公开(公告)号：US08207604B2

公开(公告)日：2012-06-26

申请号：US10985126

申请日：2004-11-10

申请人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

发明人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae M. Park

IPC分类号： H01L23/485

CPC分类号： H01L23/13 ,  H01L21/4846 ,  H01L2924/0002 ,  H01R13/2414 ,  H01R13/2464 ,  H01L2924/00

摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.

摘要翻译： 微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

公开(公告)号：US20120155055A1

公开(公告)日：2012-06-21

申请号：US13157722

申请日：2011-06-10

申请人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H05K7/00 ,  H05K3/36 ,  H05K3/32

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。

公开(公告)号：US20120152433A1

公开(公告)日：2012-06-21

申请号：US12974611

申请日：2010-12-21

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： B32B37/06

CPC分类号： H01L22/12 ,  H01L21/67092

摘要： A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.

摘要翻译： 接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度， 使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。

公开(公告)号：US20120146206A1

公开(公告)日：2012-06-14

申请号：US12966225

申请日：2010-12-13

申请人： Belgacem Haba ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Ilyas Mohammed

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L23/532

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/811 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a substrate having a first region, a second region, a first surface, and a second surface remote from the first surface. At least one microelectronic element overlies the first region on the first surface. First electrically conductive elements are exposed at one of the first surface and the second surface of the substrate within the second region with at least some of the first conductive elements electrically connected to the at least one microelectronic element. Substantially rigid metal elements overlie the first conductive elements and have end surfaces remote therefrom. A bond metal joins the metal elements with the first conductive elements, and a molded dielectric layer overlies at least the second region of the substrate and has a surface remote from the substrate. The end surfaces of the metal elements are at least partially exposed at the surface of the molded dielectric layer.

摘要翻译： 微电子封装包括具有第一区域，第二区域，第一表面和远离第一表面的第二表面的衬底。 至少一个微电子元件覆盖在第一表面上的第一区域上。 第一导电元件在第二区域内的衬底的第一表面和第二表面中的一个处暴露，其中至少一些第一导电元件电连接到至少一个微电子元件。 基本上刚性的金属元件覆盖在第一导电元件上并具有远离其的端表面。 键合金属将金属元件与第一导电元件结合，并且模制的电介质层至少覆盖在衬底的第二区域上并且具有远离衬底的表面。 金属元件的端面至少部分地暴露在模制介电层的表面。

公开(公告)号：US08193615B2

公开(公告)日：2012-06-05

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/485

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。

公开(公告)号：US20120119367A1

公开(公告)日：2012-05-17

申请号：US12963938

申请日：2010-12-09

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/03001 ,  H01L2224/03003 ,  H01L2224/0311 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/29018 ,  H01L2224/29026 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/20107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself.

公开(公告)号：US20120092832A1

公开(公告)日：2012-04-19

申请号：US12907522

申请日：2010-10-19

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K7/20

CPC分类号： H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

摘要翻译： 微电子组件包括具有相对面对的第一和第二表面的介电元件和在表面之间延伸的一个或多个孔，该介电元件还在其上具有导电元件; 第一微电子元件，其具有背面和面向电介质元件的第一表面的前表面，第一微电子元件具有第一边缘和暴露在其前表面的多个触点; 第二微电子元件，包括具有背面和面向第一微电子元件的后表面的前表面，第二微电子元件的前表面的突出部分延伸超过第一微电子元件的第一边缘，突出部分为 与介电元件的第一表面间隔开，第二微电子元件具有在前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件或第二微电子元件中的至少一个的散热器。

公开(公告)号：US20120068352A1

公开(公告)日：2012-03-22

申请号：US12883431

申请日：2010-09-16

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/92 ,  H01L25/50 ,  H01L27/14601 ,  H01L27/14632 ,  H01L2224/0346 ,  H01L2224/05009 ,  H01L2224/05647 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/82005 ,  H01L2224/82101 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2225/06544 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2224/82 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can be formed by stacking a first semiconductor element atop a second semiconductor element and forming an electrically conductive element extending through openings of the semiconductor elements. The openings may be staged. The conductive element can conform to contours of the interior surfaces of the openings and can electrically connect conductive pads of the semiconductor elements. A dielectric region can be provided at least substantially filling the openings of the semiconductor elements, and the electrically conductive element can extend through an opening formed in the dielectric region.

摘要翻译： 提供了组装和制造方法。 可以通过在第二半导体元件顶部堆叠第一半导体元件并形成延伸穿过半导体元件的开口的导电元件来形成该组件。 开口可以分段。 导电元件可以符合开口的内表面的轮廓并且可以电连接半导体元件的导电焊盘。 可以提供至少基本上填充半导体元件的开口的电介质区域，并且导电元件可以延伸穿过形成在电介质区域中的开口。

公开(公告)号：US08067267B2

公开(公告)日：2011-11-29

申请号：US11318164

申请日：2005-12-23

申请人： Belgacem Haba ,  Craig S. Mitchell

发明人： Belgacem Haba ,  Craig S. Mitchell

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3511

摘要： A method of making a stacked microelectronic assembly includes providing a first microelectronic package that includes a first substrate having a first dielectric layer, conductive posts, and conductive traces extending along the surface of the first dielectric layer; providing a second microelectronic package including a second substrate that includes a second dielectric layer; securing a microelectronic element to one of the surfaces of at least one of the first or second substrates; and joining the conductive posts of the first substrate with the fusible masses of the second substrate. The posts may include a plurality of aligned posts which are aligned in a first row extending in a single orthogonal direction along a surface of the first substrate away from a portion of the first substrate that faces a face of the microelectronic element. The aligned posts are disposed beyond one of the edges of the microelectronic element.

摘要翻译： 制造堆叠的微电子组件的方法包括提供第一微电子封装，其包括具有第一电介质层的第一衬底，导电柱和沿着第一电介质层的表面延伸的导电迹线; 提供包括第二衬底的第二微电子封装，所述第二衬底包括第二介电层; 将微电子元件固定到所述第一或第二基板中的至少一个的一个表面上; 以及将第一基板的导电柱与第二基板的可熔块接合。 柱可以包括多个对准的柱，其在沿着第一基板的表面沿着单个正交方向延伸的第一行中排列，远离第一基板的面对微电子元件的表面的部分。 对准的柱被设置在微电子元件的边缘之一之外。

公开(公告)号：US08046912B2

公开(公告)日：2011-11-01

申请号：US12321210

申请日：2009-01-16

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。