公开(公告)号：US06283359B1

公开(公告)日：2001-09-04

申请号：US09644486

申请日：2000-08-23

Applicant: Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

IPC: B23K3102

CPC classification number: H01L24/12 ,  B23K35/0222 ,  B23K35/0244 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1184 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12687 ,  Y10T428/2991 ,  H01L2224/29099 ,  H01L2924/00

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract translation: 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接​​，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。

公开(公告)号：US6037065A

公开(公告)日：2000-03-14

申请号：US29248

申请日：1998-07-06

Applicant: Karel Hajmrle ,  Kenneth G. Reid ,  Anthony P. Chilkowich ,  James B. Ramsden

Inventor： Karel Hajmrle ,  Kenneth G. Reid ,  Anthony P. Chilkowich ,  James B. Ramsden

IPC: B23K35/02 ,  B23K35/14 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K3/4015 ,  B23K35/0244 ,  H01L23/49816 ,  H05K3/3436 ,  H05K7/1084 ,  H01L2224/81141 ,  H01L2224/81193 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/162 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: A connective medium is provided for use in ball grid assemblies for detachable connections between electronic devices and circuit boards. The medium includes novel, discrete spheres defining an inner metallic, spherical core and one or more outer, electrically conductive concentric, hard and non-deformable metallic layers of nickel, copper or alloys thereof and a coating of silver or gold thereon.

Abstract translation: PCT No.PCT / CA96 / 00863 Sec。 371日期：1998年7月7日 102（e）日期1998年7月7日PCT 1996年12月19日PCT PCT。 公开号WO97 / 23121 日期1997年6月26日提供了一种用于球栅组件的连接介质，用于电子设备和电路板之间的可拆卸连接。 该介质包括新颖的离散球体，其限定内部金属球形芯和一个或多个外部导电的同心的，硬的和不可变形的镍，铜或其合金的金属层以及其上的银或金的涂层。

公开(公告)号：US5240588A

公开(公告)日：1993-08-31

申请号：US936271

申请日：1992-08-27

Applicant: Hiroyuki Uchida

Inventor： Hiroyuki Uchida

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/03 ,  H05K3/24 ,  H05K3/34

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L24/49 ,  H05K3/3421 ,  H01L2224/05554 ,  H01L2224/056 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/854 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2203/0435 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for manufacturing a pin grid array type semiconductor device package including a substrate having a principle surface and a bottom surface opposing the principal surface, a plurality of patterned metallized conductors formed in the substrate or on the principal surface of the substrate so as to be electrically connected to a semiconductor device chip to be located on the principal surface. A plurality of metallized pads are formed on the bottom surface and electrically connected to the patterned metallized conductors. A metal film is deposited so as to cover the bottom surface including the metallized pads, and a lead pin is soldered on the metal film above each metallized pad by a solder material. The lead pin is electroplated by applying a voltage to the metal film.

Abstract translation: 一种用于制造引脚格栅阵列型半导体器件封装的方法，其包括具有与主表面相对的主表面和底表面的衬底，形成在衬底中或衬底的主表面上的多个图案化金属化导体， 电连接到要位于主表面上的半导体器件芯片。 多个金属化焊盘形成在底表面上并与图案化的金属化导体电连接。 沉积金属膜以覆盖包括金属化焊盘的底表面，并且引线销通过焊料材料焊接在每个金属化焊盘上的金属膜上。 通过向金属膜施加电压来对引脚进行电镀。

公开(公告)号：US5086966A

公开(公告)日：1992-02-11

申请号：US608872

申请日：1990-11-05

Applicant: Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers ,  William Beckenbaugh

Inventor： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers ,  William Beckenbaugh

IPC: B23K1/20 ,  B23K35/02 ,  H05K3/34

CPC classification number: B23K35/0244 ,  B23K1/20 ,  H05K3/3436 ,  H05K2203/041 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/12687 ,  Y10T428/12875

Abstract: A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.

Abstract translation: 在焊接到金属基底之前，预先处理由铅 - 锡焊料合金形成的本体以在其上沉积钯。 发现钯沉积物在回流期间通过焊料增强了衬底的润湿，从而在冷却时产生强烈的冶金结合。 在优选的实施方案中，铅锡焊球通过施加锡 - 钯胶体颗粒进行预处理，并使颗粒解离以形成不连续的金属钯沉积物。

公开(公告)号：US20140291843A1

公开(公告)日：2014-10-02

申请号：US13853982

申请日：2013-03-29

Applicant: Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

Inventor： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

Abstract translation: 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。

公开(公告)号：US08759958B2

公开(公告)日：2014-06-24

申请号：US12658646

申请日：2010-02-12

Applicant: Dong-Ki Ho ,  Boseong Kim

Inventor： Dong-Ki Ho ,  Boseong Kim

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/2081 ,  H05K2203/0435 ,  Y02P70/613

Abstract: A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.

Abstract translation: 半导体封装包括第一封装和第二封装，连接端子设置在第一封装和第二封装之间，并且包括垂直堆叠的第一焊球和第二焊球，焊料钝化层，至少一个 涂覆第一和第二焊球的环形短路防止部分，围绕第一和第二焊球之间的耦合部分。

公开(公告)号：US07632710B2

公开(公告)日：2009-12-15

申请号：US11817522

申请日：2006-11-10

Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

公开(公告)号：US20090246911A1

公开(公告)日：2009-10-01

申请号：US12325897

申请日：2008-12-01

Applicant: Hiroyuki Watanabe

Inventor： Hiroyuki Watanabe

IPC: H01L21/50 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K3/3457 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K2203/0435 ,  H05K2203/072 ,  H05K2203/073 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A substrate for mounting electronic components includes an insulating layer and a pad formed on a surface of the insulating layer, the pad configured to mount an electronic component to the substrate. A solder bump is formed on the pad and configured to connecting the pad to a bump of an electronic component, the solder bump including a metal as a major component of the solder bump. A metal film is formed on a surface of the solder bump, the metal film comprising a different metal from the major component of said solder

Abstract translation: 用于安装电子部件的基板包括绝缘层和形成在绝缘层的表面上的焊盘，该焊盘被配置为将电子部件安装到基板。 在焊盘上形成焊料凸点，并将其构造成将焊盘连接到电子部件的凸块，焊料凸块包括作为焊料凸块的主要部件的金属。 在焊料凸块的表面上形成金属膜，金属膜包含与所述焊料的主要成分不同的金属

公开(公告)号：US20090233117A1

公开(公告)日：2009-09-17

申请号：US11817522

申请日：2006-11-10

Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

IPC: B32B15/04 ,  B23K31/02 ,  B23K1/20

CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

公开(公告)号：US20080115968A1

公开(公告)日：2008-05-22

申请号：US11602914

申请日：2006-11-20

Applicant: Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

Inventor： Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

IPC: H01L23/49

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/81011 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/0341 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract translation: 描述了一种微电子组件及其制造方法。 在一个示例中，微电子组件包括具有一个或多个区域以接收一个或多个焊球的表面的微电子器件，所述一个或多个区域具有包括Ni的表面光洁度。 将包含Cu的焊料材料（例如焊剂或糊料）施加到Ni表面光洁度上，并且一个或多个焊球通过在一个或多个焊球之间形成焊料接头的回流工艺耦合到微电子器件，焊料 包含Cu的材料，并且所述一个或多个区域具有包括Ni的表面光洁度。