Interposer for use with test apparatus
    253.
    发明申请
    Interposer for use with test apparatus 有权
    用于测试设备的插件

    公开(公告)号:US20060238207A1

    公开(公告)日:2006-10-26

    申请号:US11110901

    申请日:2005-04-21

    Abstract: An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.

    Abstract translation: 一种插入器,包括至少两个彼此结合的介电层,在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。 内插器非常适合用作测试设备的一部分,以将半导体芯片的高度致密图案的焊球接触件与设备的印刷电路板上较小致密的触点阵列相互连接。 该插入器还能够用于其它目的,包括作为半导体芯片和芯片载体衬底之间的互连电路化衬底,或者在芯片载体和印刷电路板之间。 还提供了制造这种插入件的各种方法。

    PCB with embedded optical fiber
    254.
    发明授权
    PCB with embedded optical fiber 失效
    PCB带嵌入式光纤

    公开(公告)号:US07125176B1

    公开(公告)日:2006-10-24

    申请号:US10674374

    申请日:2003-09-30

    Abstract: High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.

    Abstract translation: 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤,其沿纵向延伸的方向安装在加强板的表面上的凹槽中,该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位,以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤,并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上,用于光元件的电连接,例如, 与光通孔连通的VCSEL或光电二极管。

    Plastic packaging with high heat dissipation and method for the same
    258.
    发明授权
    Plastic packaging with high heat dissipation and method for the same 失效
    塑料包装具有高散热性和相同的方法

    公开(公告)号:US07023084B2

    公开(公告)日:2006-04-04

    申请号:US10746790

    申请日:2003-12-23

    Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin.A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film.Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.

    Abstract translation: 本发明提供了一种高散热塑料封装及其制造方法,其提供了具有良好粘结精度和粘合剂树脂渗漏最小的廉价薄薄的高散热塑料封装。 通过将粘合剂树脂粘合到Cu箔上并在基本中心位置预成型用于安装半导体元件的空腔的切口,形成Cu箔树脂膜。 使用粘合树脂将Cu箔树脂膜直接粘合到散热板上。 在Cu箔树脂膜上形成导体布线图案。 此外,散热板包括用于在与铜箔树脂膜的粘合树脂接合时防止树脂渗透到空腔上的停止部分。

    Membrane probe with anchored elements
    260.
    发明授权
    Membrane probe with anchored elements 失效
    带有锚定元件的膜探针

    公开(公告)号:US07011531B2

    公开(公告)日:2006-03-14

    申请号:US11031859

    申请日:2005-01-07

    Abstract: A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.

    Abstract translation: 一种在测试仪和电气部件之间建立电气连接的结构和方法。 柔性介电层具有第一面和第二面。 通孔延伸穿过电介质层的第一侧和第二侧。 盲通孔放置在从通孔偏移的位置,并且在从第一通孔的一部分到柔性介电层的一部分的第一方向上横向延伸。 盲孔从柔性介电层的第一侧沿第二方向延伸到介电层的第一侧和第二侧之间的柔性介电层的一部分。 导电构件延伸穿过通孔并延伸到盲孔中,从而填充通孔和盲孔。 导电构件具有第一表面和第二表面。 第一表面和第二表面之间的任何距离都大于电介质层的第一面和电介质层的第二面之间的距离。

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