公开(公告)号：US20060281230A1

公开(公告)日：2006-12-14

申请号：US11150997

申请日：2005-06-13

Applicant: Scott Brandenburg ,  David Laudick

Inventor： Scott Brandenburg ,  David Laudick

IPC: H01L21/00

CPC classification number: H01L23/3121 ,  H01L23/4334 ,  H01L25/0652 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K7/20854 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.

公开(公告)号：US07137189B2

公开(公告)日：2006-11-21

申请号：US10964224

申请日：2004-10-13

Applicant: Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

Inventor： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC: G11B5/127 ,  H04R31/00

CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US20060238207A1

公开(公告)日：2006-10-26

申请号：US11110901

申请日：2005-04-21

Applicant: Frank Egitto ,  How Lin

Inventor： Frank Egitto ,  How Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.

Abstract translation: 一种插入器，包括至少两个彼此结合的介电层，在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。 内插器非常适合用作测试设备的一部分，以将半导体芯片的高度致密图案的焊球接触件与设备的印刷电路板上较小致密的触点阵列相互连接。 该插入器还能够用于其它目的，包括作为半导体芯片和芯片载体衬底之间的互连电路化衬底，或者在芯片载体和印刷电路板之间。 还提供了制造这种插入件的各种方法。

公开(公告)号：US07125176B1

公开(公告)日：2006-10-24

申请号：US10674374

申请日：2003-09-30

Applicant: John W. Stafford ,  George G. Grouch ,  Irka Zazulak

Inventor： John W. Stafford ,  George G. Grouch ,  Irka Zazulak

IPC: G02B6/30 ,  G02B6/36

CPC classification number: G02B6/4246 ,  G02B6/4214 ,  G02B6/423 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/09745

Abstract: High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.

Abstract translation: 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤，其沿纵向延伸的方向安装在加强板的表面上的凹槽中，该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位，以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤，并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上，用于光元件的电连接，例如， 与光通孔连通的VCSEL或光电二极管。

公开(公告)号：US07091065B2

公开(公告)日：2006-08-15

申请号：US10667391

申请日：2003-09-23

Applicant: Tongbi Jiang ,  Alan G. Wood

Inventor： Tongbi Jiang ,  Alan G. Wood

IPC: H01L21/50

CPC classification number: H01L24/81 ,  H01L23/4985 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/53122 ,  Y10T29/53343 ,  Y10T29/53348 ,  Y10T29/53352 ,  H01L2924/00

Abstract: A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.

Abstract translation: 描述了一种中心键倒装芯片器件载体及其制造和使用方法。 载体包括支撑多个导电迹线的柔性基板。 在提供在迹线上的弹性体材料层的间隙内的位置中的每个迹线中形成切口部分。 每个切口部分的尺寸和构造被接纳用于将载体与半导体管芯电连接的焊球。

公开(公告)号：US20060139809A1

公开(公告)日：2006-06-29

申请号：US11317343

申请日：2005-12-22

Applicant: Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Noriyuki Saiki ,  Yukihiro Isono ,  Hideo Yamakura

Inventor： Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Noriyuki Saiki ,  Yukihiro Isono ,  Hideo Yamakura

IPC: G11B5/60

CPC classification number: G11B5/4826 ,  G11B5/4853 ,  H01L2224/742 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/4903

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.

Abstract translation: 本发明的实施例提供了具有适于重新利用悬架组件的焊球连接结构的头万向节组件（HGA）。 在一个实施例中，HGA包括在其前端处设置有引线焊盘的引线，并且还包括能够通过使用焊球通过焊球接合而连接到引线焊盘的滑块。 在激光束的辐射之前，形成在滑动垫的表面中的各个凹槽阻止焊球旋转并在滑块和引线板的表面上移动。

公开(公告)号：US20060113681A1

公开(公告)日：2006-06-01

申请号：US11330107

申请日：2006-01-12

Applicant: Se-young Jeong ,  Nam-seog Kim ,  Oh-se Yong ,  Soon-bum Kim ,  Sun-young Park ,  Ju-hyun Lyu ,  In-young Lee

Inventor： Se-young Jeong ,  Nam-seog Kim ,  Oh-se Yong ,  Soon-bum Kim ,  Sun-young Park ,  Ju-hyun Lyu ,  In-young Lee

IPC: H01L23/48

CPC classification number: H01L24/13 ,  B23K3/0607 ,  B23K3/0623 ,  H01L21/2885 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/048 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusions from the contact pad and the ball pad are sized and arranged to have overlapping upper portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract translation: 在布置在半导体芯片上的接触焊盘和布置在安装基板上的球垫之间形成加强焊料凸块连接器结构。 半导体芯片包括从中间层的表面向上延伸的至少一个增强突起。 安装基板包括从球垫向上延伸的至少一个加强突起，来自芯片和基板的突起被嵌入在焊料凸块连接器内。 在一些构造中，来自接触垫和球垫的加强突起的尺寸和布置为具有重叠的上部。 这些重叠部分可采取各种各样的构造，其允许突起重叠而不彼此接触，包括针阵列以及周围和被包围的元件的组合。 在每种构造中，加强突起将倾向于抑制裂纹形成和/或裂纹扩展，从而提高可靠性。

公开(公告)号：US07023084B2

公开(公告)日：2006-04-04

申请号：US10746790

申请日：2003-12-23

Applicant: Shigehisa Tomabechi ,  Akihiro Hamano

Inventor： Shigehisa Tomabechi ,  Akihiro Hamano

IPC: H01L23/34

CPC classification number: H05K1/021 ,  H01L21/4857 ,  H01L23/36 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/182 ,  H05K3/022 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2203/063 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249999 ,  Y10T428/25 ,  Y10T428/31529 ,  H01L2924/00

Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin.A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film.Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.

Abstract translation: 本发明提供了一种高散热塑料封装及其制造方法，其提供了具有良好粘结精度和粘合剂树脂渗漏最小的廉价薄薄的高散热塑料封装。 通过将粘合剂树脂粘合到Cu箔上并在基本中心位置预成型用于安装半导体元件的空腔的切口，形成Cu箔树脂膜。 使用粘合树脂将Cu箔树脂膜直接粘合到散热板上。 在Cu箔树脂膜上形成导体布线图案。 此外，散热板包括用于在与铜箔树脂膜的粘合树脂接合时防止树脂渗透到空腔上的停止部分。

公开(公告)号：US07015637B2

公开(公告)日：2006-03-21

申请号：US10637624

申请日：2003-08-11

Applicant: Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

Inventor： Yoshimi Uda ,  Kazuya Ishiwata ,  Shinsaku Kubo ,  Yasuyuki Watanabe

IPC: H01J19/66 ,  H01J19/82

CPC classification number: H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 μm. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

公开(公告)号：US07011531B2

公开(公告)日：2006-03-14

申请号：US11031859

申请日：2005-01-07

Applicant: Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

Inventor： Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

IPC: H01R12/00

CPC classification number: G01R1/06733 ,  G01R1/0735 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R2201/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  Y10T29/4922

Abstract: A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.

Abstract translation: 一种在测试仪和电气部件之间建立电气连接的结构和方法。 柔性介电层具有第一面和第二面。 通孔延伸穿过电介质层的第一侧和第二侧。 盲通孔放置在从通孔偏移的位置，并且在从第一通孔的一部分到柔性介电层的一部分的第一方向上横向延伸。 盲孔从柔性介电层的第一侧沿第二方向延伸到介电层的第一侧和第二侧之间的柔性介电层的一部分。 导电构件延伸穿过通孔并延伸到盲孔中，从而填充通孔和盲孔。 导电构件具有第一表面和第二表面。 第一表面和第二表面之间的任何距离都大于电介质层的第一面和电介质层的第二面之间的距离。