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    WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME
    62.
    发明申请
    WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME 有权
    接线板和安装结构，包括它们

    公开(公告)号：US20150296613A1

    公开(公告)日：2015-10-15

    申请号：US14646065

    申请日：2013-11-13

    申请人： KYOCERA CORPORATION

    发明人： Takeshi Matsui ,  Katsura Hayashi

    IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

    CPC分类号： H05K1/0306 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09036

    摘要： According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.

    摘要翻译： 根据本发明的一个方面，布线板包括无机绝缘层和设置在无机绝缘层的一个主表面的一部分上的导电层。 无机绝缘层的一个主表面的一部分包括在平面图中至少部分为圆形的多个第一凹部。 导电层的一部分进入多个第一凹部。 根据本发明的一个方面，可以获得能够减少导电层的断开并因此具有优异的电可靠性的布线基板。

    Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board
    63.
    发明授权
    Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board 有权
    多层印刷电路板，更具体地是阻燃和/或防烟多层印刷电路板

    公开(公告)号：US09161431B2

    公开(公告)日：2015-10-13

    申请号：US13381454

    申请日：2010-06-25

    申请人： Ronald Frosch ,  Manfred Riedler

    发明人： Ronald Frosch ,  Manfred Riedler

    IPC分类号： H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  H05K3/34

    CPC分类号： H05K1/02 ,  H05K1/0298 ,  H05K1/0373 ,  H05K3/3452 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/0989

    摘要： In the case of a multilayered printed circuit board (20), more particularly a flame-resistant and/or smoke-suppressing multilayered printed circuit board, consisting of a plurality of interconnected layers (2, 3, 12, 13) composed of incombustible, conductive material and layers (1, 11) composed of non-conductive material, two layers (2, 3, 12) composed of a conductive material in each case being separated by at least one layer (1, 11) composed of a non-conductive material, it is provided that the printed circuit board (20) contains in its interior at least two layers (2, 3, 12) having a surface proportion of at least 50%, more particularly at last 70%, composed of the incombustible, conductive material, as a result of which a multilayered printed circuit board (20) having improved flame resistance and reduced smoke evolution can be made available.

    摘要翻译： 在多层印刷电路板（20）的情况下，更特别地，由多个互不连续的层（2,3,12,13）组成的阻燃和/或防烟多层印刷电路板， 导电材料和由非导电材料构成的层（1,11），由每种情况由导电材料组成的两层（2,3,12）由至少一层由非金属材料构成的层（1,11）隔开， 导电材料，其中印刷电路板（20）在其内部包含至少两层（2,3，12），其表面比例至少为50％，更特别地至少为70％，由不可燃的 导电材料，由此可以获得具有改进的阻燃性和减少的烟雾逸出的多层印刷电路板（20）。

    INTEGRATED PHOTOSENSITIVE FILM AND THIN LED DISPLAY
    66.
    发明申请
    INTEGRATED PHOTOSENSITIVE FILM AND THIN LED DISPLAY 有权
    集成感光膜和薄型LED显示屏

    公开(公告)号：US20150221807A1

    公开(公告)日：2015-08-06

    申请号：US14172352

    申请日：2014-02-04

    申请人： Raytheon Company

    发明人： Michael H. Robson ,  Michael T. Pace

    IPC分类号： H01L31/173 ,  H05B33/08 ,  H01L31/18

    CPC分类号： H01L31/18 ,  H05K1/0286 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/10106 ,  Y02B20/346 ,  Y02P70/521

    摘要： A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways are described. The system includes a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosentive layer and configure the conductive pathway in the photosensitive layer according to the image

    摘要翻译： 描述了配置导电路径的系统和形成可配置导电通路系统的方法。 该系统包括基于光激发而变为导电的感光层和沉积在感光层上的光源层，光源层选择性地向光敏层提供光激发。 该系统还包括控制光源层的控制器，控制器照射与用户输入图像相对应的光源层的一部分以对光敏层进行光刺激，并根据图像配置感光层中的导电通路

    INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE
    67.
    发明申请
    INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE 有权
    绝缘树脂材料和多层基材

    公开(公告)号：US20150210884A1

    公开(公告)日：2015-07-30

    申请号：US14425367

    申请日：2013-09-03

    申请人： SEKISUI CHEMICAL CO., LTD.

    发明人： Tatsushi Hayashi ,  Tomoki Kunikawa ,  Reona Yokota ,  Daisuke Tottori ,  Kazutaka Shirahase

    IPC分类号： C09D163/00 ,  C08K9/06 ,  H05K1/03

    CPC分类号： C09D163/00 ,  C08G59/423 ,  C08G59/686 ,  C08G2650/56 ,  C08K3/36 ,  C08K5/5419 ,  C08K9/06 ,  C08K2201/014 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0373 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0239

    摘要： Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer.The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)−SP(B)) is not smaller than 0.5 but not larger than 3.5.

    摘要翻译： 提供了能够降低固化物体的表面的表面粗糙度的绝缘性树脂材料，并且当在固化物体的表面上形成金属层时，增加了固化物和金属层之间的粘合强度。 本发明的绝缘树脂材料包括热固性树脂，固化剂，用第一硅烷偶联剂表面处理的第一无机填料和用第二硅烷偶联剂表面处理的第二无机填料。 当含量最多的热固性树脂和第一硅烷偶联剂的有机基团的SP值之间的绝对差定义为SP（A）时，当绝热含量最高的热固性树脂的SP值与有机物 第二硅烷偶联剂组被定义为SP（B）; （SP（A）-SP（B））不小于0.5但不大于3.5。

    Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods
    69.
    发明授权
    Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods 有权
    用于在高介电膜中形成电连接的氟化银糊剂及相关产品和方法

    公开(公告)号：US09085051B2

    公开(公告)日：2015-07-21

    申请号：US12662047

    申请日：2010-03-29

    申请人： Jemssy Alvarez

    发明人： Jemssy Alvarez

    IPC分类号： H01B1/00 ,  H01B1/12 ,  B23K35/36 ,  B23K35/30 ,  H05B3/86 ,  H05K1/09 ,  H01B1/02 ,  H01B1/22 ,  B05D5/06 ,  C03C17/00 ,  G02B1/10 ,  B60L1/02 ,  H05K3/40

    CPC分类号： B23K35/36 ,  B23K35/3006 ,  B23K35/3605 ,  H05B3/86 ,  H05B2203/016 ,  H05K1/092 ,  H05K3/4007 ,  H05K3/4061 ,  H05K2201/0209

    摘要： Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by one or more strong dielectric layers, and/or methods of making the same. Certain example embodiments include a chemically modified silver paste that may be cured or fired using a standard glass tempering furnace (e.g., an electrical or gas-fuelled furnace) or a short-wave infrared heating process at temperatures below 750 degrees C. In certain example embodiments, the fluorine causes apertures or micro-factures in the dielectric layer(s), which allows the silver in the paste to move therethrough (e.g., by capillary action) to form a contact with the conductive layer(s).

    摘要翻译： 本发明的某些示例性实施例涉及能够与层叠中的至少一个导电层进行电连接的银浆，即使在至少一个导电层被一个或多个强电介质层保护的情况下，和/或 制作相同的方法 某些示例性实施方案包括可以在低于750℃的温度下使用标准玻璃回火炉（例如电气或气体燃料炉）或短波红外加热方法固化或烧制的化学改性的银浆。在某些实施例中 在实施方案中，氟引起电介质层中的孔或微生物，其允许糊料中的银通过其移动（例如通过毛细作用）以形成与导电层的接触。