公开(公告)号：US10217637B1

公开(公告)日：2019-02-26

申请号：US15709876

申请日：2017-09-20

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Qianwen Chen ,  Bing Dang ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker

IPC: H01L21/20 ,  B24B7/22 ,  H01L21/683 ,  H01L23/498

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

公开(公告)号：US20180350768A1

公开(公告)日：2018-12-06

申请号：US16057434

申请日：2018-08-07

Applicant: International Business Machines Corporation

Inventor： William E. BERNIER ,  Bing Dang ,  Mario J. Interrante ,  John U. Knickerbocker ,  Son K. Tran

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/60 ,  H01L25/065 ,  H01L23/367

CPC classification number: H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

公开(公告)号：US20180348259A1

公开(公告)日：2018-12-06

申请号：US16040621

申请日：2018-07-20

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC: G01R1/073 ,  H01L23/00 ,  B81C1/00 ,  G01R31/26 ,  B81B3/00 ,  B23K35/00

CPC classification number: G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

Abstract: A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

公开(公告)号：US20180135197A1

公开(公告)日：2018-05-17

申请号：US15851846

申请日：2017-12-22

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  Yu Luo ,  Joana Sofia Branquinho Teresa Maria

IPC: C25D7/04 ,  H01L21/288 ,  B23K35/26 ,  C25D17/12 ,  C25D3/60 ,  C25D3/30 ,  C25D3/54 ,  C25D5/02

CPC classification number: C25D7/04 ,  B23K35/26 ,  B23K35/262 ,  C25D3/30 ,  C25D3/54 ,  C25D3/60 ,  C25D5/02 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  H01L21/2885 ,  H01L23/147

Abstract: A method provides a structure that includes a substrate having a metal layer disposed on a surface and a metal feature disposed on the metal layer. The method further includes immersing the structure in a plating bath contained in an electroplating cell, the plating bath containing a selected solder material; applying a voltage potential to the structure, where the structure functions as a working electrode in combination with a reference electrode and a counter electrode that are also immersed in the plating bath; and maintaining the voltage potential at a predetermined value to deposit the selected solder material selectively only on the metal feature and not on the metal layer. An apparatus configured to practice the method is also disclosed.

公开(公告)号：US09937124B2

公开(公告)日：2018-04-10

申请号：US14483278

申请日：2014-09-11

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61K9/00 ,  A61M31/00 ,  A61M5/142 ,  A61M5/44 ,  A61N1/04

CPC classification number: A61K9/0097 ,  A61M31/002 ,  A61M2205/0244 ,  A61N1/0428 ,  A61N1/0444 ,  A61N1/0448

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US09897627B2

公开(公告)日：2018-02-20

申请号：US15469501

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: G01R1/067 ,  G01R31/00 ,  G01R1/04 ,  H01L21/66 ,  H01L23/498

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US09893047B2

公开(公告)日：2018-02-13

申请号：US15490377

申请日：2017-04-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  John Knickerbocker

IPC: H01L21/66 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/683 ,  H01L25/16 ,  H01L25/18 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L25/07

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

Abstract: Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US09867932B2

公开(公告)日：2018-01-16

申请号：US14928546

申请日：2015-10-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U Knickerbocker ,  Joana S. B. T. Maria ,  Bucknell C Webb ,  Steven L Wright

IPC: A61M5/168 ,  A61M5/142 ,  A61M5/44 ,  A61M5/172

CPC classification number: A61M5/16804 ,  A61M5/14276 ,  A61M5/172 ,  A61M5/44 ,  A61M2205/0244 ,  A61M2205/04 ,  A61M2205/332 ,  A61M2205/3561 ,  A61M2205/50 ,  A61M2207/00

Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

公开(公告)号：US20170221872A1

公开(公告)日：2017-08-03

申请号：US15490377

申请日：2017-04-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  John Knickerbocker

IPC: H01L25/00 ,  H01L21/66 ,  H01L21/78 ,  H01L25/18 ,  H01L25/16 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

Abstract: Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US20170194225A1

公开(公告)日：2017-07-06

申请号：US14984227

申请日：2015-12-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Jae-Woong Nah ,  Robert John Polastre

IPC: H01L23/31 ,  H01L21/786 ,  H01L23/15

CPC classification number: H05K5/0095 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H05K5/0247 ,  H05K5/04

Abstract: A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurality of electronic devices having a top surface and a plurality of sides. A hermetic sealant is applied to each electronic device to completely encase the top surface and the sides while bonding to the base layer. At least one of the layers is a metallization layer formed by metal deposition. Full metallization may be applied over the entire wafer and a pattern subsequently transferred to the full metallization by one of laser and chemical etching. The electronic device may further include at least one electronic component attached to one of the layers and encased by the hermetic sealant.