公开(公告)号：US20080002460A1

公开(公告)日：2008-01-03

申请号：US11711882

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

IPC分类号： H01L31/0232 ,  G11C11/00 ,  H01L21/02 ,  H01L21/82 ,  H01L23/02 ,  H01L23/04

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips, each packaged chip having a protective layer, e.g., a transparent lid, metallic enclosure layer, shield layer, etc., and methods are provided for manufacturing such protective layer to be incorporated into a packaged chip. Lidded chip structures, and assemblies are also provided which include lidded chips.

摘要翻译： 提供了用于制造封装芯片的方法，每个封装芯片具有保护层，例如透明盖，金属外壳层，屏蔽层等，并且提供了用于制造要并入封装芯片的保护层的方法。 还提供了包括芯片的芯片结构和组件。

公开(公告)号：US20080001241A1

公开(公告)日：2008-01-03

申请号：US11713804

申请日：2007-03-01

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

IPC分类号： H01L31/0203 ,  H01L21/50 ,  H01L23/02

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips having protective layers, e.g., lids or other overlying layers having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures and assemblies including lidded chips are also provided.

摘要翻译： 提供了用于制造具有保护层的封装芯片的方法，例如具有透明，部分透明或不透明特性的盖或其它上覆层或这些特性的组合。 提供了制造封装芯片的方法。 还提供了带芯芯片的芯片结构和组件。

公开(公告)号：US20070042527A1

公开(公告)日：2007-02-22

申请号：US11204680

申请日：2005-08-16

申请人： David Tuckerman ,  Giles Humpston

发明人： David Tuckerman ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L23/06 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic package is provided that includes a microelectronic device and a cover. The device and the cover are typically substantially immobilized relative to each other. The cover typically has a higher coefficient of thermal expansion while the device has a higher effective stiffness. The package may be formed in wafer-level processes.

摘要翻译： 提供了一种微电子封装，其包括微电子器件和盖。 装置和盖通常基本上相对于彼此固定。 该盖通常具有较高的热膨胀系数，同时该装置具有较高的有效刚度。 封装可以在晶片级工艺中形成。

公开(公告)号：US20050189635A1

公开(公告)日：2005-09-01

申请号：US11068831

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

摘要翻译： 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器 能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。

公开(公告)号：US20050082653A1

公开(公告)日：2005-04-21

申请号：US10948976

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US5397997A

公开(公告)日：1995-03-14

申请号：US57590

申请日：1993-05-06

申请人： David Tuckerman ,  Pradip Patel

发明人： David Tuckerman ,  Pradip Patel

IPC分类号： G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R31/2863 ,  H01L2224/0401 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14

摘要： A device and method for burn-in of bare chips prior to assembly into a multichip module. Each die to be tested is positioned with its I/O pads positioned to face an interconnection burn-in test substrate which may be a silicon circuit board. Each die is temporarily electrically connected to the substrate by a deformable solder bump.

摘要翻译： 在组装到多芯片模块之前，裸芯片的老化装置和方法。 要测试的每个管芯的定位是将I / O焊盘定位成面对可能是硅电路板的互连老化测试基板。 每个管芯通过可变形的焊料凸块临时电连接到衬底。

公开(公告)号：US20070148941A1

公开(公告)日：2007-06-28

申请号：US11318822

申请日：2005-12-27

申请人： Belgacem Haba ,  David Tuckerman

发明人： Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/44

CPC分类号： H05K3/4007 ,  H01L2224/16225 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2203/0384

摘要： Methods for making a microelectronic component including a plurality of conductive posts extending and projecting away from a flexible substrate, wherein at least some of the conductive posts are electrically connected to a plurality of traces exposed on the flexible substrate.

摘要翻译： 用于制造微电子部件的方法，所述微电子部件包括从柔性基板延伸并远离的多个导电柱，其中至少一些导电柱电连接到暴露在柔性基板上的多个迹线。

公开(公告)号：US20070096311A1

公开(公告)日：2007-05-03

申请号：US11641152

申请日：2006-12-19

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。

公开(公告)号：US20060033189A1

公开(公告)日：2006-02-16

申请号：US11201726

申请日：2005-08-11

申请人： Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David Tuckerman

发明人： Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David Tuckerman

IPC分类号： H01L23/02

CPC分类号： B81B7/007 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1092

摘要： As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.

摘要翻译： 如本文所公开的，提供了用于形成加盖芯片的结构和方法。 通过所公开的方法提供，在与芯片的布线绝缘的芯片上形成金属基底图案，并且形成包括金属的盖。 盖子连接到芯片上的金属基底图案以形成封盖的芯片。 在一个实施例中，芯片的前表面被暴露，其从芯片的触点延伸到芯片的边缘。 在另一个实施例中，导电连接形成于接触件，导电连接件从接触件延伸到芯片前表面上的暴露平面处的端子。

公开(公告)号：US20060027899A1

公开(公告)日：2006-02-09

申请号：US11166861

申请日：2005-06-24

申请人： Giles Humpston ,  Masud Beroz ,  David Tuckerman

发明人： Giles Humpston ,  Masud Beroz ,  David Tuckerman

IPC分类号： H01L23/495

CPC分类号： H01L21/563 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，以及与微电子元件的第一面间隔开并覆盖微电子元件的第一面的柔性基板，柔性基板具有背离微电子元件的第一面的导电焊盘。 该封装包括附接到柔性基板的导电焊盘并远离微电子元件的第一面突出的多个球体，每个球体具有远离导电焊盘的接触表面，球体的接触表面包括接触金属 没有焊料。 所述包装还包括多个支撑元件，其设置在所述微电子元件和所述基板之间，用于将所述柔性基板支撑在所述微电子元件上方，所述球体与所述支撑元件相抵消。