公开(公告)号：US20100190846A1

公开(公告)日：2010-07-29

申请号：US12753826

申请日：2010-04-02

申请人： Yuuzou Tsuchida ,  Kotarou Tsuchida ,  Kunitomo Watanabe ,  Daisuke Sakurai ,  Mamoru Koketsu ,  Mitsuo Kawabe ,  Teruo Utsumi

发明人： Yuuzou Tsuchida ,  Kotarou Tsuchida ,  Kunitomo Watanabe ,  Daisuke Sakurai ,  Mamoru Koketsu ,  Mitsuo Kawabe ,  Teruo Utsumi

IPC分类号： A01N43/16 ,  A01P1/00

CPC分类号： A01N35/04 ,  A01N43/16 ,  A01N43/40 ,  A01N65/00 ,  A01N65/44 ,  A61K31/11 ,  A61K31/353 ,  A61K31/4406 ,  A61K36/00 ,  Y02A50/473 ,  Y02A50/481 ,  A01N2300/00

摘要： A method for suppressing the growth of microorganism comprises the steps of providing a microbicidal agent comprising 5,7,4′-trihydroxy-3′,5′-dimethoxyflavone, and contacting the agent with the microorganism, wherein said microorganism is selected from the group consisting of Salmonella sp., and Pseudomonas aeruginosa.

摘要翻译： 抑制微生物生长的方法包括以下步骤：提供包含5,7,4'-三羟基-3'，5'-二甲氧基黄酮的杀菌剂，并使该试剂与微生物接触，其中所述微生物选自 由沙门氏菌和铜绿假单胞菌组成。

公开(公告)号：US07375421B2

公开(公告)日：2008-05-20

申请号：US11147864

申请日：2005-06-08

申请人： Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

发明人： Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

IPC分类号： H01R4/58 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L23/5384 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06593 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/055 ,  H01L2924/00014 ,  H01L2924/00

摘要： Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.

摘要翻译： 变薄和堆叠对于用于各种移动设备，智能卡，存储卡等的电路模块是必不可少的。 这些要求使得电路模块的制造由于分层而更复杂或更不可靠。 提供了一种多层结构的电路模块，其通过将半导体芯片和无源部件嵌入由热塑性树脂制成的片材中而形成; 在电路块的边界处折叠由在其上设置有布线图案的电路块形成的模块片，以堆叠成层; 并通过施加热和压力进行热粘合和集成模块片。 结果，可以以简单的方式制造高可靠性的电路模块。

公开(公告)号：US20080104817A1

公开(公告)日：2008-05-08

申请号：US11666466

申请日：2006-02-28

申请人： Masahiko Igarashi ,  Hideo Watanabe ,  Nobuyoshi Asaga ,  Satoshi Komuro ,  Takeshi Mochizuki ,  Daisuke Sakurai ,  Manabu Igusa ,  Yoshihiro Umebayashi ,  Masahiro Oiwake

发明人： Masahiko Igarashi ,  Hideo Watanabe ,  Nobuyoshi Asaga ,  Satoshi Komuro ,  Takeshi Mochizuki ,  Daisuke Sakurai ,  Manabu Igusa ,  Yoshihiro Umebayashi ,  Masahiro Oiwake

IPC分类号： B21D39/03 ,  B21D17/04

CPC分类号： B24D13/145 ,  B21H5/027 ,  B24B9/04 ,  Y10T29/49826

摘要： A spline rolling tool including a plurality of forming teeth that are to bite into a cylindrical workpiece so as to roll splines in the workpiece. Each of the forming teeth has an incomplete toothed region in which a crest of each forming tooth is removed such that an upper end of each forming tooth in the incomplete toothed region is defined by an incomplete-toothed region surface that includes a curved surface portion, a flat surface portion and a slant surface portion. The incomplete-toothed region surface is defined at its periphery by a chamfered edge that has a surface roughness of not larger than about 3.2 μm. Also disclosed is a process of manufacturing the spline rolling tool, which includes a chamfering step of forming the chamfered edge by using a wire brush having abrasive grains that are fixed to bristles of the wire brush.

摘要翻译： 一种花键滚动工具，其包括要咬入圆柱形工件中的多个成形齿，以便在工件中滚动花键。 每个成形齿具有不完整的齿形区域，其中每个成形齿的顶部被去除，使得不完全齿形区域中的每个成形齿的上端由包括弯曲表面部分的不完全齿区域表面限定， 平坦表面部分和倾斜表面部分。 不完全齿形区域表面在其周边由一个具有不大于3.2μm的表面粗糙度的倒角边缘限定。 还公开了一种制造花键滚动工具的方法，其包括通过使用具有固定到线刷的刷毛的磨粒的线刷形成倒角边缘的倒角步骤。

公开(公告)号：US09238278B2

公开(公告)日：2016-01-19

申请号：US14005874

申请日：2012-01-25

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： B23K35/02 ,  B23K1/00 ,  B32B3/24 ,  B32B3/30 ,  B23K1/20 ,  B23K3/06 ,  B23K35/26 ,  H01L23/00 ,  C22C13/00 ,  B23K35/362 ,  B23K35/40 ,  C22C1/02 ,  B22F7/00 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B22F7/004 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  B23K35/40 ,  B23K2101/42 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  C22C28/00 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/15788 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0425 ,  Y10T428/24322 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.

摘要翻译： 一种焊料转移基板，包括：基底层; 布置在基层上的粘合剂层; 以及布置在所述粘合剂层上的多个焊料粉末，其中在作为多孔构件的所述基底层中，至少允许剥离液体通过的多个孔由其侧面形成， 层不布置在其上布置有粘合剂层的一侧。 特别地，粘合剂层具有渗透的剥离液体膨胀的特性。

公开(公告)号：US08134081B2

公开(公告)日：2012-03-13

申请号：US12096255

申请日：2007-01-12

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H05K1/03

CPC分类号： H05K1/03 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/0082 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0347 ,  H05K2203/0514 ,  H05K2203/056 ,  H05K2203/107 ,  Y10T29/49124

摘要： A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

摘要翻译： 三维电路板通过包括板，设置在板上方的多个台阶上的第一布线电极组和至少在高度方向连接到第一布线电极组的第二布线电极形成， 其中第一布线电极组和第二布线电极之间的至少一个连接部分被整合为连续相同的形状。

公开(公告)号：US08119449B2

公开(公告)日：2012-02-21

申请号：US12278481

申请日：2007-03-06

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/11554 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2203/0514 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of connection terminals, where electrode terminal of electronic part and connection terminal of substrate are connected through protruding electrode and protruding electrode is formed of a conductive resin including a photosensitive resin and a conductive filler.

摘要翻译： 电子部件安装结构包括具有多个电极端子的电子部件，在与这些电极端子对应的位置设置有连接端子的基板，以及用于连接电极端子和连接端子中的一个的突起电极，其中电子部件的电极端子 基板的连接端子通过突出电极连接，突起电极由包含感光性树脂和导电性填料的导电性树脂形成。

公开(公告)号：US07768795B2

公开(公告)日：2010-08-03

申请号：US11660515

申请日：2005-08-31

申请人： Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

发明人： Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

IPC分类号： H01R12/16

CPC分类号： H01L25/18 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/15331 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4614

摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.

摘要翻译： 电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制 电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。 该电子电路装置（100）分配母基板。 此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

公开(公告)号：US20080094793A1

公开(公告)日：2008-04-24

申请号：US11660515

申请日：2005-08-31

申请人： Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

发明人： Daisuke Sakurai ,  Masahiro Ono ,  Kazuhiro Nishikawa

IPC分类号： H05K5/00 ,  H01L21/52

CPC分类号： H01L25/18 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/15331 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4614

摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.

摘要翻译： 电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制 电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。 该电子电路装置（100）分配母基板。 此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

公开(公告)号：US07297876B2

公开(公告)日：2007-11-20

申请号：US10918274

申请日：2004-08-13

申请人： Daisuke Sakurai ,  Norihito Tsukahara ,  Kazuhiro Nishikawa

发明人： Daisuke Sakurai ,  Norihito Tsukahara ,  Kazuhiro Nishikawa

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T29/4913 ,  H01L2224/82 ,  H01L2924/00

摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

摘要翻译： 对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。 接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。 然后将薄膜冷却固化。 将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。 上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。

公开(公告)号：US20070200217A1

公开(公告)日：2007-08-30

申请号：US11653304

申请日：2007-01-16

申请人： Norihito Tsukahara ,  Daisuke Sakurai

发明人： Norihito Tsukahara ,  Daisuke Sakurai

IPC分类号： H01L21/82 ,  H01L23/48

CPC分类号： H05K1/185 ,  H01L21/563 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/186 ,  H05K3/4614 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： After a first electronic component is inserted into a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, a thickness of a module may be decreased by a thickness of the base substrate. Further, since electronic components are surface-mounted, electronic components of arbitrary sizes and types may be used.