公开(公告)号：US09650928B2

公开(公告)日：2017-05-16

申请号：US14448951

申请日：2014-07-31

申请人： IBIDEN CO., LTD.

发明人： Toshiaki Shibata ,  Yuki Miwa

IPC分类号： B01D50/00 ,  B01D39/14 ,  B01D39/06 ,  B01D39/20 ,  F01N3/022 ,  B01D46/24 ,  C04B38/00 ,  C04B111/00 ,  F01N3/035

CPC分类号： F01N3/0222 ,  B01D46/2429 ,  B01D46/247 ,  B01D46/2474 ,  B01D2046/2433 ,  B01D2046/2437 ,  B01D2046/2481 ,  B01D2046/2496 ,  C04B38/0006 ,  C04B38/0009 ,  C04B2111/00793 ,  F01N3/035 ,  F01N2330/06 ,  F01N2330/30 ,  F01N2510/00 ,  Y02T10/20 ,  C04B35/565 ,  C04B38/0016 ,  C04B38/0054 ,  C04B38/0074

摘要： A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The porous cell walls each have a porosity of 55% or acre but not more than 70%. The porous cell walls include pores with a pore diameter of 40 μm or more. The pores have a pore volume occupying 10% or more of a total pore volume of the porous cell walls. The exhaust gas emission cells have an average cross sectional area larger than an average cross sectional area of the exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. A total volume of the exhaust gas introduction cells is larger than a total volume of the exhaust gas emission cells.

公开(公告)号：US20170130626A1

公开(公告)日：2017-05-11

申请号：US15410726

申请日：2017-01-19

申请人： IBIDEN CO., LTD.

发明人： Shigeaki GOTO ,  Masaki IMAEDA ,  Hokuto OZEKI

IPC分类号： F01N3/022 ,  F01N13/16 ,  B01D46/24

CPC分类号： B01D53/869 ,  B01D46/2455 ,  B01D46/2466 ,  B01D46/247 ,  B01D2046/2492 ,  B01D2046/2496 ,  F01N3/0222 ,  F01N13/16 ,  F01N2330/06 ,  F01N2330/34 ,  F01N2340/00 ,  Y02T10/20

摘要： A honeycomb filter includes a plurality of cells and porous cell walls. Exhaust gas is to flow through the plurality of cells. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The honeycomb filter has a round cross sectional shape. Each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells. In the cross section, the exhaust gas introduction cells and the exhaust gas emission cells each have a polygonal shape. In the cross section, a side forming a cross sectional shape of each of the first exhaust gas introduction cells faces one of the exhaust gas emission cells, a side forming a cross sectional shape of each of the second exhaust gas introduction cells faces one of the exhaust gas emission cells.

公开(公告)号：US09635765B2

公开(公告)日：2017-04-25

申请号：US14465127

申请日：2014-08-21

申请人： IBIDEN CO., LTD.

发明人： Teruyuki Ishihara ,  Michimasa Takahashi

IPC分类号： H05K3/00 ,  H05K3/34

CPC分类号： H05K3/0097 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/3494 ,  H05K2201/0909 ,  H05K2201/10424 ,  Y10T29/49126

摘要： A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

公开(公告)号：US20170064825A1

公开(公告)日：2017-03-02

申请号：US15252264

申请日：2016-08-31

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/113 ,  H01L2224/16225 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09118 ,  H05K2201/09136 ,  H05K2201/096 ,  H05K2203/025 ,  H05K2203/1189 ,  H05K2203/1476 ,  H05K2203/1536 ,  H05K2203/308

摘要： A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.

摘要翻译： 印刷电路板包括具有第一和第二表面的第一电路基板和具有第三和第四表面的第二电路基板，使得第一基板层压在第三表面上，并且第一和第三表面彼此相对。 第二基板包括导体层，包括增强材料并形成在导体层上的第一绝缘层，并且经由形成在第一绝缘层中并连接到导体层的导体安装，使得第二基板在第三绝缘层上具有安装区域 并且所述安装通孔导体具有通孔底部形成用于将电子部件安装在所述安装区域中的焊盘，并且所述第一基板包括绝缘层，所述绝缘层不包含增强材料并且具有穿过所述绝缘层的开口并暴露所述通孔底部 在安装区域中形成焊盘。

公开(公告)号：US09546820B2

公开(公告)日：2017-01-17

申请号：US14493804

申请日：2014-09-23

申请人： IBIDEN CO., LTD.

发明人： Yasutaka Ito

IPC分类号： B32B18/00 ,  F27D1/00 ,  C23C24/00 ,  C23C24/10 ,  C23C30/00 ,  C30B15/14 ,  C30B35/00 ,  C23C16/30

CPC分类号： F27D1/0033 ,  C23C16/30 ,  C23C24/00 ,  C23C24/10 ,  C23C30/00 ,  C30B15/14 ,  C30B35/00 ,  Y10T428/13 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/1352 ,  Y10T428/1355

摘要： A structure of the present invention is the structure which is formed of a base made of a metal and an inorganic material surface layer made of crystalline and amorphous inorganic materials, wherein thermal conductivity of the inorganic material surface layer is lower than the thermal conductivity of the base, infrared emissivity of the inorganic material surface layer is higher than the infrared emissivity of the base, and the base is an annular body.

摘要翻译： 本发明的结构是由金属制的基材和由结晶性和无定形无机材料制成的无机材料表面层形成的结构，其中无机材料表面层的导热率低于 基体，无机材料表面层的红外发射率高于基体的红外发射率，基体为环状体。

公开(公告)号：US09514876B2

公开(公告)日：2016-12-06

申请号：US14603822

申请日：2015-01-23

申请人： IBIDEN Co., Ltd.

发明人： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Haruhiko Morita

IPC分类号： H01F5/00 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F41/04

CPC分类号： H01F27/2804 ,  H01F27/24 ,  H01F41/041 ,  H01F2027/2809 ,  Y10T29/4902

摘要： A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.

摘要翻译： 印刷布线板包括具有穿过绝缘层的第一穿透孔的绝缘层，包括填充在穿过绝缘层的第一穿透孔中的磁性材料的磁芯结构，使得包括形成第一磁性体层的磁芯结构 在第一贯通孔中形成绝缘层，导体层形成在绝缘层上并具有使电感器图案围绕磁芯结构的圆周的电感图案。 导体层的磁芯结构和电感器图案形成电感器件。

公开(公告)号：US09497849B2

公开(公告)日：2016-11-15

申请号：US13754185

申请日：2013-01-30

申请人： IBIDEN CO., LTD.

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Furusawa

IPC分类号： H05K1/02 ,  H05K3/46 ,  H01L21/48 ,  H01L23/498

CPC分类号： H05K1/02 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09136 ,  H01L2924/00

摘要： A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

摘要翻译： 印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。 芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层 第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，第一和第二结构 第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。 ％。

公开(公告)号：US09486739B2

公开(公告)日：2016-11-08

申请号：US14278860

申请日：2014-05-15

申请人： IBIDEN CO., LTD.

发明人： Reo Uchimura ,  Hisashi Ando ,  Yasutaka Ito

IPC分类号： F01N3/28 ,  B01D53/88 ,  B32B5/26 ,  B32B27/12 ,  B32B7/12 ,  B32B15/14 ,  B32B27/32 ,  B32B27/36 ,  B32B1/08

CPC分类号： B01D53/885 ,  B32B1/08 ,  B32B5/26 ,  B32B7/12 ,  B32B15/14 ,  B32B27/12 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/54 ,  F01N3/2853 ,  F01N3/2864 ,  F01N3/2871 ,  F01N2450/28 ,  Y10T29/494 ,  Y10T29/49826

摘要： A holding seal material made of a laminated mat configured by laminating a plurality of mats containing an inorganic fiber and having a rectangular planar shape so that longitudinal-direction lengths of the respective mats sequentially increase as the mats are laminated, in which the film is attached to a principal surface of the mat configuring the laminated mat and having a longest longitudinal-direction length on an opposite side to a side on which the mat having the longest longitudinal-direction length is in contact with other mats and longitudinal-direction side surfaces of the mat having the longest longitudinal-direction length, and the film is attached to a principal surface of the mat having the longest longitudinal-direction length on the side on which the mat having the longest longitudinal-direction length is in contact with other mats in a state in which a part of the principal surface is exposed.

摘要翻译： 一种由层压垫制成的保持密封材料，所述保持密封材料通过层叠多个包含无机纤维并且具有矩形平面形状的垫而构成，使得各个垫的长度方向长度随着所述垫被层压而依次增加，其中所述膜被附接 涉及构成层压垫的垫的主表面，并且在其长度方向长度最长的垫与其它垫和纵向侧表面接触的一侧的相反侧具有最长的纵向长度 具有最长纵向长度的垫，并且该膜附着到具有最长纵向长度的垫与其它垫子接触的一侧上具有最长纵向长度的垫的主表面 主表面的一部分露出的状态。

公开(公告)号：US09480170B2

公开(公告)日：2016-10-25

申请号：US13274897

申请日：2011-10-17

申请人： Katsuhiko Tanno ,  Youichirou Kawamura

发明人： Katsuhiko Tanno ,  Youichirou Kawamura

IPC分类号： H05K1/03 ,  H05K3/34 ,  H01L21/48 ,  H01L23/00

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/094 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/043 ,  Y10T29/49121 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49167 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.

摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。

公开(公告)号：US09480156B2

公开(公告)日：2016-10-25

申请号：US13406915

申请日：2012-02-28

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/20 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。