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公开(公告)号：JPWO2007072616A1
公开(公告)日：2009-05-28
申请号：JP2007509813
申请日：2006-10-05
申请人： 株式会社村田製作所
CPC分类号： H05K1/141 , H01L23/552 , H01L2224/16225 , H01L2924/19105 , H05K1/0218 , H05K1/144 , H05K1/181 , H05K1/183 , H05K3/20 , H05K3/284 , H05K3/3442 , H05K2201/045
摘要： 【課題】コスト低減が可能で、歩留り向上を達成できる部品内蔵モジュールを提供する。【解決手段】部品内蔵モジュールAは、上面に第1の配線2を有するモジュール基板1と、モジュール基板の第1の配線上に実装された第1の回路部品7と、第1の回路部品が実装された箇所以外のモジュール基板の第1の配線上に実装され、モジュール基板より小面積のサブモジュール基板10と、サブモジュール基板の上面の第2の配線11に実装された第2の回路部品15と、モジュール基板の上面全面に、第1の回路部品、第2の回路部品およびサブモジュール基板を包み込むように形成された絶縁樹脂層20とを備える。サブモジュール基板10としてモジュール基板1より配線精度の高い基板を使用することで、サブモジュール基板上に集積回路素子15aを搭載でき、信頼性が高く安価な部品内蔵モジュールを得る。【選択図】図1
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公开(公告)号：JPWO2004112450A1
公开(公告)日：2006-07-20
申请号：JP2005500756
申请日：2003-06-12
申请人： 富士通株式会社
CPC分类号： H05K1/141 , H05K1/182 , H05K3/366 , H05K2201/045 , H05K2201/09072 , H05K2203/1572
摘要： 少なくとも2枚の基板を絶縁部材を介して貼り合わせることにより貼合せ基板を形成し、前記貼合せ基板にスルーホールを形成し、前記貼合せ基板の一方の面に第1の電子部品を搭載し、前記貼合せ基板の他方の面に第2の電子部品を搭載し、前記第1の電子部品と前記第2の電子部品とを、前記スルーホールを介して電気的に接続する。
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公开(公告)号：JP2005346625A
公开(公告)日：2005-12-15
申请号：JP2004168525
申请日：2004-06-07
发明人： SAEKI TAKANORI
CPC分类号： G11C5/066 , G06F13/1684 , G11C5/04 , H05K1/14 , H05K1/141 , H05K3/366 , H05K2201/045 , H05K2201/10159 , Y02D10/14
摘要： PROBLEM TO BE SOLVED: To provide a memory module facilitating coping with large capacity and high speed. SOLUTION: This hierarchical module has: first module boards 10 1 -10 8 each mounted with a plurality of DRAM devices 11; and a second module board 20 mounted with the first modules 10 1 -10 8 , provided with a signal line group respectively connected to the plurality of first modules side by side, and mounted with a controlling LSI 50 connected to the first modules via the signal line group provided side by side, performing conversion into signal lines of a smaller number than the total number of the signal line group and performing output. The second module board 20 is mounted on a motherboard 40. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译： 要解决的问题：提供便于应对大容量和高速度的存储器模块。
解决方案：该分层模块具有：每个安装有多个DRAM装置11的第一模块板10 -10
8 以及安装有第一模块10＆lt; SB＆gt; -10＆lt; SB＆gt; 8＆lt; SB＆gt;之间的第二模块板20，其具有并排分别连接到多个第一模块的信号线组，以及 安装有通过并排设置的信号线组连接到第一模块的控制LSI50，执行到比信号线组的总数少的信号线的转换并执行输出。 第二模块板20安装在主板40上。版权所有（C）2006，JPO＆NCIPI -
公开(公告)号：JP2004273938A
公开(公告)日：2004-09-30
申请号：JP2003065392
申请日：2003-03-11
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NISHIMURA TAKAO , AIBA KAZUYUKI , TAKASHIMA AKIRA
IPC分类号： H01L25/18 , H01L23/31 , H01L25/065 , H01L25/10 , H01L25/11 , H05K1/02 , H05K1/14 , H05K1/16 , H05K3/34
CPC分类号： H05K1/141 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06558 , H01L2225/06568 , H01L2225/06572 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/023 , H05K1/144 , H05K1/145 , H05K1/16 , H05K3/3436 , H05K2201/045 , H05K2201/049 , H05K2201/10515 , H05K2201/10734 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To stack a general-purpose semiconductor device part (semiconductor device) regarding a stacked semiconductor device having a three-dimensional structure wherein a plurality of semiconductor device parts and semiconductor elements are stacked.
SOLUTION: An interposer substrate 13A is disposed between an upper device part 11A and a lower device part 12A. The upper device part 11A has a semiconductor element 14A, a first wiring substrate 16A and an external connection terminal 22. The lower device part 12A has a second wiring substrate 17A located in a lower part of the upper device part 11A, a semiconductor element 15A and a connection electrode 26 formed in an upper surface 24A of the second wiring substrate 17A. The interposer substrate 13A has a circuit substrate body 18A disposed between the first wiring substrate 16A and the second wiring substrate 17A, a first conductive member 32 connected to the connection electrode 26, a second conductive member 33 which is formed corresponding to a formation position of the external connection terminal 22 and electrically connected to the external connection terminal 22 and a third conductive member 34A connecting the first conductive member 32 and the second conductive member 33.
COPYRIGHT: (C)2004,JPO&NCIPI-
公开(公告)号：JP2003298204A
公开(公告)日：2003-10-17
申请号：JP2002093633
申请日：2002-03-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUZUKI YUKIKO , SAKUMA KATSUMI , KIYONO TAKEHIRO , MASUDA KEIJI , SUGATA AKIHIKO
IPC分类号： H05K1/16 , H01P1/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H05K1/141 , H05K1/0243 , H05K3/0061 , H05K3/3442 , H05K3/366 , H05K3/403 , H05K2201/045 , H05K2201/049 , H05K2201/0792 , H05K2201/09181 , H05K2201/1003 , H05K2201/10515 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of a high frequency component, which can be manufactured at low cost and can reduce parasitic capacitance. SOLUTION: This mounting structure comprises a metal base, a first substrate whose backside is adhered to the metal base and which has a first wiring pattern on the surface, a second substrate which has a second wiring pattern thereon and whose backside is adhered to the surface of the first substrate in mounting so that the second wiring pattern is connected to the first wiring pattern, and a component which is mounted on the surface of the second substrate so as to be connected with the second wiring pattern. COPYRIGHT: (C)2004,JPO
摘要翻译： 要解决的问题：提供可以以低成本制造并可以减少寄生电容的高频分量的安装结构。 解决方案：该安装结构包括金属基底，其背面粘附到金属基底并且在表面上具有第一布线图案的第一基底，其上具有第二布线图案并且其背面被粘附的第二基底 到第一基板的表面，使得第二布线图案连接到第一布线图案，以及安装在第二基板的表面上以与第二布线图形连接的部件。 版权所有（C）2004，JPO
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公开(公告)号：JP5105042B2
公开(公告)日：2012-12-19
申请号：JP2006081664
申请日：2006-03-23
申请人： イビデン株式会社
发明人： 俊彦 横幕
CPC分类号： H05K3/3463 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/16251 , H05K1/0262 , H05K1/141 , H05K3/341 , H05K3/3415 , H05K3/3457 , H05K3/4602 , H05K2201/045 , H05K2201/10189 , H05K2201/10318 , H05K2201/10424 , H05K2201/10674 , H05K2203/1572 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , H01L2224/05599
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公开(公告)号：JP4655891B2
公开(公告)日：2011-03-23
申请号：JP2005319367
申请日：2005-11-02
申请人： ソニー株式会社
IPC分类号： H01L21/822 , H01L27/04 , H04B1/40
CPC分类号： H05K1/141 , H01L25/0652 , H01L25/18 , H01L2224/16225 , H01L2924/01019 , H01L2924/01037 , H01L2924/19107 , H05K1/0243 , H05K1/144 , H05K3/284 , H05K2201/045 , H05K2201/10098 , H05K2201/10515 , H05K2201/10674
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公开(公告)号：JP4524454B2
公开(公告)日：2010-08-18
申请号：JP2004336113
申请日：2004-11-19
申请人： ルネサスエレクトロニクス株式会社
CPC分类号： H01L25/162 , H01L23/3121 , H01L23/4824 , H01L23/5227 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/83 , H01L25/50 , H01L27/0617 , H01L27/0629 , H01L2224/0401 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/3463 , H05K3/3494 , H05K2201/045 , H05K2203/081 , H05K2203/1476 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/43 , H01L2924/01006
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公开(公告)号：JP3917946B2
公开(公告)日：2007-05-23
申请号：JP2003065392
申请日：2003-03-11
申请人： 富士通株式会社
IPC分类号： H01L25/10 , H01L25/18 , H01L23/31 , H01L25/065 , H01L25/11 , H05K1/02 , H05K1/14 , H05K1/16 , H05K3/34
CPC分类号： H05K1/141 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06558 , H01L2225/06568 , H01L2225/06572 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/023 , H05K1/144 , H05K1/145 , H05K1/16 , H05K3/3436 , H05K2201/045 , H05K2201/049 , H05K2201/10515 , H05K2201/10734 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
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公开(公告)号：JP3558063B2
公开(公告)日：2004-08-25
申请号：JP2001376583
申请日：2001-12-11
申请人： 株式会社日立製作所
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K35/22 , B23K35/24 , B23K35/26 , B23K35/28 , B23K35/30 , B23K101/40 , C22C5/02 , C22C5/06 , C22C9/02 , C22C13/00 , C22C28/00 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/31 , H01L23/36 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/492 , H01L23/495 , H01L23/50 , H05K1/14 , H05K3/34
CPC分类号： H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： PROBLEM TO BE SOLVED: To provide a soldering material realizing soldering joint for an electronic equipment by the new solder joint, in particular solder joint on the high temperature side in temperature hierarchical joint. SOLUTION: After the solder joint part of a semiconductor device and a board are soldered, a compound 3 containing Sn, etc., is formed around a ball 1 of metals such as Cu, Al, Au and Ag or a metal alloy, the metal ball 1 is connected by the compound 3. The brazing filler metal is provided by the paste containing a mixture of the ball 1 of the metal such as Cu, Al, Au, and Ag or the metal alloy and a metal ball 2 of Sn or In.
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