公开(公告)号：US5162896A

公开(公告)日：1992-11-10

申请号：US652371

申请日：1991-02-07

申请人： Chiaki Takubo ,  Kazutaka Saito ,  Toshio Sudo

发明人： Chiaki Takubo ,  Kazutaka Saito ,  Toshio Sudo

IPC分类号： H01L23/495 ,  H01L23/64 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/64 ,  H01L23/647 ,  H01L2224/16225 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/3011 ,  H05K1/0218 ,  H05K1/118

摘要： A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown. Conductive thin-film wiring lines are formed on an insulative thin-film layer. These thin-film wiring lines include feed-through type signal input wiring lines to be connected to the input terminals of the chip. Each feed-through type signal input wiring line has an inner lead to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor is to be connected. The feed-through type signal input wiring lines have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures.

摘要翻译： 示出了用于安装具有包括信号输入和输出端子的外部连接端子的砷化镓IC芯片的带自动接合基板或TAB基板。 导电薄膜布线形成在绝缘薄膜层上。 这些薄膜布线包括要连接到芯片的输入端的馈通型信号输入布线。 每个馈通型信号输入线路具有内部引线，芯片的对应的信号输入端直接连接到该内部引线，用于接收高速输入信号的端子焊盘以及阻抗匹配电阻器 要连接。 馈通型信号输入布线具有微带信号传输和共面信号传输线结构的复合线结构。

公开(公告)号：US07877871B2

公开(公告)日：2011-02-01

申请号：US12230280

申请日：2008-08-27

申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

IPC分类号： H05K3/02 ,  G03G15/16

CPC分类号： H05K3/207 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2203/0517 ,  H05K2203/105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.

摘要翻译： 图像形成装置包括基于图像信息在光导体上形成静电潜像的曝光单元，通过电路层的形成材料制成的调色剂来显影静电潜像的显影单元和传送调色剂图像的静电转印单元 在光导体上的基片上。 转印调色剂图像以覆盖形成在基板上的导体层的至少一部分。 此时，伴随着调色剂图像的转印开始导致的导体层中引起的过多的电荷被去除。 或者，将与该调色剂相反极性的电荷加到导体层中。 这些允许电路层形成为在导体层上有利地并且牢固地具有期望的图案。

公开(公告)号：US20100025860A1

公开(公告)日：2010-02-04

申请号：US12533492

申请日：2009-07-31

申请人： Kazumasa Tanida ,  Mie Matsuo ,  Masahiro Sekiguchi ,  Chiaki Takubo

发明人： Kazumasa Tanida ,  Mie Matsuo ,  Masahiro Sekiguchi ,  Chiaki Takubo

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01014 ,  H01L2924/01029

摘要： In one aspect of the present invention, a semiconductor device, may include a semiconductor substrate having a first surface and a second surface opposite to the first surface; a through hole in the semiconductor substrate, including an expansion portion which is provided in a vicinity of the first surface so that an opening area of the first opening is greater than an opening area of a lowermost portion of the expansion portion; a first insulating layer on the first surface of the semiconductor substrate; a first wiring layer on the first insulating layer to close the opening of the first insulating layer; a second insulating layer provided on the expansion portion of the through hole; and a second wiring layer on the second insulating layer to extend from inside of the through hole to the second surface of the semiconductor substrate.

摘要翻译： 在本发明的一个方面中，半导体器件可以包括具有第一表面和与第一表面相对的第二表面的半导体衬底; 半导体衬底中的通孔，包括设置在第一表面附近的膨胀部分，使得第一开口的开口面积大于膨胀部分的最下部分的开口面积; 在所述半导体衬底的第一表面上的第一绝缘层; 第一绝缘层上的第一布线层，用于封闭第一绝缘层的开口; 设置在通孔的膨胀部分上的第二绝缘层; 以及在所述第二绝缘层上的从所述通孔的内部延伸到所述半导体衬底的所述第二表面的第二布线层。

公开(公告)号：US20100000083A1

公开(公告)日：2010-01-07

申请号：US12541568

申请日：2009-08-14

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC分类号： H05K3/10 ,  H05K3/20

CPC分类号： H05K3/246 ,  G03G15/6585 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/12097 ,  Y10T428/12104 ,  Y10T428/12111 ,  Y10T428/24917 ,  H01L2924/00

摘要： According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.

摘要翻译： 根据本发明的一种模式，含有含有50重量％以上的热固性树脂的树脂含水率为500〜14500ppm的含金属的树脂粒子和树脂中含有的微细金属粒子是 提供。

公开(公告)号：US20090096051A1

公开(公告)日：2009-04-16

申请号：US12249438

申请日：2008-10-10

申请人： Hitoshi SUGIYAMA ,  Atsuko Yamashita ,  Kazutaka Akiyama ,  Susumu Harada ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Kazumasa Tanida ,  Chiaki Takubo ,  Hiroshi Yoshikawa ,  Akihiro Hori

发明人： Hitoshi SUGIYAMA ,  Atsuko Yamashita ,  Kazutaka Akiyama ,  Susumu Harada ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Kazumasa Tanida ,  Chiaki Takubo ,  Hiroshi Yoshikawa ,  Akihiro Hori

IPC分类号： H01L31/0216 ,  H01L31/18

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014

摘要： A solid state imaging device includes: an imaging device substrate with an imaging device section formed on a first major surface side thereof; a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface; a circuit substrate provided with a circuit substrate electrode opposed to the second major surface; a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode; and a light shielding layer provided coplanar with the backside interconnect electrode or on the circuit substrate side of the backside interconnect electrode.

摘要翻译： 固态成像装置包括：具有形成在其第一主表面侧的成像装置部分的成像装置基板; 设置在成像器件基板的第二主表面侧并电连接到成像器件部分的背面互连电极，第二主表面在第一主表面的相对侧上; 电路基板，设置有与第二主表面相对的电路基板电极; 连接部，其将所述背面侧配线电极与所述电路基板电极电连接; 以及与背面配线电极共同设置的遮光层，或背面配线电极的电路基板侧。

公开(公告)号：US20080265443A1

公开(公告)日：2008-10-30

申请号：US12213766

申请日：2008-06-24

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L23/28

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07405159B2

公开(公告)日：2008-07-29

申请号：US11712373

申请日：2007-03-01

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/302

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US06977130B2

公开(公告)日：2005-12-20

申请号：US10618631

申请日：2003-07-15

申请人： Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

发明人： Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

IPC分类号： H01L21/28 ,  G03G5/05 ,  G03G9/09 ,  G03G13/26 ,  H01L21/288 ,  H01L21/3205 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46 ,  G03G13/16 ,  B05D1/04 ,  H05C1/00

CPC分类号： H05K3/4664 ,  G03G5/056 ,  G03G9/0926 ,  G03G13/26 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15787 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0425 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0537 ,  H01L2924/00

摘要： A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.

摘要翻译： 提供了一种制造满足成本降低，多样化的小批量生产和更短的设计，制造，评估和校正周期的电子电路的方法。 该方法包括至少形成第一图案或形成第二图案。 形成第一图案包括：通过基本上由树脂制成的带电粒子的粘附在形成在感光基底上的静电潜像上形成可见图像; 通过可见图像的接触和加压将可见图像转印到中间转印基底上; 在中间转移基体上加热/软化; 并通过树脂层的接触和加压将加热/软化的树脂层转移到基材上。 在形成第二图案时，使用含有导电金属微粒的带电粒子，在与第一图案形成类似地转移含金属的树脂图案之后，通过无电镀形成导体金属层。

公开(公告)号：US20050253247A1

公开(公告)日：2005-11-17

申请号：US10885138

申请日：2004-07-07

申请人： Takashi Imoto ,  Chiaki Takubo

发明人： Takashi Imoto ,  Chiaki Takubo

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/60 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18

CPC分类号： H01L24/34 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof, and the semiconductor element being electrically connected to at least the one first interconnection and mounted on the one major surface, a sealing member being provided on the one major surface of the chip mounting base and covering the semiconductor element and the first interconnection, at least one third interconnection being provided on a surface of the sealing member, and at least one fourth interconnection being provided in the sealing member and the chip mounting base, and electrically connected to the first interconnection, the second interconnection, and the third interconnection.

摘要翻译： 公开了一种包括至少一个半导体元件的半导体器件，一个芯片安装基座在其一个主表面上设置有至少一个第一互连件和在其另一个主表面上的至少一个第二互连件，并且该半导体元件电连接到 至少一个第一互连并且安装在所述一个主表面上，密封构件设置在所述芯片安装基座的所述一个主表面上并且覆盖所述半导体元件和所述第一互连，至少一个第三互连设置在 所述密封构件和至少一个第四互连件设置在所述密封构件和所述芯片安装基座中，并且电连接到所述第一互连，所述第二互连和所述第三互连。

公开(公告)号：US20050212145A1

公开(公告)日：2005-09-29

申请号：US11088879

申请日：2005-03-25

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L23/532

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装半导体元件的安装衬底以及用树脂密封半导体元件的至少表面侧的树脂层。