公开(公告)号：US09332657B2

公开(公告)日：2016-05-03

申请号：US13629961

申请日：2012-09-28

申请人： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Tomoya Terakura

发明人： Toshiki Furutani ,  Yukinobu Mikado ,  Mitsuhiro Tomikawa ,  Tomoya Terakura

IPC分类号： H05K1/16 ,  H05K1/18 ,  H05K3/44 ,  H05K3/46

CPC分类号： H05K3/445 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10015 ,  Y10T29/4913

摘要： A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.

摘要翻译： 一种多层印刷布线板的制造方法，其特征在于，具备金属部件和连接金属部件的连接部的金属层，分别形成具有电子部件的层叠多层结构体和金属部件部，在连接部中形成切断后的贯通孔 分别切割金属层的连接部分，并在叠层多层结构上形成层间绝缘层，使层压多层结构夹在层间绝缘层之间。 层间绝缘层的形成包括用层叠的多层结构中的一个或多个层间绝缘层衍生的树脂填充切割的通孔。

公开(公告)号：US20130221505A1

公开(公告)日：2013-08-29

申请号：US13598751

申请日：2012-08-30

申请人： Toshiki FURUTANI ,  Takeshi Furusawa

发明人： Toshiki FURUTANI ,  Takeshi Furusawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/3511

摘要： A printed wiring board includes a substrate, a first buildup formed on a first surface of the substrate and including the outermost conductive layer, and a second buildup layer formed on a second surface of the substrate and including the outermost conductive layer. The outermost layer of the first buildup has pads positioned to connect a semiconductor component, the first buildup has a component mounting region directly under the component such that the outermost layer of the first buildup has a portion in the region, the outermost layer of the second buildup has a portion directly under the region, and the portions satisfy the ratio in the range of from 1.1 to 1.35, where the ratio is obtained by dividing a planar area of the portion of the second buildup by a planar area of the portion of the first buildup.

摘要翻译： 印刷布线板包括基板，形成在基板的第一表面上并且包括最外面的导电层的第一累积物和形成在基板的第二表面上并且包括最外面导电层的第二累积层。 第一堆积的最外层具有定位成连接半导体部件的焊盘，第一堆积具有直接在部件下方的部件安装区域，使得第一堆积物的最外层具有该区域中的一部分，第二部分的最外层 积聚部分具有直接在该区域下方的部分，并且这些部分满足在1.1至1.35范围内的比率，其中通过将第二聚集部分的平面面积除以该部分的平面面积获得的比例 第一次积累

公开(公告)号：US08466372B2

公开(公告)日：2013-06-18

申请号：US12555438

申请日：2009-09-08

申请人： Shunsuke Sakai ,  Kenji Sato ,  Toshiki Furutani

发明人： Shunsuke Sakai ,  Kenji Sato ,  Toshiki Furutani

IPC分类号： H05K1/16

CPC分类号： H05K1/0298 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/049 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.

摘要翻译： 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 第二导电图案邻近穿透孔的周边形成并且成形为使得用于将电子部件定位在穿透孔中的片材相对于芯基板的第一表面在穿孔上水平地​​层叠。

公开(公告)号：US20120247818A1

公开(公告)日：2012-10-04

申请号：US13425585

申请日：2012-03-21

申请人： Takema Adachi ,  Toshiki Furutani ,  Liyi Chen

发明人： Takema Adachi ,  Toshiki Furutani ,  Liyi Chen

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K3/445 ,  H05K3/3478 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2203/041

摘要： A printed wiring board includes a core substrate, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, and a through-hole conductor connecting the first and second conductive layers. The substrate has an insulation structure and a metal layer, the metal layer has opening through which the conductor passes and has side wall recessed into the metal layer and forming the opening, the structure has first resin layer on one side of the metal layer, second resin layer on the opposite side and filler filling the opening, the conductor has first portion in the first layer and second portion in the second layer, the first and second portions are connected in the filler, the first portion is tapered from the first toward second conductive layers, and the second portion is tapered from the second toward first conductive layers.

摘要翻译： 印刷布线板包括芯基板，在基板的第一表面上的第一导电层，在基板的第二表面上的第二导电层，以及连接第一和第二导电层的通孔导体。 基板具有绝缘结构和金属层，金属层具有开口，导体通过该开口，并且具有凹入金属层的侧壁并形成开口，该结构在金属层的一侧具有第一树脂层，第二树脂层 树脂层在相对侧，填料填充开口，导体具有第一层中的第一部分和第二层中的第二部分，第一和第二部分连接在填料中，第一部分从第一至第二部分逐渐变细 导电层，第二部分从第二导电层逐渐变细。

公开(公告)号：US08225503B2

公开(公告)日：2012-07-24

申请号：US12163252

申请日：2008-06-27

申请人： Takashi Kariya ,  Toshiki Furutani

发明人： Takashi Kariya ,  Toshiki Furutani

IPC分类号： H05K3/10

CPC分类号： H05K3/428 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/26175 ,  H01L2224/73204 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01093 ,  H01L2924/14 ,  H05K1/187 ,  H05K3/205 ,  H05K3/243 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/0361 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern.

摘要翻译： 一种用于制造具有内置电子元件的板的方法，包括提供包括支撑基底和金属箔的支撑基板，在支撑基板的金属箔上形成由金属材料制成的保护膜，形成导电图案 通过添加方法在保护膜上由金属材料制成，将电子元件放置在具有导电图案的支撑基板上，使得形成电路的电子元件的表面面向导电图案，用电子元件覆盖电子元件 绝缘树脂，使用第一蚀刻溶液蚀刻掉金属箔，使得保护膜不被第一蚀刻溶液溶解，或者保护膜具有比金属箔的蚀刻速度慢的蚀刻速度，并且电连接 电子元件的端子和导电图案的一部分。

公开(公告)号：US20120175754A1

公开(公告)日：2012-07-12

申请号：US13246933

申请日：2011-09-28

申请人： Toshiki FURUTANI ,  Daiki KOMATSU ,  Nobuya TAKAHASHI ,  Masatoshi KUNIEDA ,  Naomi FUJITA ,  Koichi TSUNODA ,  Minetaka OYAMA ,  Toshimasa YANO

发明人： Toshiki FURUTANI ,  Daiki KOMATSU ,  Nobuya TAKAHASHI ,  Masatoshi KUNIEDA ,  Naomi FUJITA ,  Koichi TSUNODA ,  Minetaka OYAMA ,  Toshimasa YANO

IPC分类号： H01L25/07 ,  H01L23/495

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/10674

摘要： A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component.

摘要翻译： 一种布线板，包括由绝缘材料制成并具有穿透部分的芯基板，形成在芯基板的表面上的第一层间绝缘层，形成在第一层间绝缘层的表面上的第一导电电路， 形成在第一层间绝缘层中的导体和容纳在芯基板的穿透部分中并包括半导体元件的电子部件，安装在半导体元件上的凸块体，连接到凸块体的导电电路，层间树脂绝缘体 形成在导电电路上的层，以及形成在层间树脂绝缘层中的通孔导体。 第一通孔导体具有与电子部件中的通路导体的锥形方向相反的锥形方向。

公开(公告)号：US20110265323A1

公开(公告)日：2011-11-03

申请号：US13183742

申请日：2011-07-15

申请人： Hajime SAKAMOTO ,  Toshiki Furutani ,  Hiroshi Segawa

发明人： Hajime SAKAMOTO ,  Toshiki Furutani ,  Hiroshi Segawa

IPC分类号： H05K3/10

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring.

摘要翻译： 一种制造插入件的方法，包括在支撑基板上形成无机绝缘层，在无机绝缘层的表面中或表面上形成第一布线，在无机绝缘层和第一布线上形成有机绝缘层，形成第二布线 在有机绝缘层上布线，以及形成连接第二布线和第一布线的导体部分。

公开(公告)号：US07994432B2

公开(公告)日：2011-08-09

申请号：US12488207

申请日：2009-06-19

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： H05K1/16

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers.

摘要翻译： 一种电路布线板，包括布线基板和容纳在所述布线基板中的耐热基板，其热膨胀系数在3ppm至10ppm之间的范围内，并且包括芯基板和形成在所述芯上的积层布线层 衬底，包括导电层的积层布线层，层间树脂绝缘层和通过层间树脂绝缘层之一连接导电层的通孔导体。

公开(公告)号：US20090175023A1

公开(公告)日：2009-07-09

申请号：US12345295

申请日：2008-12-29

申请人： Hajime Sakamoto ,  Toshiki Furutani ,  Hiroshi Segawa

发明人： Hajime Sakamoto ,  Toshiki Furutani ,  Hiroshi Segawa

IPC分类号： H05K7/02 ,  C23F1/00

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.

摘要翻译： 中间层包括无机绝缘层，形成在无机绝缘层的表面中或其表面上的第一布线，形成在无机绝缘层上和第一布线上的有机绝缘层，形成在有机绝缘层上的第二布线，以及 连接第一布线和第二布线的导体部分。

公开(公告)号：US20090053910A1

公开(公告)日：2009-02-26

申请号：US12254592

申请日：2008-10-20

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： H01R12/02

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。