公开(公告)号：US06330159B1

公开(公告)日：2001-12-11

申请号：US09606972

申请日：2000-06-28

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片

公开(公告)号：US06292368B1

公开(公告)日：2001-09-18

申请号：US09521231

申请日：2000-03-08

Applicant: Denis Pradel

Inventor： Denis Pradel

IPC: H01L2302

CPC classification number: H05K1/021 ,  H01L23/367 ,  H01L23/49855 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/77272 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/10659 ,  H05K2201/10674 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrical power component is provided with electrodes including, on one of the faces of the component, a single electrode, the electrodes being connectable by brazing to an electrical connection support by means of an electrical and thermal connection plate.

Abstract translation: 电力部件设置有电极，其包括在部件的一个面上的单个电极，电极可通过电连接板和热连接板通过钎焊连接到电连接支撑件。

公开(公告)号：US06188578B1

公开(公告)日：2001-02-13

申请号：US09379599

申请日：1999-08-24

Applicant: Po-Yao Lin ,  Ching-Bai Hwang

Inventor： Po-Yao Lin ,  Ching-Bai Hwang

IPC: H05K720

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K3/3421 ,  H05K2201/10659 ,  H05K2201/10674

Abstract: An integrated circuit package has a printed circuit board, a die mounted on the printed circuit board, and a heat spreader attached to the printed circuit board to cover the die and contact with the backside of the die. The heat spreader is formed by a piece body and a plurality of supporting leads extended downward from the periphery of the piece body. The supporting leads of the heat spreader are attached to the printed circuit board by surface mounting technology. The piece body of the heat spreader abuts on the backside of the die so that heat from the die can be conducted both upward to the outer environment and downward to the printed circuit board through the heat spreader, thereby enhancing the heat dissipation efficiency.

Abstract translation: 集成电路封装具有印刷电路板，安装在印刷电路板上的管芯，以及附着在印刷电路板上以覆盖管芯并与管芯背面接触的散热器。 散热器由片体和从片体的周边向下延伸的多个支撑引线形成。 散热器的支撑引线通过表面贴装技术连接到印刷电路板。 散热器的主体靠在模具的背面，使得来自模具的热量可以通过散热器向上到外部环境并向下传播到印刷电路板，从而提高散热效率。

公开(公告)号：US6061242A

公开(公告)日：2000-05-09

申请号：US257567

申请日：1999-02-25

Applicant: David J. Corisis ,  Walter L. Moden

Inventor： David J. Corisis ,  Walter L. Moden

IPC: H01L23/495 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K3/303 ,  H01L23/49568 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: A semiconductor device having a die paddle and a die disposed on the die paddle. The die paddle serves as a heat dissipation device and the die paddle is partially and/or fully encapsulated by a package body. Thermal posts extend from the die paddle to direct heat from the semiconductor device to a printed circuit board and further provide stability and alignment during placement of the semiconductor device on the printed circuit board.

Abstract translation: 一种半导体器件，具有裸片和芯片上的裸片。 管芯焊盘用作散热装置，并且管芯焊盘部分地和/或完全被封装主体封装。 散热柱从模板延伸，以将热量从半导体器件引导到印刷电路板，并且在将半导体器件放置在印刷电路板上时进一步提供稳定性和对准。

公开(公告)号：US5898575A

公开(公告)日：1999-04-27

申请号：US710573

申请日：1996-09-19

Applicant: Emily Hawthorne ,  John McCormick

Inventor： Emily Hawthorne ,  John McCormick

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K7/02

CPC classification number: H05K3/301 ,  H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.

Abstract translation: 承载多个导电引线的薄介电基片具有由基板限定的孔，其中定位有具有焊盘的管芯，该焊盘接合到由衬底承载的引线的端部并突出到与管芯焊盘接触的孔中。 引线包括自由的外端，其横向向外和向下突出离开基板的平面，以连接到电路板上的接触焊盘。 在通过薄的自支撑导热散热器连接到电路板上之后，自由导线与带组件上的芯片之间的压力隔离开，该散热器接触与其焊盘相对的模具的侧面并且包括固定的支架 /或延伸穿过薄基板中的对准孔并与印刷电路板的冲浪物理接触的定位销。 该布置使得能够将施加到散热器的力直接传递到电路板，从而将模具，薄基板及其脆弱的自由导线与施加到模具和/或散热器的力隔离。

公开(公告)号：US5490040A

公开(公告)日：1996-02-06

申请号：US172467

申请日：1993-12-22

Applicant: Gene J. Gaudenzi ,  Joseph M. Mosley ,  Vito J. Tuozzolo ,  John C. Milliken

Inventor： Gene J. Gaudenzi ,  Joseph M. Mosley ,  Vito J. Tuozzolo ,  John C. Milliken

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34 ,  H01R9/09 ,  B23K31/02 ,  H01L23/48

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/49816 ,  H05K3/3415 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K3/3447 ,  Y02P70/613

Abstract: An electrical device for logic circuits having a package comprising a combination of controlled collapse electrical interconnections, such as solder balls and pin through-hole conductors, wherein the conductors are disposed outside the perimeter of an inter-array of solder balls, which when a maximum number of solder balls are disposed, the array is circular in shape, so as to provide an increased footprint for the electrical device beyond that, otherwise maximum footprint for solder balls alone, which footprint is otherwise limited in size due to failures which occur in solder balls when solder balls are exposed to thermal and mechanical stress levels at extended distances from the neutral or zero stress point of the array.

Abstract translation: 一种用于逻辑电路的电子装置，其具有包括诸如焊球和销通孔导体的受控塌缩电互连的组合的封装，其中所述导体设置在焊球间排列的周边之外，当最大值 焊球的数量被设置，该阵列的形状是圆形的，以便为电气设备提供增加的占地面积，否则最大限度地限制焊球的尺寸，否则由于焊料中发生的故障而限制了其尺寸 当焊球暴露于与阵列的中性点或零应力点相距较远距离的热和机械应力水平时的球。

公开(公告)号：US5475261A

公开(公告)日：1995-12-12

申请号：US164784

申请日：1993-12-10

Applicant: Tetsu Tanizawa

Inventor： Tetsu Tanizawa

IPC: H01L21/60 ,  H01L23/04 ,  H01L23/057 ,  H01L23/498 ,  H05K3/34 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L29/41

CPC classification number: H01L24/73 ,  H01L23/04 ,  H01L23/057 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/81 ,  H05K3/3415 ,  H05K3/3426 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K3/3421 ,  H05K3/3447 ,  Y02P70/613

Abstract: A semiconductor device includes a predetermined number of surface mount first lead pins (14), arranged around the periphery of the underside of a package (13) fitted with a chip (11). A predetermined number of second lead pins (22, 41), each having a specific function, are provided in a region near the center of the underside of the package (13) inside of the region populated with the first lead pins (14).

Abstract translation: 半导体器件包括预定数量的表面安装的第一引线引脚（14），其布置在装配有芯片（11）的封装（13）的下侧的周边周围。 每个具有特定功能的预定数量的第二引线引脚（22,41）设置在安装有第一引脚（14）的区域内部的封装（13）的下侧附近的区域中。

公开(公告)号：US5420755A

公开(公告)日：1995-05-30

申请号：US90141

申请日：1993-07-15

Applicant: Peter Hiller

Inventor： Peter Hiller

IPC: H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046

Abstract: A circuit board with electrical components in which the components are inserted with their insulated bodies into through bores of the circuit board, slightly protruding from the underside and top of the board, and having contact surfaces which are soldered to a strip conductor. The lower ends of the components terminate in a hemispherical cup or rounded conical tip and have at least one lower contact surface protruding into the strip conductor and soldered to it. The upper ends of the components comprise a plurality of upper contact surfaces insulated from each other and connected to a plurality of contact elements protruding from the component body. The contact elements are connected at a distance around the bores to the strip conductor on top of the circuit board by soldering paste.

Abstract translation: PCT No.PCT / FR91 / 00648 Sec。 371日期：1993年7月15日 102（e）日期1993年7月15日PCT 1991年9月15日PCT PCT。 WO92 / 03901 PCT出版物 日期：1992年3月5日。具有电气部件的电路板，其中部件通过其绝缘体插入电路板的通孔中，从电路板的下侧和顶部略微突出，并具有焊接到 带状导体。 组件的下端终止于半球形杯或圆锥形尖端，并且具有突出到带状导体中并焊接到其上的至少一个下接触表面。 部件的上端包括多个彼此绝缘的上接触表面，并且连接到从组件主体突出的多个接触元件。 接触元件通过焊膏在孔周围一定距离连接到电路板顶部的带状导体。

公开(公告)号：US5296652A

公开(公告)日：1994-03-22

申请号：US876192

申请日：1992-04-30

Applicant: Grady A. Miller, Jr.

Inventor： Grady A. Miller, Jr.

IPC: H05K3/32 ,  H05K7/10 ,  H02B1/00

CPC classification number: H05K3/325 ,  H01R12/714 ,  H05K7/1084 ,  H05K2201/10378 ,  H05K2201/10659 ,  H05K2201/10719 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156

Abstract: A method and apparatus are provided for mounting a circuit component such as a gate array device 12 on a printed circuit board 14. The component 12 may include a plurality of pin-type electrical contacts 18 wherein a first portion of the pin-type contacts 18 have been replaced by button-type contacts. In one embodiment, at least two of the pin-type contacts 22, 24 have been retained and serve the dual purpose of locating the gate array device 12 on the printed circuit board 14 and attaching the gate array device 12 to the printed circuit board 14. A sheet of boron nitride 26 is positioned between the printed circuit board 14 and the circuit component, e.g., the gate array device 12. The sheet of boron nitride 26 includes a plurality of openings extending therethrough in a pattern corresponding to the pattern of electrical contacts 18 on the gate array device 12. The openings 32 in the sheet of boron nitride 26 that correspond to the button-type contacts have resilient electrical contacts 34 disposed therein. The printed circuit board 14 includes a plurality of pad-type contacts 40 disposed on a surface thereof in a pattern corresponding to the button-type contacts of the gate array device 12.

Abstract translation: 提供了一种用于将诸如门阵列器件12的电路部件安装在印刷电路板14上的方法和装置。部件12可以包括多个针式电触点18，其中销型触点18的第一部分 已被按钮式联系人取而代之。 在一个实施例中，已经保持了至少两个销型触点22,24，并且用于将栅极阵列器件12定位在印刷电路板14上并将栅阵列器件12附接到印刷电路板14的两个目的 一块氮化硼26位于印刷电路板14和电路部件（例如栅极阵列器件12）之间。氮化硼片26包括以对应于电气图案的图案的方式延伸穿过其中的多个开口 触点18在栅极阵列器件12上。氮化硼片26中对应于按钮式触点的开口32具有布置在其中的弹性电触点34。 印刷电路板14包括以对应于门阵列器件12的按钮型触点的图案设置在其表面上的多个焊盘型触点40。

公开(公告)号：US5155905A

公开(公告)日：1992-10-20

申请号：US695206

申请日：1991-05-03

Applicant: Grady A. Miller, Jr.

Inventor： Grady A. Miller, Jr.

IPC: H05K3/32 ,  H05K7/10

CPC classification number: H05K3/325 ,  H01R12/714 ,  H05K7/1084 ,  H05K2201/10378 ,  H05K2201/10659 ,  H05K2201/10719 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156

Abstract: A method and apparatus are provided for mounting a gate array device 12 on a printed circuit board 14. The device 12 includes at least two pin-type electrical contacts 22, 24 and a plurality of button-type contacts. A sheet of boron nitride 26 is positioned between the printed circuit 14 and the gate array device 12. The sheet of boron nitride 26 includes a plurality of openings extending therethrough in a pattern corresponding to the pattern of electrical contacts 18 on the gate array device 12. The openings 32 in the sheet of boron nitride 26 have resilient electrical contacts 34 disposed therein. The printed circuit board 14 includes a plurality of button-type contacts 40 disposed on a surface thereof in a pattern corresponding to the button-type contacts of the gate array device 12 and the resilient electrical contacts 34.

Abstract translation: 提供了一种用于将栅极阵列器件12安装在印刷电路板14上的方法和装置。器件12包括至少两个引脚型电触点22,24和多个按钮型触点。 一块氮化硼26位于印刷电路14和栅极阵列器件12之间。氮化硼片26包括多个开口，以对应于门阵列器件12上的电触点图案的图案延伸穿过 氮化硼片26中的开口32具有布置在其中的弹性电触点34。 印刷电路板14包括多个按钮型触点40，其以与门阵列器件12和弹性电触头34的按钮型触点相对应的图案设置在其表面上。