占区域，用于将半导体芯片的功率放大单元和第二半导体芯片的天线开关耦合到半导体器件中，该半导体器件配置RF模块 。 在RF模块中，第一半导体芯片和第二半导体芯片并排安装在布线板的中心区域中。 第一半导体芯片由放大器电路和控制电路形成，并且包括硅衬底或化合物半导体衬底。 另一方面，第二半导体芯片由天线开关形成，并且包括硅衬底或化合物半导体衬底。 第一半导体芯片的焊盘和第二半导体芯片的焊盘彼此分别电耦合。 通过形成在布线板的表面的接合线和形成在布线基板内的接合线进行该耦合。

公开(公告)号：US20110141428A1

公开(公告)日：2011-06-16

申请号：US12676704

申请日：2007-10-03

申请人： Naoki Maruyama ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masashi Yamaura

发明人： Naoki Maruyama ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masashi Yamaura

IPC分类号： G02F1/1339

CPC分类号： G02F1/13394 ,  G02F2001/13398

摘要： A process for producing a spacer for a liquid crystal display apparatus whereby an ink-jet method is used to print droplets composed of an ink that contains a resin and a solvent that dissolves it but that contains essentially no solid particles on a substrate 23, and the solvent is removed from the droplets on the substrate 23 to form a spacer 11 situated at a prescribed location on the substrate 23, wherein A in the following formula (1) is −10 to 15 mJ/m2, where X mN/m is the surface tension of the ink at 25° C. and Y mJ/m2 is the surface free energy of the substrate 23 at 25° C. A=X−Y  (1)

摘要翻译： 一种用于制造用于液晶显示装置的间隔件的方法，其中使用喷墨方法来印刷由包含树脂的溶剂和基本上不含固体颗粒的溶剂构成的油墨，以及 从基板23上的液滴除去溶剂，形成位于基板23的规定位置的间隔物11，其中，下式（1）中的A为-10〜15mJ / m 2，其中，X mN / m为 在25℃下油墨的表面张力和Y mJ / m 2是25℃时基体23的表面自由能。A = X-Y（1）

公开(公告)号：US20090130996A1

公开(公告)日：2009-05-21

申请号：US12244908

申请日：2008-10-03

申请人： Tomoaki Kudaishi ,  Satoshi Sakurai ,  Takayuki Tsutsui ,  Masashi Yamaura ,  Reiichi Arai ,  Takayuki Maehara

发明人： Tomoaki Kudaishi ,  Satoshi Sakurai ,  Takayuki Tsutsui ,  Masashi Yamaura ,  Reiichi Arai ,  Takayuki Maehara

IPC分类号： H04B1/38 ,  H01L23/49

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The present invention aims to reduce an exclusively-possessed area of each of bonding wires mounted over a wiring board, for coupling a power amplifying unit of a semiconductor chip and an antenna switch of a second semiconductor chip in a semiconductor device that configures an RF module. In the RF module, the first semiconductor chip and the second semiconductor chip are mounted side by side in a central area of the wiring board. The first semiconductor chip is formed with amplifier circuits and a control circuit and comprises a silicon substrate or a compound semiconductor substrate. On the other hand, the second semiconductor chip is formed with an antenna switch and comprises the silicon substrate or compound semiconductor substrate. Pads of the first semiconductor chip and pads of the second semiconductor chip are respectively electrically coupled to one another. This coupling is carried out by the bonding wires formed in the surface of the wiring board and the bonding wires formed inside the wiring board.

摘要翻译： 本发明的目的在于减少安装在布线板上的各引线的独占区域，用于将半导体芯片的功率放大单元和第二半导体芯片的天线开关耦合到半导体器件中，该半导体器件配置RF模块 。 在RF模块中，第一半导体芯片和第二半导体芯片并排安装在布线板的中心区域中。 第一半导体芯片由放大器电路和控制电路形成，并且包括硅衬底或化合物半导体衬底。 另一方面，第二半导体芯片由天线开关形成，并且包括硅衬底或化合物半导体衬底。 第一半导体芯片的焊盘和第二半导体芯片的焊盘彼此分别电耦合。 通过形成在布线板的表面的接合线和形成在布线基板内的接合线进行该耦合。