公开(公告)号：US11744004B2

公开(公告)日：2023-08-29

申请号：US17464935

申请日：2021-09-02

Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  Avary Holding (Shenzhen) Co., Limited. ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： Wei-Xiang Li

IPC: H05K3/30 ,  H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  H05K1/18

CPC classification number: H05K1/0206 ,  H05K1/183 ,  H05K3/064 ,  H05K3/30 ,  H05K1/09 ,  H05K2201/064 ,  H05K2201/09036 ,  H05K2201/10151 ,  H05K2203/0723

Abstract: A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

公开(公告)号：US20230199968A1

公开(公告)日：2023-06-22

申请号：US17552982

申请日：2021-12-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： SHIH-HSI TAI ,  TUNG-HO TAO ,  TZE-YANG YEH

IPC: H05K3/06 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/06 ,  H05K1/0201 ,  H05K3/0017 ,  H05K2201/09036 ,  H05K2203/0502

Abstract: A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.

公开(公告)号：US20230199954A1

公开(公告)日：2023-06-22

申请号：US18111738

申请日：2023-02-20

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： LIN-JIE GAO ,  YONG-CHAO WEI

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/05 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K1/114 ,  H05K3/0041 ,  H05K1/056 ,  H05K3/3452 ,  H05K3/421 ,  H05K2203/0415 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/0358 ,  H05K2201/0195

Abstract: A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

公开(公告)号：US20230163147A1

公开(公告)日：2023-05-25

申请号：US18159132

申请日：2023-01-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koichi Shimizu ,  Satoru Hamasaki

IPC: H01L27/146 ,  H01L23/053 ,  H01L23/00 ,  H05K3/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L27/14618 ,  H01L23/053 ,  H01L24/48 ,  H05K3/0014 ,  H05K1/0373 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/10121 ,  H01L2224/48227 ,  H05K2201/09036

Abstract: A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.

公开(公告)号：US20190006077A1

公开(公告)日：2019-01-03

申请号：US16102039

申请日：2018-08-13

Applicant: Radial Electronics, Inc.

Inventor： James E. Quilici

IPC: H01F17/00 ,  H05K3/46 ,  H05K3/04 ,  H05K1/02 ,  H01F41/064 ,  H01F5/00 ,  H01F17/06 ,  H01F41/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04 ,  H05K1/16 ,  H01F27/02 ,  H05K3/00

CPC classification number: H01F17/0033 ,  H01F5/00 ,  H01F17/062 ,  H01F27/027 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/2895 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2809 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

Abstract: Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.

公开(公告)号：US10043960B2

公开(公告)日：2018-08-07

申请号：US13296812

申请日：2011-11-15

Applicant: Peter Scott Andrews ,  Jeffrey Carl Britt

Inventor： Peter Scott Andrews ,  Jeffrey Carl Britt

IPC: H01L33/08 ,  H01L33/38 ,  H01L33/62 ,  H01L33/60 ,  H01L33/20 ,  H01L25/075 ,  H01L33/64 ,  H01L23/373 ,  H05K1/03 ,  H05K1/02 ,  H05K3/06 ,  H05K3/16

CPC classification number: H01L33/62 ,  H01L23/3735 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12032 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/16 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.

公开(公告)号：US20180192518A1

公开(公告)日：2018-07-05

申请号：US15907366

申请日：2018-02-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Masaaki MINAMI

IPC: H05K1/14 ,  H05K1/03 ,  H05K3/36 ,  B32B15/08 ,  B23K20/10 ,  B29C65/08 ,  B29C65/00

CPC classification number: H05K1/142 ,  B23K20/10 ,  B29C65/08 ,  B29C65/081 ,  B29C66/1282 ,  B29C66/12841 ,  B29C66/43 ,  B29C66/71 ,  B29C66/72321 ,  B29C66/73161 ,  B29C66/73921 ,  B29C66/742 ,  B29C66/81419 ,  B29C66/8322 ,  B29K2705/02 ,  B29K2995/0072 ,  B29K2995/0074 ,  B29L2031/3425 ,  B32B15/08 ,  B32B2457/08 ,  H05K1/0313 ,  H05K1/117 ,  H05K1/147 ,  H05K3/328 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T428/19 ,  B29K2067/003

Abstract: A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration.

公开(公告)号：US20180156426A1

公开(公告)日：2018-06-07

申请号：US15724896

申请日：2017-10-04

Applicant: GE Lighting Solutions, LLC

Inventor： Yongli Feng ,  Yong fen Chen ,  Brian Morgan Spahnie ,  Yan Ni

IPC: F21V19/00 ,  F21V23/00 ,  F21S4/28 ,  F21K9/90

CPC classification number: F21V19/005 ,  F21K9/90 ,  F21S4/28 ,  F21V23/002 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H05K3/0058 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10106 ,  Y02P70/613

Abstract: An LED module having improved bonding features is described. In some embodiments, an LED module includes at least one LED light source, at least one wire, and a housing that has a rear wall having a surface. A flow channel is cut into at least one portion of the surface of the rear wall, which provides additional surface area when glue is applied to affix the housing of the LED module to a substrate.

公开(公告)号：US20180153039A1

公开(公告)日：2018-05-31

申请号：US15715551

申请日：2017-09-26

Applicant: Samsung Display Co., Ltd.

Inventor： Kyung-hwa LIM ,  Sangan KWON ,  Kyunho KIM ,  Yong-jin SHIN ,  Shimho YI ,  Heebum PARK

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  G09G3/20

CPC classification number: H05K1/142 ,  G09G3/2092 ,  G09G3/3225 ,  G09G3/3648 ,  G09G2310/08 ,  G09G2380/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/147 ,  H05K1/18 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09027 ,  H05K2201/09036 ,  H05K2201/10128

Abstract: A display device includes a display panel, a first circuit board, a control unit disposed on the first circuit board, a second circuit board, and a coupling film which electrically couples the control unit and the second circuit board to each other. The coupling film includes a first coupling part including a first region attached to the first circuit board, and a second region overlapping the display panel when viewed in a thickness direction of the display panel, a second coupling part including a third region attached to the second circuit board, and a fourth region overlapping the display panel when viewed in the thickness direction of the display panel, and a third coupling part coupled to each of the second region and the fourth region to electrically couple the first coupling part and the second coupling part to each other.

公开(公告)号：US20180138646A1

公开(公告)日：2018-05-17

申请号：US15800161

申请日：2017-11-01

Applicant: Yi-Fang CHUANG ,  Nai-Chien CHANG ,  NICECONN TECHNOLOGY CO., LTD.

Inventor： Yi-Fang CHUANG ,  Nai-Chien CHANG

IPC: H01R24/60 ,  H01R13/66

CPC classification number: H01R24/60 ,  H01R12/52 ,  H01R13/6594 ,  H01R13/665 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: A USB connecting apparatus includes a board member, a plurality of first conductive connection portions, a metal housing and an assembly structure. The board member is a printed circuit board complying with the USB-Type C specification and includes a main body portion and a tongue portion. The tongue portion includes two surfaces facing toward each other. Each first conductive connection portion is electrically disposed on at least one surface of the tongue portion in order to form a tongue plate. The metal housing is arranged on the board member and surrounds the tongue plate correspondingly. The assembly structure is arranged on the plate member and/or the metal housing. The plate member and the metal housing are positioned relative to each other via the assembly structure. Accordingly, the USB connecting apparatus can be used on an existing electronic product circuit board and can be directly used as USB Type-C.