公开(公告)号：US20140140030A1

公开(公告)日：2014-05-22

申请号：US14163031

申请日：2014-01-24

Applicant: FUJITSU LIMITED

Inventor： Seiki Sakuyama ,  Taiji Sakai

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H01B1/026 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/462 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2224/0401

Abstract: A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

Abstract translation: 导电材料包括主要成分是第一金属的第一金属部分; 第二金属部分形成在第一金属部分上，其主要成分是第二金属，第二金属的熔点低于第一金属的熔点，第二金属可以与第一金属形成金属化合物; 和主要成分为第三金属的第三金属部分，该第三金属可以与第二金属发生共晶反应。

公开(公告)号：US08643185B2

公开(公告)日：2014-02-04

申请号：US12246811

申请日：2008-10-07

Applicant: Ryoichi Kajiwara ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

Inventor： Ryoichi Kajiwara ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

IPC: H01L23/488 ,  H01L21/60 ,  H01B1/22

CPC classification number: H01L23/49562 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Abstract translation: 芯片接合部分由具有约15μm至200μm的最大粒径和Ag的粘合剂层的良好导电的Cu金属粉末金属地结合，并且微孔均匀地分散在接合层中。 利用这种结构，可以在不使用铅的情况下确保约260℃的回流电阻和热循环试验下的可靠性。

公开(公告)号：US20130087605A1

公开(公告)日：2013-04-11

申请号：US13596511

申请日：2012-08-28

Applicant: Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

Inventor： Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

IPC: B23K35/24 ,  B23K31/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3613 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01B1/22 ,  H01L24/24 ,  H01L24/82 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K3/3463 ,  H05K2201/0272 ,  H01L2924/00

Abstract: A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Abstract translation: 一种导电接合材料，包括：第一金属颗粒; 平均粒径大于第一金属颗粒的平均粒径的第二金属颗粒; 和平均粒径大于第一金属粒子的平均粒径的第三金属粒子，比第一金属粒子的相对密度大的相对密度，高于第二金属粒子的熔点的熔点 。

公开(公告)号：US08314339B2

公开(公告)日：2012-11-20

申请号：US12495860

申请日：2009-07-01

Applicant: Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

Inventor： Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

IPC: H05K1/03 ,  H05K1/09

CPC classification number: H05K3/249 ,  H05K1/118 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2203/1105

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract translation: 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

公开(公告)号：US08182923B2

公开(公告)日：2012-05-22

申请号：US12427275

申请日：2009-04-21

Applicant: Naomichi Ohashi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Takayuki Higuchi

Inventor： Naomichi Ohashi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Takayuki Higuchi

IPC: H01B1/22 ,  B32B15/08

CPC classification number: H01B1/22 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/0272 ,  Y10T428/31681 ,  H01L2224/05599

Abstract: A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

Abstract translation: 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。

公开(公告)号：US08105687B2

公开(公告)日：2012-01-31

申请号：US12959752

申请日：2010-12-03

Applicant: Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

IPC: B32B7/12 ,  H01L23/29

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0425 ,  Y02P70/611 ,  Y10T428/2857 ,  Y10T428/31678

Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.

公开(公告)号：US07968015B2

公开(公告)日：2011-06-28

申请号：US12832040

申请日：2010-07-07

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06 ,  H01B1/04 ,  H02H9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a light emitting diode device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio.

Abstract translation: 一个或多个实施例提供一种利用具有相对较高纵横比的半导体或导电材料的可开关电介质材料的发光二极管器件。

公开(公告)号：US07935430B2

公开(公告)日：2011-05-03

申请号：US11553387

申请日：2006-10-26

Applicant: Hiroki Suzuki ,  Masato Uehara

Inventor： Hiroki Suzuki ,  Masato Uehara

IPC: B32B15/08 ,  B32B15/16 ,  B23K1/00 ,  B23K1/19 ,  B22F7/02 ,  H01L23/14

CPC classification number: H05K1/111 ,  H01L24/01 ,  H05K1/095 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/0373 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12042 ,  Y10T428/12049 ,  Y10T428/12479 ,  Y10T428/12528 ,  Y10T428/12569

Abstract: A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.

Abstract translation: 提供了一种接合结构及其制造方法。 基板和部件的接合结构包括在基板上由金属粉末和树脂部件形成的电极。 将组分与电极结合的低熔点焊料。 金属粉末至少含有球形金属粉末和片状金属粉末。 低熔点焊料从电极表面渗入电极。

公开(公告)号：US07886432B2

公开(公告)日：2011-02-15

申请号：US12159832

申请日：2007-09-13

Applicant: Tadahiko Sakai ,  Hideki Eifuku

Inventor： Tadahiko Sakai ,  Hideki Eifuku

IPC: H05K3/34

CPC classification number: H05K3/323 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0272 ,  H05K2203/0425 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for connecting a first terminal array 6 provided in a connection portion 5 of a first electric component and a second terminal array 8 provided in a connection portion 7 of a second electric component to each other in such a manner that electric continuity is established between them has two steps, that is, a step of tentatively fixing the two connection portions 5 and 7 with each other whose terminal arrays 6 and 8 are positioned with respect to each other by soldering them with solder particles 3 using a paste-like anisotropic conductive adhesive 1 in which the solder particles 3 and conductive particles 4 are dispersed in a thermosetting resin 2, and a step of finally fixing the two connection portions 5 and 7 with each other with the thermosetting resin 2 that has been set thermally. This prevents positional deviation from occurring between the two terminal arrays 6 and 8 during a transport from a tentative fixing apparatus to a final fixing apparatus.

Abstract translation: 一种将设置在第一电气部件的连接部分5中的第一端子阵列6和设置在第二电气部件的连接部分7中的第二端子阵列8彼此连接的方法， 它们具有两个步骤，即，通过使用糊状各向异性导电性的焊料颗粒3焊接它们来临时固定端子阵列6和8相对于彼此定位的两个连接部分5和7的步骤 粘合剂1，其中焊料颗粒3和导电颗粒4分散在热固性树脂2中，以及最后用热固化的热固性树脂2将两个连接部分5和7彼此固定的步骤。 这防止了在从临时定影装置传送到最终定影装置期间在两个端子阵列6和8之间发生位置偏移。

公开(公告)号：US20100288534A1

公开(公告)日：2010-11-18

申请号：US12011353

申请日：2008-01-24

Applicant: Alfred I-Tsung Pan ,  Scott T. Haubrich

Inventor： Alfred I-Tsung Pan ,  Scott T. Haubrich

IPC: H05K1/00 ,  B05C11/00

CPC classification number: H05K1/097 ,  H01B1/22 ,  H01B1/24 ,  H01L21/288 ,  H01L21/76801 ,  H01L29/78681 ,  H01L29/7869 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

Abstract translation: 描述了通过印刷和固化形成印刷元件的可印刷组合物。 可印刷组合物包括第一类型的多个纳米结构，其在印刷和固化时形成限定中间体积的布置。 可印刷组合物还包括第二类型的多个纳米结构，其在印刷和固化时至少部分地填充中间体积以促进印刷元件中的光滑表面形貌和降低的孔隙率。