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公开(公告)号：US06239386B1
公开(公告)日：2001-05-29
申请号：US08695642
申请日：1996-08-12
IPC分类号： H01R909
CPC分类号： H01R13/2414 , H01R12/714 , H05K1/0272 , H05K1/036 , H05K1/056 , H05K1/116 , H05K3/0032 , H05K3/445 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0382 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/09827 , H05K2201/10378 , H05K2203/0554 , H05K2203/0582 , H05K2203/135 , H05K2203/308 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.
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公开(公告)号：US5980270A
公开(公告)日：1999-11-09
申请号：US753539
申请日：1996-11-26
IPC分类号： H01R33/76 , B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L21/60 , H01L23/32 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/7076 , H01R12/714 , H01R13/2407 , H01R13/2464 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06733 , G01R1/06738 , G01R1/06744 , G01R3/00 , H01L2224/13109 , H01L2224/16 , H01L2224/16237 , H01L2224/8114 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01L2924/351 , H01R4/028 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49144 , Y10T29/49179
摘要： A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.
摘要翻译： 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。
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公开(公告)号：US5834339A
公开(公告)日：1998-11-10
申请号：US610610
申请日：1996-03-07
IPC分类号： H01L21/56 , H01L21/68 , H01L23/31 , H01L23/495 , H01L21/44
CPC分类号： H01L21/568 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/3114 , H01L23/49572 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/08225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/80203 , H01L2224/80207 , H01L2224/81192 , H01L2224/81904 , H01L2224/83209 , H01L2224/9212 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311
摘要： A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component encapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer layer is created.
摘要翻译： 在未固化或部分固化的微电子部件密封剂和粘合剂/芯片附着层中去除空隙和气泡的方法。 通过施加均匀的压力（等静压或静水压）和能量使得产生基本上无空隙/无气泡的中间层，基本上消除了微电子部件和支撑基板之间的间隙内的密封的空隙或气泡。
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公开(公告)号：US5632631A
公开(公告)日：1997-05-27
申请号：US306205
申请日：1994-09-14
IPC分类号： B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06744 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R3/00 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L24/81 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。
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25.发明授权Manufacture of semiconductor connection components with frangible lead sections 失效制造具有易碎引线部分的半导体连接部件
公开(公告)号：US5629239A
公开(公告)日：1997-05-13
申请号：US408262
申请日：1995-03-21
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498
CPC分类号： H01L24/86 , H01L21/4846 , H01L23/4985 , H01L23/49861 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , Y10T29/49121
摘要： A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.
摘要翻译： 一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。 通过在延伸的处理区域中处理引线形成材料形成脆性部分，该处理区域延伸穿过由许多引线占据的区域。 该工艺避免了在引线的侧边缘上特别细蚀刻形成凹口的需要。
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公开(公告)号：US5615824A
公开(公告)日：1997-04-01
申请号：US410324
申请日：1995-03-24
IPC分类号： H01R33/76 , B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L21/60 , H01L23/32 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , B23K1/00
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/7076 , H01R12/714 , H01R13/2407 , H01R13/2464 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06733 , G01R1/06738 , G01R1/06744 , G01R3/00 , H01L2224/13109 , H01L2224/16 , H01L2224/16237 , H01L2224/8114 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01L2924/351 , H01R4/028 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49144 , Y10T29/49179
摘要： A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.
摘要翻译： 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。
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27.发明授权公开(公告)号：US06541845B2
公开(公告)日：2003-04-01
申请号：US09777781
申请日：2001-02-06
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.
摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。
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公开(公告)号：US06324754B1
公开(公告)日：2001-12-04
申请号：US09047638
申请日：1998-03-25
IPC分类号： H05K334
CPC分类号： H01L24/81 , H01L23/49838 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/19043 , H05K1/111 , H05K3/3452 , H05K2201/0397 , H05K2201/09381 , H05K2201/09663 , H05K2201/0969 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , H05K2201/2081 , H05K2203/041 , Y02P70/611 , Y10T29/49004 , Y10T29/4913 , Y10T29/49144
摘要： Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.
摘要翻译： 用于微电子连接的焊盘由一组从中心点径向向外延伸的可焊接润湿条形成。 固体芯焊球位于每个焊盘上并回流。 焊盘配置有助于使焊球居中，并将焊球保持在所需位置，从而最小化所得焊料凸块的高度变化。 此外，焊盘可以包括由非可润湿金属，金属化合物或电介质材料限定的不可润湿表面。 焊盘上的不可润湿区域限制焊料，并避免需要单独的焊接掩模。
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公开(公告)号：US06247228B1
公开(公告)日：2001-06-19
申请号：US08989305
申请日：1997-12-12
IPC分类号： H05K336
CPC分类号： H05K3/462 , H01L23/49827 , H01L23/5385 , H01L2924/0002 , H01R12/523 , H01R12/714 , H01R13/2414 , H01R43/0256 , H05K1/0272 , H05K1/036 , H05K1/056 , H05K1/116 , H05K3/0032 , H05K3/326 , H05K3/4623 , H05K3/4641 , H05K2201/0195 , H05K2201/0382 , H05K2201/0397 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/09827 , H05K2201/10378 , H05K2203/0554 , H05K2203/0582 , H05K2203/135 , H05K2203/308 , Y10T29/49126 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165 , Y10T156/1744 , H01L2924/00
摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.
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公开(公告)号：US5934914A
公开(公告)日：1999-08-10
申请号：US845016
申请日：1997-04-22
IPC分类号： B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06744 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R3/00 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L24/81 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
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