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公开(公告)号：US20130175694A1
公开(公告)日：2013-07-11
申请号：US13345485
申请日：2012-01-06
申请人： Ying-Ching Shih , Szu Wei Lu , Jing-Cheng Lin
发明人： Ying-Ching Shih , Szu Wei Lu , Jing-Cheng Lin
IPC分类号： H01L21/58 , H01L23/485 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/3185 , H01L23/49816 , H01L24/97 , H01L2221/68345 , H01L2221/68381 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81192 , H01L2224/83005 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/0401 , H01L2224/83
摘要： A method includes forming a dielectric layer over a substrate, forming an interconnect structure over the dielectric layer, and bonding a die to the interconnect structure. The substrate is then removed, and the dielectric layer is patterned. Connectors are formed at a surface of the dielectric layer, wherein the connectors are electrically coupled to the die.
摘要翻译： 一种方法包括在衬底上形成电介质层，在电介质层上形成互连结构，以及将管芯结合到互连结构。 然后去除衬底，并对电介质层进行图案化。 连接器形成在电介质层的表面，其中连接器电耦合到管芯。
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公开(公告)号：US09691706B2
公开(公告)日：2017-06-27
申请号：US13452140
申请日：2012-04-20
申请人： Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
发明人： Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
IPC分类号： H01L23/48 , H01L23/538 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/544 , H01L21/683 , H01L23/31
CPC分类号： H01L25/0655 , H01L21/31053 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6836 , H01L21/78 , H01L23/3128 , H01L23/49816 , H01L23/5386 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/742 , H01L24/82 , H01L24/92 , H01L24/94 , H01L24/96 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2223/54426 , H01L2224/02311 , H01L2224/0401 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/11002 , H01L2224/11334 , H01L2224/1134 , H01L2224/1184 , H01L2224/12105 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/2101 , H01L2224/211 , H01L2224/214 , H01L2224/215 , H01L2224/24011 , H01L2224/24101 , H01L2224/24137 , H01L2224/244 , H01L2224/24991 , H01L2224/82005 , H01L2224/82106 , H01L2224/8213 , H01L2224/82132 , H01L2224/92 , H01L2224/94 , H01L2924/181 , H01L2924/18162 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/82 , H01L2224/11 , H01L2224/19 , H01L2924/00
摘要： A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line over and connected to the stud bump. An electrical connector is over and electrically coupled to the redistribution line.
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公开(公告)号：US20130187270A1
公开(公告)日：2013-07-25
申请号：US13452140
申请日：2012-04-20
申请人： Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
发明人： Chen-Hua Yu , Jing-Cheng Lin , Jui-Pin Hung
IPC分类号： H01L23/48
CPC分类号： H01L25/0655 , H01L21/31053 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6836 , H01L21/78 , H01L23/3128 , H01L23/49816 , H01L23/5386 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/742 , H01L24/82 , H01L24/92 , H01L24/94 , H01L24/96 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2223/54426 , H01L2224/02311 , H01L2224/0401 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/11002 , H01L2224/11334 , H01L2224/1134 , H01L2224/1184 , H01L2224/12105 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/2101 , H01L2224/211 , H01L2224/214 , H01L2224/215 , H01L2224/24011 , H01L2224/24101 , H01L2224/24137 , H01L2224/244 , H01L2224/24991 , H01L2224/82005 , H01L2224/82106 , H01L2224/8213 , H01L2224/82132 , H01L2224/92 , H01L2224/94 , H01L2924/181 , H01L2924/18162 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2224/82 , H01L2224/11 , H01L2224/19 , H01L2924/00
摘要： A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line over and connected to the stud bump. An electrical connector is over and electrically coupled to the redistribution line.
摘要翻译： 封装包括在管芯的顶表面处具有导电焊盘的芯片，在导电焊盘上方并连接到导电焊盘的柱形凸块，以及重新分配线，并且连接到螺柱凸块。 电连接器在再分配线上电连接。
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公开(公告)号：US20110309647A1
公开(公告)日：2011-12-22
申请号：US12818022
申请日：2010-06-17
申请人： Ku-Feng Yang , Weng-Jin Wu , Jing-Cheng Lin , Wen-Chih Chiou , Chen-Hua Yu
发明人： Ku-Feng Yang , Weng-Jin Wu , Jing-Cheng Lin , Wen-Chih Chiou , Chen-Hua Yu
CPC分类号： H01L21/67346 , H01L21/6838 , H01L21/68785
摘要： An apparatus for supporting a wafer includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween. The gas passage is configured to be sealed by the wafer placed directly over the gas-penetration layer. The apparatus further includes a valve connected to the gas passage.
摘要翻译： 用于支撑晶片的装置包括基座和气体穿透层。 气体渗透层和直接位于气体穿透层下方的基底的一部分在它们之间形成气体通道。 气体通道被直接设置在气体穿透层上方的晶片密封。 该装置还包括连接到气体通道的阀。
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公开(公告)号：US08500182B2
公开(公告)日：2013-08-06
申请号：US12818022
申请日：2010-06-17
申请人： Ku-Feng Yang , Weng-Jin Wu , Jing-Cheng Lin , Wen-Chih Chiou , Chen-Hua Yu
发明人： Ku-Feng Yang , Weng-Jin Wu , Jing-Cheng Lin , Wen-Chih Chiou , Chen-Hua Yu
IPC分类号： B25J15/00
CPC分类号： H01L21/67346 , H01L21/6838 , H01L21/68785
摘要： An apparatus for supporting a wafer includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween. The gas passage is configured to be sealed by the wafer placed directly over the gas-penetration layer. The apparatus further includes a valve connected to the gas passage.
摘要翻译： 用于支撑晶片的装置包括基座和气体穿透层。 气体渗透层和直接位于气体穿透层下方的基底的一部分在它们之间形成气体通道。 气体通道被直接设置在气体穿透层上方的晶片密封。 该装置还包括连接到气体通道的阀。
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公开(公告)号：US20120056315A1
公开(公告)日：2012-03-08
申请号：US12874952
申请日：2010-09-02
申请人： Hsin Chang , Fang Wen Tsai , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng
发明人： Hsin Chang , Fang Wen Tsai , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng
IPC分类号： H01L23/48 , H01L21/768 , H01L23/498
CPC分类号： H01L21/76898 , H01L21/6835 , H01L23/481 , H01L23/49827 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/5442 , H01L2223/54426 , H01L2224/03002 , H01L2224/03912 , H01L2224/0401 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05647 , H01L2224/11002 , H01L2224/1146 , H01L2224/1147 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01327 , H01L2924/14 , H01L2924/04941 , H01L2924/04953 , H01L2924/00
摘要： A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.
摘要翻译： 一种器件包括衬底和包括穿透衬底的导电贯穿衬底通孔（TSV）的对准标记。
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公开(公告)号：US20130020698A1
公开(公告)日：2013-01-24
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11474 , H01L2224/1148 , H01L2224/11616 , H01L2224/11825 , H01L2224/11849 , H01L2224/1191 , H01L2224/13013 , H01L2224/13015 , H01L2224/13018 , H01L2224/13019 , H01L2224/13022 , H01L2224/13023 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1362 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16056 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/81121 , H01L2224/81143 , H01L2224/81193 , H01L2224/81815 , H01L2225/06513 , H01L2225/06555 , H01L2225/06565 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/12 , H01L2924/14 , H01L2924/3512 , H01L2924/35121 , H01L2924/384 , H01L2924/3841 , H01L2924/00014
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
摘要翻译： 提供了一种用于导电柱的系统和方法。 一个实施例包括具有位于其外边缘周围的沟槽的导电柱。 当在导电柱上形成导电凸块时，沟槽用于引导诸如焊料的导电材料。 导电柱然后可以通过导电材料电连接到另一接触件。
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公开(公告)号：US08816498B2
公开(公告)日：2014-08-26
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
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公开(公告)号：US08928159B2
公开(公告)日：2015-01-06
申请号：US12874952
申请日：2010-09-02
申请人： Hsin Chang , Fang Wen Tsai , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng
发明人： Hsin Chang , Fang Wen Tsai , Jing-Cheng Lin , Wen-Chih Chiou , Shin-Puu Jeng
IPC分类号： H01L23/48 , H01L21/683 , H01L21/768 , H01L23/544 , H01L23/00 , H01L23/498
CPC分类号： H01L21/76898 , H01L21/6835 , H01L23/481 , H01L23/49827 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/5442 , H01L2223/54426 , H01L2224/03002 , H01L2224/03912 , H01L2224/0401 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05647 , H01L2224/11002 , H01L2224/1146 , H01L2224/1147 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01327 , H01L2924/14 , H01L2924/04941 , H01L2924/04953 , H01L2924/00
摘要： A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.
摘要翻译： 一种器件包括衬底和包括穿透衬底的导电贯穿衬底通孔（TSV）的对准标记。
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公开(公告)号：US20120104578A1
公开(公告)日：2012-05-03
申请号：US13342583
申请日：2012-01-03
申请人： Hsien-Pin Hu , Chen-Hu Yu , Shin-Puu Jeng , Shang-Yun Hou , Jing-Cheng Lin , Wen-Chih Chiou , Hung-Jung Tu
发明人： Hsien-Pin Hu , Chen-Hu Yu , Shin-Puu Jeng , Shang-Yun Hou , Jing-Cheng Lin , Wen-Chih Chiou , Hung-Jung Tu
IPC分类号： H01L23/495
CPC分类号： H01L21/561 , H01L21/486 , H01L23/147 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/97 , H01L25/0655 , H01L2224/05001 , H01L2224/05027 , H01L2224/05571 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05541 , H01L2224/05005 , H01L2224/05599 , H01L2224/05099
摘要： A method includes providing an interposer wafer including a substrate, and a plurality of through-substrate vias (TSVs) extending from a front surface of the substrate into the substrate. A plurality of dies is bonded onto a front surface of the interposer wafer. After the step of bonding the plurality of dies, a grinding is performed on a backside of the substrate to expose the plurality of TSVs. A plurality of metal bumps is formed on a backside of the interposer wafer and electrically coupled to the plurality of TSVs.
摘要翻译： 一种方法包括提供包括衬底的中介层晶片，以及从衬底的前表面延伸到衬底中的多个贯通衬底通孔（TSV）。 多个管芯结合到插入件晶片的前表面上。 在结合多个模具的步骤之后，在基板的背面进行研磨以暴露多个TSV。 多个金属凸块形成在插入器晶片的背面并电耦合到多个TSV。
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