公开(公告)号：US20170062374A1

公开(公告)日：2017-03-02

申请号：US15015758

申请日：2016-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunmo CHU ,  Wonsuk CHANG ,  Chanmoon CHUNG

IPC: H01L23/00

CPC classification number: H01L24/33 ,  H01B1/22 ,  H01L23/53276 ,  H01L23/5328 ,  H01L24/09 ,  H01L24/29 ,  H01L2224/29028 ,  H01L2224/29105 ,  H01L2224/29198 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/2949 ,  H01L2224/2957 ,  H01L2224/29691 ,  H01L2224/32227 ,  H01L2924/01006 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/1426 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10674 ,  H05K2203/0425

Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.

Abstract translation: 提供各向异性导电材料，包括各向异性导电材料的电子器件和/或制造电子器件的方法。 各向异性导电材料可以包括基质材料层中的多个颗粒。 至少一些颗粒可以包括芯部分和覆盖芯部分的壳部分。 核心部分可以包括在大于15℃且小于或等于约110℃或更低的温度下处于液态的导电材料。 例如，芯部可以包括液态金属，低熔点焊料和纳米填料中的至少一种。 外壳部分可以包括绝缘材料。 通过使用各向异性导电材料形成的接合部可以包括从颗粒流出的芯部，还可以包含金属间化合物。

公开(公告)号：US09332642B2

公开(公告)日：2016-05-03

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US09232648B2

公开(公告)日：2016-01-05

申请号：US14347075

申请日：2012-09-12

Applicant: Tetsuro Miyahira ,  Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi

Inventor： Tetsuro Miyahira ,  Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi

IPC: B32B3/02 ,  H05K1/03 ,  C01G39/00 ,  C01G39/02 ,  C08J5/24 ,  C08K9/02 ,  C08L63/00 ,  C09C1/00 ,  C08L71/12 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B27/20 ,  C01G39/00 ,  C01G39/02 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/84 ,  C08J5/24 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2255 ,  C08L63/00 ,  C08L71/12 ,  C09C1/0003 ,  H05K2201/0224 ,  Y10T428/24893 ,  Y10T428/256

Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

Abstract translation: 本发明提供了一种新型的表面处理的钼化合物粉末，并且提供了在平面方向上具有低热膨胀系数的预浸料，层压体，金属箔层压体，印刷线路板等，并且具有优异的可钻性，热 阻力和阻燃性。 本发明的经表面处理的钼化合物粉末的表面的至少一部分涂覆有无机氧化物，并将其用作填料。

公开(公告)号：US20150188024A1

公开(公告)日：2015-07-02

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki ISHIGAMI ,  Hidefumi NAKAMURA ,  Yukihiko SHIOHARA ,  Taku KAWASAKI ,  Fumiaki AKAHANE

IPC: H01L41/047 ,  H01L41/053 ,  B22F3/105 ,  H01L41/29 ,  B22F5/12 ,  H05K1/03 ,  H01L41/333

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US20150070805A1

公开(公告)日：2015-03-12

申请号：US14546212

申请日：2014-11-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Yamada

IPC: H02H9/04

CPC classification number: H02H9/044 ,  H01T4/12 ,  H01T4/16 ,  H05K1/0259 ,  H05K1/026 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/09063

Abstract: An ESD protection device 1 includes a plurality of input electrodes 21a through 21d and a plurality of output electrodes 21e through 21h. The plurality of input electrodes 21a through 21d are disposed along a first direction. The plurality of output electrodes 21e through 21h are disposed along the first direction. The plurality of output electrodes 21e through 21h oppose the input electrodes 21a through 21d in a second direction which is tilted with respect to the first direction. End portions of the input electrodes 21a through 21d on a side closer to the output electrodes 21e through 21h in the second direction and end portions of the output electrodes 21e through 21h on a side closer to the input electrodes 21a through 21d in the second direction form main discharge units 31a through 31d.

Abstract translation: ESD保护器件1包括多个输入电极21a至21d和多个输出电极21e至21h。 多个输入电极21a至21d沿第一方向设置。 多个输出电极21e至21h沿第一方向设置。 多个输出电极21e至21h在相对于第一方向倾斜的第二方向上与输入电极21a至21d相对。 输入电极21a至21d在第二方向上靠近输出电极21e至21h的一侧上的输入电极21a至21d的端部以及在第二方向上更靠近输入电极21a至21d的一侧的输出电极21e至21h的端部 主放电单元31a至31d。

公开(公告)号：US20140077137A1

公开(公告)日：2014-03-20

申请号：US14088737

申请日：2013-11-25

Applicant: Empire Technology Development LLC

Inventor： Kazufumi OGAWA ,  Kazuhiro Soejima

IPC: H01B1/12

CPC classification number: H01B1/12 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.

Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。

公开(公告)号：US08641929B2

公开(公告)日：2014-02-04

申请号：US13702718

申请日：2011-06-10

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: H01B1/02 ,  B41J2/16 ,  C04B28/36

CPC classification number: C09J1/00 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2303/10 ,  B22F2998/00 ,  B32B37/12 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K3/32 ,  H05K3/3463 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1131 ,  B22F2303/01 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929

Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.

Abstract translation: 提供一种能够在氮气中形成接合体的接合材料，并且在加压或高温条件下，在不进行热处理的情况下，可以显示接合强度以抵抗实际应用，同时减少样品之间的接合波动。 接合材料包括：平均一次粒径为1〜200nm的银纳米粒子，并涂布有碳原子数为8以下的有机物质; 沸点为230℃以上的分散介质; 以及包含具有至少两个羧基的有机物质的助熔剂成分。 特别地，优选组合使用银纳米粒子和亚微米银粒子。

公开(公告)号：US08623500B2

公开(公告)日：2014-01-07

申请号：US12665027

申请日：2007-08-16

Applicant: Kazufumi Ogawa ,  Kazuhiro Soejima

Inventor： Kazufumi Ogawa ,  Kazuhiro Soejima

IPC: B32B5/16

CPC classification number: H01B1/12 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.

Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。

公开(公告)号：US20120217450A1

公开(公告)日：2012-08-30

申请号：US13468896

申请日：2012-05-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/00 ,  H01B1/08 ,  H01B1/04 ,  B82Y30/00

CPC classification number: H01B3/006 ,  B82Y10/00 ,  H01B1/24 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0738 ,  Y10T428/2991

Abstract: A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.

Abstract translation: 一种电压可切换电介质材料，其包含通过机械或机械化学键合方法单独形成的多组分颗粒的浓度，所述机械或机械化学键合方法将半导体或导电型主体颗粒与多个绝缘，导电或半导电的客体颗粒结合。

公开(公告)号：US20120216713A1

公开(公告)日：2012-08-30

申请号：US13391175

申请日：2010-07-29

Applicant: Tarik Cheema ,  Georg Garnweitner ,  Günter Schmid ,  Dan Taroata

Inventor： Tarik Cheema ,  Georg Garnweitner ,  Günter Schmid ,  Dan Taroata

IPC: C09D1/00 ,  B82Y30/00

CPC classification number: H05K1/162 ,  B05D1/185 ,  H01B3/002 ,  H01B3/10 ,  H01G4/1227 ,  H01G11/48 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y02E60/13

Abstract: The invention relates to a dielectric protective layer in which nanoparticles are integrated to increase the dielectric constants. Said nanoparticles are surrounded by a protective shell to prevent agglomeration in order to maintain the small particle size for the depositioning of extra-thin film.

Abstract translation: 本发明涉及一种介电保护层，其中纳米颗粒被整合以增加介电常数。 所述纳米颗粒被保护壳包围以防止附聚，以保持用于沉积超薄膜的小粒径。