公开(公告)号：US3756891A

公开(公告)日：1973-09-04

申请号：US3756891D

申请日：1969-12-08

IPC: H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4626 ,  H05K3/386 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/092 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/063 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49117

Abstract: THE DISCLOSED TECHNIQUE COMPRISES THE LAMINATION OF TWO OR MORE CIRCUIT BOARDS USING A CONTROLLED FLOW ADHESIVE LAYER; THE CONTROLLED FLOW ADHESIVE PERMITTING THROUGH HOLES TO REMAIN UNOBSTRUCTED AFTER LAMINATION. FINAL INTERCONNECTION IS MADE BY PLATING THROUGH THE HOLES, THEREBY PROVIDING THE REQUISITE INTERCONNECTIONS BETWEEN SURFACES.

公开(公告)号：US08888504B2

公开(公告)日：2014-11-18

申请号：US13264892

申请日：2010-03-26

Applicant: Erich Pischler

Inventor： Erich Pischler

IPC: H01R12/00 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498 ,  H05K1/02 ,  H01R24/40 ,  H01R103/00 ,  H01R24/38

CPC classification number: H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/6622 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/13 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/16106 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81898 ,  H01L2224/83136 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01R23/26 ,  H01R24/40 ,  H01R2103/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/184 ,  H05K2201/09036 ,  H05K2201/092 ,  H05K2201/09809 ,  H05K2201/09845 ,  Y10T29/49117 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A male connection component (120) for connection with a correspondingly configured female connection component (140) having a recess (144) extending into a main surface (170) of a female Substrate (142) of the female connection component (140), wherein the female connection component (140) comprises a plurality of electrically conductive female contacts (146) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (170) of the female Substrate (142), the male connection component (120) comprising a male Substrate (102), a Protrusion (104) protruding from a main surface (160) of the male Substrate (102) and comprising a plurality of electrically conductive male contacts (106) which are electrically decoupled from one another and are arranged at different height levels with regard to the main surface (160) of the male Substrate (102), wherein the male connection component (120) is adapted for connection with the female connection component (140) so that upon connection, each of the plurality of electrically conductive male contacts (106) is brought in contact with one of the plurality of electrically conductive female contacts (146) for providing electric contactation at different height levels, wherein the male Substrate (102) forms at least part of one of a chip, a chip package and a circuit board.

Abstract translation: 用于与相应配置的阴连接部件（140）连接的阳连接部件（120），该阴连接部件具有延伸到阴连接部件（140）的阴基板（142）的主表面（170）的凹部（144），其中 阴连接部件（140）包括多个导电阴触头（146），它们彼此电分离并相对于阴基板（142）的主表面（170）布置在不同的高度水平处， 阳连接部件（120），包括阳基底（102），从阳基底（102）的主表面（160）突出的突起（104），并且包括多个导电的阳触头（106），电接头 并且相对于阳性基板（102）的主表面（160）布置在不同的高度水平处，其中阳连接部件（120）适于与阴连接 连接部件（140），使得在连接时，多个导电阳触头（106）中的每一个与多个导电阴触头（146）中的一个接触，用于在不同的高度级别提供电接触，​​其中 阳基板（102）形成芯片，芯片封装和电路板之一的至少一部分。

公开(公告)号：US08809689B2

公开(公告)日：2014-08-19

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US20120273260A1

公开(公告)日：2012-11-01

申请号：US13539677

申请日：2012-07-02

Applicant: Thomas A. Olden ,  Walter Wrigglesworth

Inventor： Thomas A. Olden ,  Walter Wrigglesworth

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0366 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/4632 ,  H05K3/465 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Abstract translation: 复合互连组件包括由其中嵌入有一个或多个导电迹线（例如铜或铜合金）的复合材料（例如，碳石墨材料）形成的主体结构。 提供一个或多个接触区域，使得导电迹线被暴露并且被配置为机械地和电连接到一个或多个电子部件。 身体结构可以具有各种形状，包括平面，圆柱形，圆锥形等。

公开(公告)号：US20110304949A1

公开(公告)日：2011-12-15

申请号：US13143637

申请日：2010-01-06

Applicant: Todd Hubing

Inventor： Todd Hubing

IPC: H01G4/228

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H05K1/184 ,  H05K2201/092 ,  H05K2201/09309

Abstract: A capacitor having a stem that is designed to be inserted into a single, large-diameter via hole drilled in a printed circuit board is provided, wherein the stem may have conductive rings for making the positive and negative connections to the printed circuit board power distribution planes. Inside the capacitive stem, current, or at least a portion thereof, may be carried to the main body of the capacitor through low-inductance plates that are interleaved to maximize their own mutual inductance and, therefore, minimize the connection inductance. Alternatively, the capacitor may include a coaxial stem that forms a coaxial transmission line with the anode and cathode terminals forming the inner and outer conductors.

Abstract translation: 提供一种电容器，其具有设计成插入到印刷电路板中钻出的单个大直径通孔中的阀杆，其中所述阀杆可具有导电环，用于使得与所述印刷电路板配电的正极和负极连接 飞机 在电容杆内部，电流或其至少一部分可以通过交错的低电感板传送到电容器的主体，以使其自身的互感最大化，从而使连接电感最小化。 或者，电容器可以包括形成同轴传输线的同轴杆，阳极和阴极端子形成内导体和外导体。

公开(公告)号：US20100127402A1

公开(公告)日：2010-05-27

申请号：US12692974

申请日：2010-01-25

Applicant: Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

Inventor： Kevin P. Grundy ,  Joseph C. Fjelstad ,  Gary Yasumura ,  William F. Wiedemann ,  Para K. Segaram

IPC: H01L23/48

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US07488676B2

公开(公告)日：2009-02-10

申请号：US11297358

申请日：2005-12-09

Applicant: Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

Inventor： Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

IPC: H01L21/4763

CPC classification number: H05K3/429 ,  H05K1/0268 ,  H05K3/0047 ,  H05K2201/092 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/163 ,  H05K2203/175 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

Abstract translation: 多层电路板的制造方法允许电子部件被充分地安装，并且不会妨碍电子部件的性能。 要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。 在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。 在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。 基于与检测孔导电的工具设定孔的深度。 通孔的不必要的板可以被大孔除去。

公开(公告)号：US20070279870A1

公开(公告)日：2007-12-06

申请号：US11755076

申请日：2007-05-30

Applicant: Hisashi Sato ,  Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

Inventor： Hisashi Sato ,  Yuichi Ishida ,  Masaaki Ishiguro ,  Kazuaki Nakamura

IPC: H05K7/20

CPC classification number: H05K7/026 ,  H01R9/226 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0382 ,  H05K2201/092

Abstract: An electrical component is mounted a circuit board. A case covers the circuit board. The circuit board includes a plate-like metal core and an insulation portion. The insulation portion covers a surface of the metal core. The metal core is provided with a heat radiation portion exposed from the case.

Abstract translation: 电气部件安装有电路板。 案例涵盖电路板。 电路板包括板状金属芯和绝缘部。 绝缘部分覆盖金属芯的表面。 金属芯设置有从壳体露出的散热部。

公开(公告)号：US07304862B2

公开(公告)日：2007-12-04

申请号：US11559928

申请日：2006-11-15

Applicant: Galliano R. Busletta ,  Robert J. Roessler

Inventor： Galliano R. Busletta ,  Robert J. Roessler

IPC: H05K7/00

CPC classification number: H05K1/165 ,  H01F2027/2819 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/09645

Abstract: The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect is free of a complementary via and contacts and electrically interconnects the conductive layers. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.

Abstract translation: 本发明提供一种用于将电气部件附接到其上的PWB。 PWB包括堆叠的绝缘层，位于绝缘层之间的导电层，其中导电层终止于PWB的边缘，以及位于边缘上的边缘板互连。 边缘板互连件没有互补的通孔和触点，并且电连接导电层。 本发明还提供一种制造PWB的方法，并且还提供实现边缘板互连的功率转换器。

公开(公告)号：US20070266281A1

公开(公告)日：2007-11-15

申请号：US11411920

申请日：2006-04-27

Applicant: Young Kwark

Inventor： Young Kwark

IPC: G01R31/28

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2203/049 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.

Abstract translation: 一种电路装置，其包括具有从电路板的表面延伸到嵌入导体的空腔中的集成电路芯片的电路板以及集成电路芯片和嵌入式导体之间的电连接。