公开(公告)号：US20180026012A1

公开(公告)日：2018-01-25

申请号：US15543397

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16058 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17107 ,  H01L2224/17181 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27515 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81122 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83122 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00015 ,  H01L2924/3841 ,  H01L2224/83851 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05432

Abstract: Provided is a multilayer substrate obtained by laminating semiconductor substrates each having a trough electrode. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are each selectively present at a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through electrodes are connected by the conductive particles, and the semiconductor substrates each having the through electrode are bonded by an insulating adhesive.

公开(公告)号：US20180002575A1

公开(公告)日：2018-01-04

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  H04N5/225 ,  H05K1/18 ,  C09J11/04 ,  H01B1/22 ,  H01L27/146 ,  H01R4/04 ,  C09J163/00 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20170077055A1

公开(公告)日：2017-03-16

申请号：US15115827

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00 ,  B32B27/38 ,  B32B27/14

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B2307/202 ,  B32B2457/00 ,  C08F220/18 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/066 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/061 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

Abstract translation: 各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子，光阴离子或自由基聚合性树脂层。 在第二连接层一侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒被布置在单层中。 固化比低于第一连接层的表面的区域存在于与第一连接层的厚度方向倾斜的方向上。 或者，导电粒子附近的第一连接层的区域之间的第一连接层的另一个表面的相对接近的区域的固化比率低于第一连接层的表面的硬化率。

公开(公告)号：US20170012014A1

公开(公告)日：2017-01-12

申请号：US15115771

申请日：2015-02-04

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B3/30 ,  B32B27/06 ,  B32B5/30

CPC classification number: H01L24/27 ,  B32B3/00 ,  B32B3/30 ,  B32B5/30 ,  B32B7/00 ,  B32B7/02 ,  B32B7/04 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/28 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/706 ,  C08K2201/001 ,  C08L63/00 ,  C09J4/00 ,  C09J7/10 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L2224/27001 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  C08L101/00

Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

Abstract translation: 各向异性导电膜具有形成在第一层表面上的第一和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子或光阳离子或可自由基聚合的树脂层。 在第二连接层侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒是单层。 第一连接层在表面上具有精细的突出和凹陷。 另一方面的各向异性导电膜具有顺序层叠的第一，第二和第三连接层。 由光自由基聚合树脂形成的第一层。 第二层和第三层由热阳离子或热阴离子可聚合树脂，光阳离子或光阴离子可聚合树脂，可热可聚合树脂或光可自由基聚合树脂形成。 在第二连接层侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒是单层。

公开(公告)号：US20160255724A1

公开(公告)日：2016-09-01

申请号：US15027422

申请日：2014-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H05K1/18 ,  H01B3/40 ,  H05K3/06 ,  H01B1/22 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/18 ,  C08F2/44 ,  C08F2/48 ,  C08F222/1006 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01B3/40 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/27003 ,  H01L2224/2712 ,  H01L2224/2732 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29455 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01R4/04 ,  H01R12/57 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/06 ,  H05K3/323 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical connection material such as anisotropic conductive film that suppresses generation of warpage at electrical connection portion such as anisotropic conductive connection portion, and does not allow conduction reliability of connection body obtained by electrical connection such as anisotropic conductive connection to be reduced has a structure in which a conductive particle-containing layer is disposed between first insulating thermosetting resin composition layer and second insulating thermosetting resin composition layer. The conductive particle-containing layer is obtained by irradiating conductive particle-containing resin composition layer that contains radically polymerizable acrylate compound, photoradical polymerization initiator, non-radically polymerizable epoxy-based compound, and conductive particles with light, resulting in photoradical polymerization to form B stage state of conductive particle-containing resin composition layer. The first insulating thermosetting resin composition layer and second insulating thermosetting resin composition layer each contain non-radically polymerizable epoxy-based compound and thermal cationic polymerization initiator or thermal anionic polymerization initiator.

Abstract translation: 诸如各向异性导电膜之类的各向异性导电膜的电连接材料抑制诸如各向异性导电连接部分之类的电连接部分处的翘曲产生，并且不允许通过诸如各向异性导电连接的电连接获得的连接体的导通可靠性降低， 在第一绝缘热固性树脂组合物层和第二绝缘热固性树脂组合物层之间设置有导电粒子层。 含导电颗粒的层是通过用光照射含有可自由基聚合的丙烯酸酯化合物，光自由基聚合引发剂，不可自由基聚合的环氧基化合物和导电颗粒的含有导电颗粒的树脂组合物层而获得的，从而进行光自由基聚合以形成B 含导电粒子的树脂组合物层的阶段状态。 第一绝缘热固性树脂组合物层和第二绝缘热固性树脂组合物层各自含有不可自由基聚合的环氧基化合物和热阳离子聚合引发剂或热阴离子聚合引发剂。

公开(公告)号：US20160149366A1

公开(公告)日：2016-05-26

申请号：US14904443

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01R43/20 ,  C09J7/02 ,  C09J9/02

CPC classification number: H01R43/205 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/143 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1344

Abstract: An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

Abstract translation: 各向异性导电膜即使连接端子之间的间隔变窄也能够防止端子之间的短路。 导电支撑板支撑具有一个具有粘合剂层的表面的基底膜。 阵列板设置成面向粘合剂层并且具有以对应于导电颗粒的阵列图案的图案布置的通孔。 喷雾将导电颗粒与液体一起喷射，同时向导电颗粒施加电压，其中将带有电荷的导电颗粒与来自喷雾的液体一起喷射，同时在喷雾之间施加电压 并且已经穿过阵列板的通孔的支撑板和导电颗粒以通孔的阵列图案布置在粘合剂层上。