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    LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS
    63.
    发明申请
    LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS 有权
    低电压组件与电线互连

    公开(公告)号：US20150348873A1

    公开(公告)日：2015-12-03

    申请号：US14289860

    申请日：2014-05-29

    Applicant: INVENSAS CORPORATION

    Inventor： Rajesh Katkar ,  Cyprian Emeka Uzoh

    IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768

    CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/43 ,  H01L24/46 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/023 ,  H01L2224/4502 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A component such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects of wire bond structure. Such method may include forming a structure having wire bonds extending in an axial direction within one of more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”). First contacts can then be provided at a first surface of the component and second contacts provided at a second surface of the component facing in a direction opposite from the first surface, the first contacts electrically coupled with the second contacts through the wire bonds.

    Abstract translation: 诸如插入件或微电子元件的部件可以用一组垂直延伸的引线接合结构的互连件制造。 这种方法可以包括形成具有线性结合的结构，所述线接合在元件中的多个开口之一内沿轴向延伸，并且每个引线键至少部分地与其延伸的开口的壁间隔开，所述元件基本上由材料 具有小于10摄氏度（“ppm /℃”）的百万分之几的热膨胀系数（“CTE”）。 然后可以在部件的第一表面处提供第一触点，并且提供在部件的第二表面处的面向第一表面的方向的第二触点，第一触头通过引线接合与第二触点电耦合。

    CAPACITORS USING POROUS ALUMINA STRUCTURES
    65.
    发明申请
    CAPACITORS USING POROUS ALUMINA STRUCTURES 审中-公开
    使用多孔氧化铝结构的电容器

    公开(公告)号：US20150270069A1

    公开(公告)日：2015-09-24

    申请号：US14733269

    申请日：2015-06-08

    Applicant: Invensas Corporation

    Inventor： Rajesh Katkar ,  Cyprian Emeka Uzoh

    IPC: H01G4/33 ,  H01G4/38 ,  H01G4/08

    CPC classification number: H01G4/33 ,  H01G4/01 ,  H01G4/08 ,  H01G4/10 ,  H01G4/385 ,  H01L28/60 ,  H01L28/92 ,  H01M4/80

    Abstract: Capacitors and methods of making the same are disclosed herein. In one embodiment, a capacitor comprises a structure having first and second oppositely facing surfaces and a plurality of pores each extending in a first direction from the first surface towards the second surface, and each having pore having insulating material extending along a wall of the pore; a first conductive portion comprising an electrically conductive material extending within at least some of the pores; and a second conductive portion comprising a region of the structure consisting essentially of aluminum surrounding individual pores of the plurality of pores, the second conductive portion electrically isolated from the first conductive portion by the insulating material extending along the walls of the pores.

    Abstract translation: 电容器及其制造方法在此公开。 在一个实施例中，电容器包括具有第一和第二相对面的表面和多个孔，每个孔从第一表面朝向第二表面沿第一方向延伸，并且每个孔具有沿孔的壁延伸的绝缘材料 ; 第一导电部分，包括在至少一些孔内延伸的导电材料; 以及第二导电部分，其包括主要由围绕所述多个孔的单个孔的铝构成的结构的区域，所述第二导电部分通过沿着所述孔的壁延伸的绝缘材料与所述第一导电部分电隔离。

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