公开(公告)号：US07754597B2

公开(公告)日：2010-07-13

申请号：US11457505

申请日：2006-07-14

Applicant: Naoyuki Toyoda

Inventor： Naoyuki Toyoda

IPC: H01L21/44 ,  H01L21/31 ,  H01L21/469

CPC classification number: H05K1/111 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85423 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/125 ,  H05K2201/09745 ,  H05K2203/013 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/4554

Abstract: A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47.

Abstract translation: 用于制造接合焊盘45的方法包括：通过液滴喷射方法将包含导电材料的液体的液滴L设置在基板P上，并使所设置的液滴L凝固形成焊盘。 所形成的焊盘45具有圆筒形状，并且包括凹部47。

公开(公告)号：US20100165185A1

公开(公告)日：2010-07-01

申请号：US12719942

申请日：2010-03-09

Applicant: FU-YEN TSENG

Inventor： FU-YEN TSENG

IPC: H04N5/225 ,  H05K1/11

CPC classification number: H05K1/111 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Abstract translation: 电路板组件包括电路板和至少一个电气元件。 电路板包括包括支撑表面的电介质基底和形成在支撑表面上的至少一个连接部分。 所述至少一个电气元件经由连接介质电连接到所述至少一个连接部件。 至少一个排气孔延伸穿过连接部分和电介质基板。 至少一个排气孔构造成从连接介质排出空气。

公开(公告)号：US07729129B2

公开(公告)日：2010-06-01

申请号：US11873445

申请日：2007-10-17

Applicant: Masafumi Shigaki ,  Isao Nakazawa ,  Kazunori Yamanaka

Inventor： Masafumi Shigaki ,  Isao Nakazawa ,  Kazunori Yamanaka

IPC: H05K9/00

CPC classification number: H05K1/021 ,  H01L23/66 ,  H01L25/165 ,  H01L2223/6627 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/19032 ,  H05K1/0203 ,  H05K1/0243 ,  H05K1/142 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0323 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10409

Abstract: In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.

Abstract translation: 在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段中使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和 作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或 更多的螺钉，并且当由于紧固而以10N / cm 2或更大的压力按压时，该片被安装在外壳上。

公开(公告)号：US20100101852A1

公开(公告)日：2010-04-29

申请号：US12646517

申请日：2009-12-23

Applicant: Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

Inventor： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

IPC: H05K1/11

CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

Abstract translation: 本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半，小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

公开(公告)号：US20100099276A1

公开(公告)日：2010-04-22

申请号：US12587978

申请日：2009-10-15

Applicant: Simone Capeleto ,  Christian Hacker

Inventor： Simone Capeleto ,  Christian Hacker

IPC: H01R12/00

CPC classification number: H05K1/148 ,  H05K3/0061 ,  H05K3/361 ,  H05K2201/09027 ,  H05K2201/09745 ,  H05K2201/10106

Abstract: Connecting a first (12) and a second (14) printed circuit board or PCB carrying a LED lighting source (10) and the associated drive circuitry involves providing board connection pads (12a, 14a) at said first (12) and second (14) PCBs, and arranging a flex PCB (16) in a bridge-like fashion between the first (12) and second (14) PCBs. The flex PCB (16) has connection pads (16a) for bonding with the board connection pads (12a, 14a) of the PCBs (12, 14). The connection pads (16a) in the flex PCB (16) arranged in a bridge-like fashion between the first (12) and second (14) PCBs are bonded with the connection pads (12a, 14a) of the first (12) and second (14) PCBs, so that the first (12) and second (14) PCBs are connected.

Abstract translation: 连接携带LED照明源（10）的第一（12）和第二（14）印刷电路板或PCB以及相关联的驱动电路包括在所述第一（12）和第二（14）处提供板连接焊盘（12a，14a） ）PCB，并且在第一（12）和第二（14）PCB之间布置以桥状形式的柔性PCB（16）。 柔性PCB（16）具有用于与PCB（12,14）的板连接焊盘（12a，14a）接合的连接焊盘（16a）。 在第一（12）和第二（14）PCB之间以桥状排列的柔性PCB（16）中的连接焊盘（16a）与第一（12）和第二（14）PCB的连接焊盘（12a，14a） 第二（14）个PCB，使得第一（12）和第二（14）个PCB连接。

公开(公告)号：US07658616B2

公开(公告)日：2010-02-09

申请号：US12328026

申请日：2008-12-04

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and interposer groupings of different height being mounted on a first surface of said carrier plane. Each interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of each hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 包括电绝缘载体平面和不同高度的插入物分组的平面栅格阵列（LGA）插入器结构安装在所述载体平面的第一表面上。 每个插入件在横截面中具有半环形结构并且由介电弹性体材料构成。 多个导电元件围绕每个半环形插入器的表面布置，并且从其最上端向内和向下自由地延伸，与位于电绝缘载体平面相反侧的至少一个部件电接触。

公开(公告)号：US07629269B2

公开(公告)日：2009-12-08

申请号：US11096315

申请日：2005-03-31

Applicant: Cengiz A. Palanduz

Inventor： Cengiz A. Palanduz

IPC: H01L21/31

CPC classification number: H01G4/33 ,  H01G4/1209 ,  H01G4/20 ,  H01L2224/16225 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09309 ,  H05K2201/09745 ,  H05K2203/0568 ,  Y10S977/773

Abstract: A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material comprises columnar grains.

Abstract translation: 一种方法，包括将包含一定量的陶瓷材料的纳米颗粒的胶体悬浮液沉积在基底上; 并对悬浮液进行热处理以形成薄膜。 一种方法，包括将陶瓷材料的多个纳米颗粒沉积在衬底的表面上的预定位置; 并对多个纳米颗粒进行热处理以形成薄膜。 一种包括计算设备的系统，包括微处理器，所述微处理器通过衬底耦合到印刷电路板，所述衬底包括形成在表面上的至少一个电容器结构，所述电容器结构包括第一电极，第二电极和陶瓷 设置在第一电极和第二电极之间的材料，其中陶瓷材料包括柱状晶粒。

公开(公告)号：US20090289360A1

公开(公告)日：2009-11-26

申请号：US12470004

申请日：2009-05-21

Applicant: YOSHIMI TAKAHASHI ,  KENJI MASUMOTO

Inventor： YOSHIMI TAKAHASHI ,  KENJI MASUMOTO

IPC: H01L23/498 ,  H01L21/60 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13023 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/167 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A method of forming an electronic assembly including a plurality of IC die having bonding terminals that have a solderable material thereon and a workpiece. The workpiece includes workpiece contact pads including an elevated ring having a ring height at least 5 μm above a minimum contact pad height in an indented bonding region that is within the elevated ring. The bonding terminals and/or the plurality of workpiece contact pads include solder thereon. A plurality of IC die are mounted on the workpiece. Heat is applied so that the solder becomes tacky while remaining below its melting temperature to obtain a tacked position. The plurality of IC die are pressed using a pressing tool to heat the solder to a peak temperature that is above the melting temperature. The elevated ring resists horizontal movement of the plurality of IC die from their tacked positions during pressing.

Abstract translation: 一种形成电子组件的方法，包括具有在其上具有可焊接材料的接合端子和工件的多个IC管芯。 工件包括工件接触垫，该工件接触焊盘包括在高架环内的凹陷接合区域中具有至少5mum以上的最小接触垫高度的环高度的提升环。 接合端子和/或多个工件接触焊盘在其上包括焊料。 多个IC管芯安装在工件上。 施加热量使得焊料变得发粘，同时保持低于其熔融温度以获得粘合位置。 使用加压工具对多个IC管芯进行加压，将焊料加热到高于熔融温度的峰值温度。 升高的环在压制期间抵抗多个IC芯片从其固定位置的水平移动。

公开(公告)号：US20090196003A1

公开(公告)日：2009-08-06

申请号：US12362670

申请日：2009-01-30

Applicant: Seiya FUJII

Inventor： Seiya FUJII

IPC: H05K7/00 ,  H05K1/11 ,  C23F1/00 ,  H01L21/98 ,  H05K1/16

CPC classification number: H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09745 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a wiring board according to the present invention, a substrate, a solder resist provided on the substrate, a land, a wiring line, and a connection portion connecting the wiring line and the land, the connection portion is provided with a recess as a non-flat portion, and is formed to comprise a width greater than a width of the wiring line and smaller than a width (diameter) of the land, the width of the connection portion being gradually increased from the wiring line toward the land.

Abstract translation: 在根据本发明的布线板中，基板，设置在基板上的阻焊剂，焊盘，布线和连接布线和焊盘的连接部分，连接部分设置有作为 非平坦部分，并且形成为包括大于布线的宽度的宽度并且小于焊盘的宽度（直径），连接部分的宽度从布线向着平台逐渐增加。

公开(公告)号：US20090107710A1

公开(公告)日：2009-04-30

申请号：US11977783

申请日：2007-10-26

Applicant: Joel R. Goergen

Inventor： Joel R. Goergen

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H05K1/0242 ,  H01P3/081 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/098 ,  Y10T29/49126

Abstract: Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

Abstract translation: 公开了电路板及其制造方法。 电路板使用形成为包括纵向通道的导体承载高速信号。 通道增加了导体的表面积，从而增强了导体承载高速信号的能力。 在至少一些实施例中，通道内的介电常数和通道之外的介质常数之间也存在不连续性，这被认为可减少信号损耗。