公开(公告)号：US07701071B2

公开(公告)日：2010-04-20

申请号：US11090104

申请日：2005-03-24

Applicant: Masako Watanabe ,  Masazumi Amagai

Inventor： Masako Watanabe ,  Masazumi Amagai

IPC: H01L23/48

CPC classification number: H05K3/3478 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

Abstract translation: 一种半导体器件（1700），其包括具有轮廓（1711）的工件（1201）和多个接触焊盘（1205）以及具有多个端子焊盘（1702）的外部部分（1701）。 该部件与工件间隔开，端子焊盘分别对准工件接触焊盘。 回流元件（1203）将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料（1204）填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，材料具有基本上与工件轮廓相一致的轮廓（1711），并且基本上没有空隙填充空间（1707）。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。

公开(公告)号：US20100071205A1

公开(公告)日：2010-03-25

申请号：US12284440

申请日：2008-09-22

Applicant: David Graumann ,  David Bruneau

Inventor： David Graumann ,  David Bruneau

IPC: H05K13/00 ,  D03D1/00

CPC classification number: D03J1/00 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/02 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2401/16 ,  D10B2503/04 ,  D10B2505/08 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/5313

Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

Abstract translation: 本文公开的实施例提供了用于将扫描控制和其他电子芯片附接到纺织品的方法，例如在织机上作为实时制造过程的一部分。

公开(公告)号：US07661964B2

公开(公告)日：2010-02-16

申请号：US11882028

申请日：2007-07-30

Applicant: Kazuaki Suzuki ,  Masaki Taniguchi

Inventor： Kazuaki Suzuki ,  Masaki Taniguchi

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/186 ,  H05K3/325 ,  H05K3/4611 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611

Abstract: A connecting part for ensuring a secure connection includes first connecting terminals that are arranged on one face of a supporting member and second connecting terminals that are arranged on the back face of the supporting member. The supporting member may have an elastic body. The connecting terminals are interconnected by conductive films which are formed on the face of the supporting member. Connecting parts are arranged between circuit boards on which electronic parts are mounted, and the circuit boards are mutually fixed in the state in which the connecting parts are compressed. The first and second connecting terminals are pushed against lands on the circuit boards by restoring force of the connecting parts, and then the circuit boards are electrically interconnected.

Abstract translation: 用于确保安全连接的连接部分包括布置在支撑构件的一个面上的第一连接端子和布置在支撑构件的背面上的第二连接端子。 支撑构件可以具有弹性体。 连接端子由形成在支撑构件的表面上的导电膜互连。 连接部件布置在其上安装电子部件的电路板之间，并且电路板在连接部件被压缩的状态下相互固定。 第一和第二连接端子通过连接部件的恢复力而被推靠在电路板上的平台上，然后电路板电互连。

公开(公告)号：US20100007033A1

公开(公告)日：2010-01-14

申请号：US12497996

申请日：2009-07-06

Applicant: Takashi KITAE ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

Inventor： Takashi KITAE ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC: H01L23/48 ,  H01L21/56 ,  H05K1/14

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

Abstract: A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

Abstract translation: 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US20090271979A1

公开(公告)日：2009-11-05

申请号：US12502115

申请日：2009-07-13

Applicant: DAN L. MASSOPUST ,  CURTIS D. KELLER ,  STEVEN R. SLOTTO ,  PETER J. NYSTROM ,  JOHN R. ANDREWS ,  STEVEN V. KOROL ,  SCOTT T. TREECE ,  BRITTON T. PINSON ,  CHAD J. SLENES ,  SAMUEL SCHULTZ ,  LEE M. OIEN ,  JONATHAN R. BRICK

Inventor： DAN L. MASSOPUST ,  CURTIS D. KELLER ,  STEVEN R. SLOTTO ,  PETER J. NYSTROM ,  JOHN R. ANDREWS ,  STEVEN V. KOROL ,  SCOTT T. TREECE ,  BRITTON T. PINSON ,  CHAD J. SLENES ,  SAMUEL SCHULTZ ,  LEE M. OIEN ,  JONATHAN R. BRICK

IPC: H05K3/36

CPC classification number: B41J2/0057 ,  B41J2/1408 ,  B41J2002/14491 ,  B41J2202/18 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3484 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0191 ,  H05K2203/063 ,  Y10T29/49126

Abstract: A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.

Abstract translation: 打印系统包括将墨水输送到图像接收器的打印头和至少一个墨水储存器以将墨水输送到打印头。 驱动电路向打印头提供信号以控制墨水的传送，并且插入在打印头和墨水储存器之间的柔性电路将驱动电路连接到打印头。 柔性电路可以包括加热器以向墨水容器提供热量。 或者，柔性电路可以用在其层内具有加热器的刚性基板代替。

公开(公告)号：US20090266592A1

公开(公告)日：2009-10-29

申请号：US12427991

申请日：2009-04-22

Applicant: Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

Inventor： Masayoshi Koyama ,  Norihito Tsukahara ,  Susumu Matsuoka

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/361 ,  H01L2224/11003 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01019 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/167 ,  Y10T29/49126

Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

Abstract translation: 其中电线的端面（36a）位于从第一板（31a）的接合区域中的端部退出的位置的电路​​板，电线的端面（36b）位于从接头的端部撤出的位置 第二板（31b）的区域，填充第一板（31a）的导线的端面（36a）与第二板（31b）的导线的端面（36b）之间的间隙（W） 与导体（16A）和第一板（31a）和第二板（31b）通过树脂接合。

公开(公告)号：US20090261149A1

公开(公告)日：2009-10-22

申请号：US12374240

申请日：2007-07-18

Applicant: Kazutaka Furuta ,  Masaki Taniguchi

Inventor： Kazutaka Furuta ,  Masaki Taniguchi

IPC: B23K31/02

CPC classification number: H05K3/328 ,  B30B5/02 ,  B30B15/065 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75304 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.

Abstract translation: 提供了一种使用热压头的安装方法，其可以在短时间内以高连接可靠性安装电气部件。 该方法用于通过使用在可加热金属头主体上具有由弹性体构成的弹性压接构件的热压头将电气部件安装在布线板上。 在该方法中，在布线基板的安装区域上配置粘合剂之后，在安装区域上配置电气部件，通过使用热压头通过热压接将电气部件接合在布线基板上。 在进行热压接时，通过头主体的金属部分按压电气部件的顶部区域，并且电气部件的侧部区域附近的粘合剂被弹性部分的锥形部分挤压 粘合剂。

公开(公告)号：US20090231818A1

公开(公告)日：2009-09-17

申请号：US12471405

申请日：2009-05-24

Applicant: Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

Inventor： Liang-Ming Yu ,  Chien-Lung Tsou ,  Hsin-Li Lin ,  Yuming Liu

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and at least a capacitor. In one embodiment, the circuit board has a plurality of contacts. The capacitor is disposed on the circuit board with a gap therebetween. Besides, the capacitor has a plurality of terminals electrically connected to the contacts correspondingly. The gap is filled with a glue.

Abstract translation: 提供一种电子元件模块和使用其的电子装置。 电子元件模块包括电路板和至少一个电容器。 在一个实施例中，电路板具有多个触点。 电容器设置在电路板上，其间具有间隙。 此外，电容器具有相应地电连接到触点的多个端子。 间隙充满了胶水。

公开(公告)号：US20090230551A1

公开(公告)日：2009-09-17

申请号：US12470562

申请日：2009-05-22

Applicant: Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

Inventor： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC: H01L23/498

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

Abstract: The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved.Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

Abstract translation: 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US07576430B2

公开(公告)日：2009-08-18

申请号：US11669160

申请日：2007-01-31

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Abstract translation: 提供了包括第一基板，第二基板，非导电粘合剂层和球形间隔件的接合结构。 第一衬底具有第一接合焊盘。 第二基板设置在第一基板的一侧，并且分别包括设置在第二接合焊盘上的第二接合焊盘和顺应凸块。 第二基板上的第二接合焊盘分别通过柔性凸块电连接到第一基板上的第一接合焊盘。 非导电性粘合剂层夹在第一基板和第二基板之间。 球形间隔件分布在非导电粘合剂层中以保持第一和第二基板之间的间隙。