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    CARRIER SUBSTRATE
    84.
    发明申请
    CARRIER SUBSTRATE 审中-公开

    公开(公告)号：US20170223841A1

    公开(公告)日：2017-08-03

    申请号：US15488519

    申请日：2017-04-17

    申请人： Unimicron Technology Corp.

    发明人： Chun-Ting Lin

    IPC分类号： H05K3/40 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673 ,  H05K1/11

    摘要： A carrier substrate includes a circuit structure layer, a first solder resist layer, a second solder resist layer and conductive towers. The circuit structure layer includes a core structure layer, a first circuit layer and a second circuit layer. The first solder resist layer has first openings exposing a portion of the first circuit layer. The second solder resist layer has second openings exposing a portion of the second circuit layer. The conductive towers are disposed at the first openings, higher than a surface of the first solder resist layer and connected with the first openings exposed by the first circuit layer, wherein a diameter of each of the conductive towers gradually increases by a direction from away-from the first openings towards close-to the first openings. A diameter of the second conductive towers is greater than that of the first conductive towers.

    CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
    88.
    发明申请
    CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20170164468A1

    公开(公告)日：2017-06-08

    申请号：US14997583

    申请日：2016-01-18

    申请人： UNIMICRON TECHNOLOGY CORP.

    发明人： HUNG-LIN CHANG ,  MING-HAO WU ,  SYUN-SIAO CHANG ,  CHENG-PO YU ,  CHI-MIN CHANG

    IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/11

    CPC分类号： H05K3/4697 ,  H05K3/4644

    摘要： A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    Optical-electro circuit board
    89.
    发明授权
    Optical-electro circuit board 有权
    光电电路板

    公开(公告)号：US09581774B2

    公开(公告)日：2017-02-28

    申请号：US15164878

    申请日：2016-05-26

    申请人： Unimicron Technology Corp.

    发明人： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

    IPC分类号： G02B6/43 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/32

    CPC分类号： G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

    摘要： An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

    摘要翻译： 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。