公开(公告)号：US06496255B2

公开(公告)日：2002-12-17

申请号：US09923143

申请日：2001-08-06

申请人： Kazumi Sugai ,  Belgacem Haba ,  Yukio Morishige

发明人： Kazumi Sugai ,  Belgacem Haba ,  Yukio Morishige

IPC分类号： G01N2100

CPC分类号： G01N21/55

摘要： A sample is rotated about an axis perpendicular to a surface of the sample in predetermined angular steps. The surface of the sample is irradiated with linearly polarized light, and a reflected intensity of light reflected from the surface of the sample is detected in each angular step. Based on a rotational angle dependency of the reflected intensity, the crystal face orientation of the sample is determined. To improve signal-to-noise ratio, the crystal lattice of the sample is excited. Further, the surface of the sample is irradiated with a plurality of linearly polarized light beams to obtain a plurality of reflected intensities.

公开(公告)号：US06449159B1

公开(公告)日：2002-09-10

申请号：US09564064

申请日：2000-05-03

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H05K720

CPC分类号： H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674

摘要： The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partially attached to the heat spreader, where at least one of the electrically conductive leads is preferably common to both of the semiconductors. The two semiconductors may be mounted or preferably directly bonded onto opposing side walls of the heat spreader. The invention also provides a method of making the abovementioned semiconductor module.

摘要翻译： 本发明提供一种半导体模块，其包括散热器，至少两个热耦合到散热器的半导体以及电连接到半导体的多个导电引线。 引线可以形成至少部分地附接到散热器的柔性电路的一部分，其中至少一个导电引线优选地是两个半导体共同的。 两个半导体可以被安装或优选地直接结合到散热器的相对的侧壁上。 本发明还提供了制造上述半导体模块的方法。

公开(公告)号：US06428328B2

公开(公告)日：2002-08-06

申请号：US09977803

申请日：2001-10-15

申请人： Belgacem Haba ,  Anthony B. Faraci

发明人： Belgacem Haba ,  Anthony B. Faraci

IPC分类号： H01R1201

CPC分类号： H05K3/326 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01R12/89 ,  H01R13/193 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49213

摘要： A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket.

摘要翻译： 用于微电子元件的连接器包括具有期望地布置成矩形网格图案的多个通孔的片状电介质层。 每个孔设置在一个主表面上，具有大致层状接触，其具有在通孔上向内延伸的至少一个突起。 电介质层的第二主表面上的接触焊盘覆盖在通孔上，以提供盲端，该盲端通过衬套穿过通孔的金属层与另一接触电连接。 所得到的连接器提供低或零插入力插座，用于安装具有凸起引线的微电子元件。 凸起引线可以被接收在相应的插座中，而不与触点或突起接合，然后通过沿横向的移动来接合触点或突起以提供到插座的电连接。

公开(公告)号：US06376904B1

公开(公告)日：2002-04-23

申请号：US09685941

申请日：2000-10-10

申请人： Belgacem Haba ,  Donald V. Perino ,  Sayeh Khalili

发明人： Belgacem Haba ,  Donald V. Perino ,  Sayeh Khalili

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.

摘要翻译： 一种半导体模块，具有具有平坦表面的第一集成电路管芯。 第一集成电路管芯具有基本上设置在平面表面上的第一导电焊盘和电连接到第一导电焊盘的再分布导电焊盘。 再分布的导电焊盘设置在平面的周边附近。 半导体模块具有与平面相邻并且与周边偏移堆叠的第二集成电路管芯，使得第二集成电路管芯上的第二导电焊盘可以电连接到再分布的导电焊盘。

公开(公告)号：US06261863B1

公开(公告)日：2001-07-17

申请号：US09471973

申请日：1999-12-23

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H05K3/4092 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.

摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。 制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。

公开(公告)号：US06190509B1

公开(公告)日：2001-02-20

申请号：US09034515

申请日：1998-03-04

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H05F300

CPC分类号： H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

摘要： A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of an anisotropic conductive material incorporating a dielectric material in a fluid condition and electrically conductive particles in the dielectric material and applying a field to the anisotropic conductive material so as to alter the configuration of the particles. The layer has a pair of oppositely directed major faces, a vertical direction between the major faces and horizontal directions parallel to the major faces. The field applied to the layer of anisotropic conductive material may include electrical or magnetic fields. In certain embodiments, at last some of the conductive particles are elongated so that when the field is applied to the layer of anisotropic conductive material, the field turns the axes of elongation of at least some of the elongated particles towards the vertical direction. In other embodiments the field moves at least some of the conductive particles in horizontal directions.

摘要翻译： 制造用于微电子封装的各向异性导电元件的方法包括提供在介质材料中结合有电介质材料的介电材料和介电材料中的导电颗粒的各向异性导电材料层，并向各向异性导电材料施加场，以便 改变粒子的配置。 该层具有一对相对定向的主面，主要面之间的垂直方向和平行于主面的水平方向。 施加到各向异性导电材料层的场可以包括电场或磁场。 在某些实施例中，最后一些导电颗粒是细长的，使得当场施加到各向异性导电材料层时，该场将至少一些细长颗粒的延伸轴线朝向垂直方向转动。 在其它实施例中，该场沿水平方向移动至少一些导电颗粒。

公开(公告)号：US5951305A

公开(公告)日：1999-09-14

申请号：US112545

申请日：1998-07-09

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01R12/70 ,  H05K3/32 ,  H01R9/09

CPC分类号： H01R12/7076 ,  H01R12/57 ,  H05K3/326 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49218

摘要： A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric element has holes of slightly larger diameter than the apertures, the holes being aligned with the apertures so that a lip region of the flexible dielectric element overlies each hole. The socket also includes contacts disposed adjacent to the holes and apertures. The joining units on the chip assembly are of larger diameter than the apertures but smaller than the holes. When the chip assembly is engaged with the socket, the dielectric element deforms. The joining units pass through the apertures and are retained in engagement with the socket, and in electrical contact with the contacts of the socket, by the dielectric element.

公开(公告)号：US20160163620A1

公开(公告)日：2016-06-09

申请号：US15047295

申请日：2016-02-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

摘要翻译： 提供了一种微电子组件，其包括基本上由半导体或无机电介质材料中的至少一种构成的第一元件，该介电材料具有面向并附着到微电子元件的主表面的表面，在该电子元件的主表面处暴露多个导电焊盘，该微电子元件具有 其中有源半导体器件。 第一开口从第一元件的暴露表面延伸到附接到微电子元件的表面，并且第二开口从第一开口延伸到第一导电焊盘中，其中第一和第二开口相交，其中内表面 第一和第二开口相对于微电子元件的主表面以不同的角度延伸。 导电元件在第一和第二开口内延伸并接触至少一个导电垫。

公开(公告)号：US09159708B2

公开(公告)日：2015-10-13

申请号：US12839038

申请日：2010-07-19

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/52 ,  H01L25/10 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6611 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83851 ,  H01L2224/45099

摘要： A microelectronic package having a substrate, a microelectronic element, e.g., a chip, and terminals can have conductive elements electrically connected with element contacts of the chip and contacts of the substrate. Conductive elements can be electrically insulated from one another for simultaneously carrying different electric potentials. An encapsulant can overlie the first surface of the substrate and at least a portion of a face of the microelectronic element remote from the substrate, and may have a major surface above the microelectronic element. A plurality of package contacts can overlie a face of the microelectronic element remote from the substrate. The package contacts, e.g., conductive masses, substantially rigid posts, can be electrically interconnected with terminals of the substrate, such as through the conductive elements. The package contacts can have top surfaces at least partially exposed at the major surface of the encapsulant.

摘要翻译： 具有衬底，微电子元件（例如芯片）和端子的微电子封装可以具有与芯片的元件触点和衬底的触点电连接的导电元件。 导电元件可以彼此电绝缘以同时承载不同的电位。 密封剂可以覆盖在衬底的第一表面上，并且微电子元件的表面的至少一部分远离衬底，并且可以在微电子元件上方具有主表面。 多个封装触点可以覆盖远离基板的微电子元件的表面。 封装接触，例如导电块，基本上刚性的柱，可以与衬底的端子，例如通过导电元件电连接。 封装接触件可以具有至少部分地暴露在密封剂的主表面处的顶表面。

公开(公告)号：US09142508B2

公开(公告)日：2015-09-22

申请号：US13170095

申请日：2011-06-27

申请人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/52 ,  H01L23/528 ,  H01L23/532 ,  H01L21/768

CPC分类号： H01L21/76831 ,  H01L21/76807 ,  H01L21/76834 ,  H01L21/76852 ,  H01L21/76885 ,  H01L21/76897 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53209 ,  H01L23/53238 ,  H01L23/53252 ,  H01L2221/1036 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods of fabricating a multi-layer semiconductor device such as a multi-layer damascene or inverted multi-layer damascene structure using only a single or reduced number of exposure steps. The method may include etching a precursor structure formed of materials with differential removal rates for a given removal condition. The method may include removing material from a multi-layer structure under different removal conditions. Further disclosed are multi-layer damascene structures having multiple cavities of different sizes. The cavities may have smooth inner wall surfaces. The layers of the structure may be in direct contact. The cavities may be filled with a conducting metal or an insulator. Multi-layer semiconductor devices using the methods and structures are further disclosed.

摘要翻译： 仅使用单个或减少数量的曝光步骤来制造多层半导体器件的方法，例如多层镶嵌或倒置的多层镶嵌结构。 该方法可以包括用于对于给定的去除条件蚀刻由具有差异去除速率的材料形成的前体结构。 该方法可以包括在不同的去除条件下从多层结构去除材料。 还公开了具有不同尺寸的多个空腔的多层镶嵌结构。 空腔可以具有平滑的内壁表面。 结构的层可以直接接触。 空腔可以用导电金属或绝缘体填充。 进一步公开了使用这些方法和结构的多层半导体器件。