公开(公告)号：US20070194443A1

公开(公告)日：2007-08-23

申请号：US11705729

申请日：2007-02-13

申请人： Marco Lederer ,  Rainer Popp

发明人： Marco Lederer ,  Rainer Popp

IPC分类号： H01L23/34

CPC分类号： H05K7/2049 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0263 ,  H01L2924/00014 ,  H01L2924/00

摘要： An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at the flat portion, disposed within a housing. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. Contact feet extend from the flat portions to conductor tracks on the substrate. A pressure plate exerts pressure on the load terminals to hold them in place and establish electrical contact between the contact feet and the conductor tracks, while also establishing thermal contact between the load terminals and the cooling component. The cooling component, the housing, and the pressure plate form a first unit, which is mechanically decoupled from a second unit comprising the substrate and the load terminals.

摘要翻译： 具有相关制造方法的装置，压力接触实施例中的功率半导体模块和冷却部件。 模块包括实施为具有扁平部分的金属模制体的负载端子和始终位于平坦部分的接触装置，该接触装置设置在壳体内。 每个平坦部分平行于衬底的表面设置并与其间隔开。 接触脚从平坦部分延伸到基板上的导体轨迹。 压力板对负载端子施加压力以将其保持在适当位置，并且在接触脚和导体轨道之间建立电接触，同时还在负载端子和冷却部件之间建立热接触。 冷却部件，壳体和压力板形成第一单元，其与包括基板和负载端子的第二单元机械地分离。

公开(公告)号：US20070187844A1

公开(公告)日：2007-08-16

申请号：US11593788

申请日：2006-11-06

申请人： Kong-Chen Chen

发明人： Kong-Chen Chen

IPC分类号： H01L23/29

CPC分类号： H05K3/303 ,  H01L21/67259 ,  H01L22/32 ,  H01L22/34 ,  H01L23/041 ,  H01L23/10 ,  H01L23/4093 ,  H01L23/481 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0268 ,  H05K1/0296 ,  H05K1/144 ,  H05K1/16 ,  H05K3/222 ,  H05K3/325 ,  H05K7/20436 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/49133 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides systems and methods for assembling an electronic assembly using an anisotropic conducting membrane (ACM) as a component interconnect and a substrate embossed with placement cavities or a positional fixture to facilitate component placement on the substrate in the electronic assembly. The fixture may comprise multiple layers of interconnects to improve routing density for the electronic assembly enclosed in a housing. An alignment chain may be used to monitor positional and contact integrity of the ACM interfaced components in a complex assembly. The systems and methods allow components to be detached for reuse. Interconnection elements or conduction pathways at the components can be used to interconnect a plurality of neighboring substrates over the ACM layers into a stacked electronic assembly.

摘要翻译： 本发明提供用于组装使用各向异性导电膜（ACM）作为部件互连的电子组件的系统和方法，以及用放置空腔或位置固定器压花的基板，以便于元件放置在电子组件中的基板上。 夹具可以包括多层互连，以改善围绕在壳体中的电子组件的布线密度。 可以使用对准链来监视复杂组件中ACM接口部件的位置和接触完整性。 系统和方法允许组件分离以重新使用。 组件之间的互连元件或传导路径可用于将ACM层上的多个相邻衬底互连成堆叠式电子组件。

公开(公告)号：US20070187817A1

公开(公告)日：2007-08-16

申请号：US11705719

申请日：2007-02-13

申请人： Rainer Popp

发明人： Rainer Popp

IPC分类号： H01L23/34

CPC分类号： H01L25/50 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power semiconductor module in a pressure contact embodiment and a method for producing such modules, for disposition on a cooling component. Load terminals of the modules are formed as metal molded bodies having at least one contact element, one flat portion, and contact feet emanating therefrom. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. The contact feet extend from the flat portion to the substrate. An elastic intermediate layer is disposed between adjacent load terminals, in the region of the respective flat portions, and the intermediate layer and load terminals form a stack.

摘要翻译： 压力接触实施例中的功率半导体模块和用于制造这种模块的方法，用于配置在冷却部件上。 模块的负载端子形成为具有至少一个接触元件，一个平坦部分和从其发出的接触脚的金属模制体。 每个平坦部分平行于衬底的表面设置并与其间隔开。 接触脚从平坦部分延伸到基底。 在相邻的负载端子之间，在相应的平坦部分的区域中设置弹性中间层，并且中间层和负载端子形成堆叠。

公开(公告)号：US20070187140A1

公开(公告)日：2007-08-16

申请号：US11566912

申请日：2006-12-05

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： H05K1/16

CPC分类号： H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

摘要翻译： 本发明是提供一种印刷电路板，其中即使在高度集成的半导体装置安装在其上时也能够降低由半导体芯片和印刷电路板的热膨胀系数之间的差异引起的故障连接或断开，并且电子 设备使用相同。 根据本发明的电子设备（4）包括具有元件安装销（18）的印刷电路板（1）和具有电极焊盘（3）的表面安装型半导体设备（2），其中元件安装 销（18）具有弹性并且被推靠在电极焊盘（3）上以保持电连接。

公开(公告)号：US07256490B2

公开(公告)日：2007-08-14

申请号：US11591744

申请日：2006-11-02

申请人： Warren M. Farnworth ,  Alan G. Wood

发明人： Warren M. Farnworth ,  Alan G. Wood

IPC分类号： H01L23/04 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3128 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2867 ,  H01L21/4846 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0218 ,  H05K1/113 ,  H05K3/027 ,  H05K2201/09363 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A test carrier for a semiconductor component includes a base for retaining the component, and an interconnect on the base having contacts configured to electrically engage component contacts on the component. The base includes conductors in electrical communication with the contacts on the interconnect, which are defined by grooves in a conductive layer. In addition, the conductors include first portions of the conductive layer configured for electrical transmission, which are separated from one another by second portions of the conductive layer configured for no electrical transmission. The test carrier is configured for mounting to a burn in board in electrical communication with a test circuitry configured to apply test signals through the contacts on the interconnect to the component.

公开(公告)号：US20070176619A1

公开(公告)日：2007-08-02

申请号：US11697643

申请日：2007-04-06

申请人： Igor Khandros ,  Gaetan Mathieu

发明人： Igor Khandros ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

摘要： An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

摘要翻译： 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US07244125B2

公开(公告)日：2007-07-17

申请号：US10731669

申请日：2003-12-08

申请人： Dirk D. Brown ,  John D. Williams ,  Eric M. Radza

发明人： Dirk D. Brown ,  John D. Williams ,  Eric M. Radza

IPC分类号： H01R12/00

CPC分类号： H05K7/1069 ,  G01R1/0416 ,  G01R3/00 ,  H01L23/32 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/714 ,  H01R13/03 ,  H01R13/2407 ,  H01R13/2442 ,  H01R43/007 ,  H01R43/205 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

摘要： A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

摘要翻译： 用于电连接到形成在半导体器件上的焊盘的连接器包括衬底和形成在衬底上的导电材料的接触元件阵列。 每个接触元件包括附接到基底的顶表面的基部和从基部延伸并具有突出在基底上方的远端的弯曲弹簧部分。 弯曲的弹簧部分被形成为远离接触平面弯曲并且具有设置成在接合半导体器件的相应焊盘时提供受控的擦拭动作的曲率。

公开(公告)号：US20070075444A1

公开(公告)日：2007-04-05

申请号：US11515207

申请日：2006-08-31

申请人： Xuezhe Zheng ,  Ashok Krishnamoorthy ,  John Cunningham

发明人： Xuezhe Zheng ,  Ashok Krishnamoorthy ,  John Cunningham

IPC分类号： H01L23/544

CPC分类号： G02B6/12007 ,  G02B6/29341 ,  G02B6/43 ,  H01L23/48 ,  H01L24/10 ,  H01L24/13 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/2919 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2225/06527 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

摘要翻译： 一种组件，包括第一和第二电子设备以及将第一电子设备上的光波导光耦合到第二电子设备上的光波导的光耦合设备。 以这种方式，设备之间的光学邻近通信是可能的。 电子设备可以是集成电路芯片。 第一光波导相对于光耦合装置定位，以将光信号引导到光耦合装置。 此外，第二光波导相对于光耦合装置定位，以接收从光耦合装置指向第二光波导的光信号。 因此，光耦合装置将第一光波导光学耦合到第二光波导。

公开(公告)号：US20070066046A1

公开(公告)日：2007-03-22

申请号：US11602034

申请日：2006-11-20

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/44 ,  H01L21/00

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

摘要翻译： 电连接具有带有多个触点的第一表面的微电子部件的方法。 该方法包括以下步骤：通过将具有支撑结构的连接部件和由支撑结构的第一表面基本上彼此平行延伸的多个细长柱与微电子部件并置而形成子组件，使得支撑结构覆盖在表面 所述部件的柱子远离所述部件并且将所述柱电连接到所述微电子部件的触头。

公开(公告)号：US07145250B2

公开(公告)日：2006-12-05

申请号：US11113063

申请日：2005-04-25

申请人： Shigeyuki Maruyama ,  Toru Nishino ,  Kazuhiro Tashiro

发明人： Shigeyuki Maruyama ,  Toru Nishino ,  Kazuhiro Tashiro

IPC分类号： H01L29/40 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49838 ,  G01R31/2886 ,  H01L21/6835 ,  H01L22/32 ,  H01L24/48 ,  H01L24/72 ,  H01L24/81 ,  H01L2221/68354 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15173 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An LSI package comprises an LSI element and a wiring board. The plurality of pin terminals of the LSI element each includes a first conductive layer and a second conductive layer superposed on the first conductive layer. The plurality of pin terminals of the wiring board each includes a third conductive layer joined to the second conductive layer, and the wiring board further comprises outer joining terminals. The first, second, and third conductive layers are made of materials causing the metallic bond between the second conductive layer and third conductive layer to be stronger than the metallic bond between the first conductive layer and second conductive layer. The LSI element is tested using the outer joining terminals of the wiring board. The second conductive layer and third conductive layer are joined to attain a metallic bond through aggregation derived from pressure, and are reliably brought into electrical contact with each other for a test. After the test is completed, the terminals of the LSI element are peeled off from the terminals of the wiring board. At this time, the second conductive layer is transferred to the third conductive layer, and the first conductive layer is left intact in each of the terminals of the LSI element. The LSI element is then mounted on another wiring board.

摘要翻译： LSI封装包括LSI元件和布线板。 LSI元件的多个引脚端子各自包括叠置在第一导电层上的第一导电层和第二导电层。 布线基板的多个引脚端子各自包括接合到第二导电层的第三导电层，并且布线板还包括外连接端子。 第一，第二和第三导电层由使得第二导电层和第三导电层之间的金属键合比第一导电层和第二导电层之间的金属键更强的材料制成。 使用布线板的外部接合端子来测试LSI元件。 第二导电层和第三导电层被接合以通过来自压力的聚集获得金属键，并且可靠地彼此进行电接触以进行测试。 测试完成后，LSI元件的端子从布线板的端子剥离。 此时，第二导电层被转移到第三导电层，并且第一导电层在LSI元件的每个端子中保持完整。 然后将LSI元件安装在另一个布线板上。