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公开(公告)号:CN102487021A
公开(公告)日:2012-06-06
申请号:CN201110046083.4
申请日:2011-02-25
申请人: 新科金朋有限公司 , 星科金朋(上海)有限公司
发明人: R.D.潘德塞
IPC分类号: H01L21/50 , H01L21/60 , H01L23/00 , H01L23/498 , H01L23/488
CPC分类号: H01L24/17 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L23/528 , H01L24/03 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/09133 , H01L2224/09135 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13016 , H01L2224/13018 , H01L2224/13019 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/17133 , H01L2224/27013 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48157 , H01L2224/48158 , H01L2224/4816 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/812 , H01L2224/81385 , H01L2224/81801 , H01L2224/94 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本发明涉及形成用于倒装半导体管芯的焊盘布局的半导体器件和方法。一种半导体器件具有带有管芯焊盘布局的半导体管芯。管芯焊盘布局中的信号焊盘主要位于半导体管芯周边附近,并且功率焊盘和接地焊盘主要位于自信号焊盘的内侧。信号焊盘被布置成大体上平行于半导体管芯边缘的周边行或周边阵列。在信号焊盘、功率焊盘和接地焊盘上形成凸块。凸块可以具有可熔部分和非可熔部分。在基底上形成具有互连点的导电迹线。凸块比互连点宽。所述凸块被结合到互连点,使得凸块覆盖互连点的顶面和侧面。在半导体管芯与基底之间的凸块周围沉积密封剂。
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公开(公告)号:CN101752334A
公开(公告)日:2010-06-23
申请号:CN200910224397.1
申请日:2009-12-02
申请人: 株式会社瑞萨科技
IPC分类号: H01L23/48 , H01L23/485 , H01L23/49 , H01L21/60
CPC分类号: H01L24/05 , H01L21/565 , H01L22/32 , H01L23/485 , H01L23/49816 , H01L24/06 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/02205 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/05027 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05173 , H01L2224/05181 , H01L2224/05184 , H01L2224/05553 , H01L2224/05554 , H01L2224/05558 , H01L2224/05564 , H01L2224/05568 , H01L2224/05572 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/0568 , H01L2224/06183 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/2919 , H01L2224/29198 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/4502 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/46 , H01L2224/4807 , H01L2224/48095 , H01L2224/48145 , H01L2224/48158 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/4878 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2225/0651 , H01L2225/06517 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2924/00014 , H01L2924/01039 , H01L2924/0665 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/0002 , H01L2924/00015
摘要: 本发明提供一种半导体集成电路器件。在用于车辆用途等的半导体集成电路器件中,为便于安装,通常通过导线键合等,使用金导线等将半导体芯片上的铝焊盘和外部器件彼此耦合。然而,这种半导体集成电路器件由于在相对较高温度(约150℃)下长时间的使用中铝和金之间的相互作用而造成连接故障。本申请的发明提供一种半导体集成电路器件(半导体器件或电子电路器件),其包括作为该器件的一部分的半导体芯片、经由阻挡金属膜设置在半导体芯片上基于铝的键合焊盘之上的电解金镀覆表面膜(基于金的金属镀覆膜)和用于该镀覆表面膜和设置在布线板等(布线衬底)之上的外部引线之间的互连的金键合导线(基于金的键合导线)。
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公开(公告)号:CN102487021B
公开(公告)日:2015-10-07
申请号:CN201110046083.4
申请日:2011-02-25
申请人: 新科金朋有限公司 , 星科金朋(上海)有限公司
发明人: R.D.潘德塞
IPC分类号: H01L21/50 , H01L21/60 , H01L23/00 , H01L23/498 , H01L23/488
CPC分类号: H01L24/17 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L23/528 , H01L24/03 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/09133 , H01L2224/09135 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13016 , H01L2224/13018 , H01L2224/13019 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/17133 , H01L2224/27013 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48157 , H01L2224/48158 , H01L2224/4816 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/812 , H01L2224/81385 , H01L2224/81801 , H01L2224/94 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本发明涉及形成用于倒装半导体管芯的焊盘布局的半导体器件和方法。一种半导体器件具有带有管芯焊盘布局的半导体管芯。管芯焊盘布局中的信号焊盘主要位于半导体管芯周边附近,并且功率焊盘和接地焊盘主要位于自信号焊盘的内侧。信号焊盘被布置成大体上平行于半导体管芯边缘的周边行或周边阵列。在信号焊盘、功率焊盘和接地焊盘上形成凸块。凸块可以具有可熔部分和非可熔部分。在基底上形成具有互连点的导电迹线。凸块比互连点宽。所述凸块被结合到互连点,使得凸块覆盖互连点的顶面和侧面。在半导体管芯与基底之间的凸块周围沉积密封剂。
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公开(公告)号:CN103681595A
公开(公告)日:2014-03-26
申请号:CN201310725962.9
申请日:2009-12-02
申请人: 瑞萨电子株式会社
IPC分类号: H01L23/498 , H01L23/49
CPC分类号: H01L24/05 , H01L21/565 , H01L22/32 , H01L23/485 , H01L23/49816 , H01L24/06 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/02205 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/05027 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05173 , H01L2224/05181 , H01L2224/05184 , H01L2224/05553 , H01L2224/05554 , H01L2224/05558 , H01L2224/05564 , H01L2224/05568 , H01L2224/05572 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/0568 , H01L2224/06183 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/2919 , H01L2224/29198 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/4502 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/46 , H01L2224/4807 , H01L2224/48095 , H01L2224/48145 , H01L2224/48158 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/4878 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2225/0651 , H01L2225/06517 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2924/00014 , H01L2924/01039 , H01L2924/0665 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/0002 , H01L2924/00015
摘要: 本发明提供一种半导体集成电路器件。在用于车辆用途等的半导体集成电路器件中,为便于安装,通常通过导线键合等,使用金导线等将半导体芯片上的铝焊盘和外部器件彼此耦合。然而,这种半导体集成电路器件由于在相对较高温度(约150℃)下长时间的使用中铝和金之间的相互作用而造成连接故障。本申请的发明提供一种半导体集成电路器件(半导体器件或电子电路器件),其包括作为该器件的一部分的半导体芯片、经由阻挡金属膜设置在半导体芯片上基于铝的键合焊盘之上的电解金镀覆表面膜(基于金的金属镀覆膜)和用于该镀覆表面膜和设置在布线板等(布线衬底)之上的外部引线之间的互连的金键合导线(基于金的键合导线)。
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