公开(公告)号：US5629239A

公开(公告)日：1997-05-13

申请号：US408262

申请日：1995-03-21

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L24/86 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/49121

摘要： A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.

摘要翻译： 一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。 通过在延伸的处理区域中处理引线形成材料形成脆性部分，该处理区域延伸穿过由许多引线占据的区域。 该工艺避免了在引线的侧边缘上特别细蚀刻形成凹口的需要。

公开(公告)号：US5615824A

公开(公告)日：1997-04-01

申请号：US410324

申请日：1995-03-24

申请人： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

发明人： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  B23K1/00

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179

摘要： A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

摘要翻译： 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

公开(公告)号：US06938338B2

公开(公告)日：2005-09-06

申请号：US10417746

申请日：2003-04-17

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US06635553B1

公开(公告)日：2003-10-21

申请号：US09721048

申请日：2000-11-22

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L2130

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2224/48

摘要： A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

摘要翻译： 微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。 引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。 支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。 在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。

公开(公告)号：US06338982B1

公开(公告)日：2002-01-15

申请号：US09688397

申请日：2000-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： H01L2102

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US06217972B1

公开(公告)日：2001-04-17

申请号：US09173797

申请日：1998-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B32B104

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

摘要翻译： 用于制造微电子部件的柔性片被保持在由刚性材料形成的框架上，使得框架在处理期间将片材保持在张力下，从而稳定片材的尺寸。 框架可以由诸如玻璃的刚性透光材料形成，并且框架和片材之间的结合可以由透射通过框架的光制成或释放。 框架板的优选特征使得诸如蚀刻溶液的处理液体的捕获最小化，从而最小化步骤之间的处理溶液的携带。 框架可以具有接触开口，其允许通过携带电镀或蚀刻电流的电极在片材上接合金属层，而不会干扰要形成或处理特征的片材的主要部分。

公开(公告)号：US06205660B1

公开(公告)日：2001-03-27

申请号：US08845014

申请日：1997-04-22

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： H01R4300

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连和任选的有效的冶金结合 接合材料。

公开(公告)号：US6104087A

公开(公告)日：2000-08-15

申请号：US138858

申请日：1998-08-24

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

摘要翻译： 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US6002168A

公开(公告)日：1999-12-14

申请号：US978082

申请日：1997-11-25

申请人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

发明人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K3/284 ,  H05K3/4084 ,  Y02P70/613

摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

摘要翻译： 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及安装在柔性插入件上的焊接铜球。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。

公开(公告)号：US5929517A

公开(公告)日：1999-07-27

申请号：US365749

申请日：1994-12-29

申请人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H05K13/04

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146

摘要： Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

摘要翻译： 半导体芯片封装及其制造方法。 该封装包括导热保护结构，其具有向前侧开口的凹口和至少部分地围绕凹口并面向结构前部的凸缘表面。 芯片设置在凹陷中，使得具有触点的芯片的前表面朝向结构的前部。 其上具有端子的柔性电介质膜放置在凸缘表面上，并且柔性材料设置在膜和凸缘表面之间。 胶片上的端子连接到芯片上的触点。 胶片上的各个端子相对于保护结构是可移动的，这有助于热膨胀的安装和补偿。