Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof
    82.
    发明申请
    Heat transfer device with at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof 有权
    具有至少一个半导体元件,特别是激光或发光二极管元件的传热装置及其组装方法

    公开(公告)号:US20110142087A1

    公开(公告)日:2011-06-16

    申请号:US12995999

    申请日:2009-06-02

    IPC分类号: H01S3/042 H01L33/64 H01J9/227

    摘要: The invention relates, among other things, to a method for the assembly of a semiconductor component, wherein the semiconductor component on mutually opposing sides is joined in a first and a second bonded connection with a heat-conducting body each. For this purpose, the heat-conducting bodies are joined in a third bonded connection in the region of the sections thereof extending away from the semiconductor element, wherein a spacer, which with regard to the third connection is disposed on the opposite side of the semiconductor component between the heat-conducting bodies, in conjunction with the requirement that the joining zone thickness of the third connection is greater than that of the first or the second joining zone, ensures that defined joining zone thicknesses in the bonded connection are maintained during the joining process. The third connection is used for the at least partial heat transfer of the waste heat of the semiconductor component, particularly to a heat sink that is connected to the heat transfer device produced according to the invention.

    摘要翻译: 本发明尤其涉及一种用于组装半导体部件的方法,其中相互相对的侧面上的半导体部件与每个导热体在第一和第二接合连接中接合。 为此,导热体在其远离半导体元件的部分的区域中以第三接合连接接合,其中相对于第三连接的间隔件设置在半导体的相对侧上 导热体之间的部件与第三连接件的接合区域厚度大于第一连接区域或第二接合区域的连接区域厚度的要求确保了在接合期间保持接合连接中限定的接合区域厚度 处理。 第三连接用于半导体部件的废热的至少部分热传递,特别是用于连接到根据本发明生产的传热装置的散热器。

    HIGH-POWER SEMICONDUCTOR LASER AND METHOD FOR MANUFACTURING THE SAME
    84.
    发明申请
    HIGH-POWER SEMICONDUCTOR LASER AND METHOD FOR MANUFACTURING THE SAME 有权
    大功率半导体激光器及其制造方法

    公开(公告)号:US20110128987A1

    公开(公告)日:2011-06-02

    申请号:US13056137

    申请日:2009-12-28

    申请人: Xingsheng Liu

    发明人: Xingsheng Liu

    IPC分类号: H01S5/022 H01L21/50

    摘要: A high-power semiconductor laser includes a support block, an anode metal plate, a cathode metal plate and a chip. The support block has a step, and the two ends of the support block have bosses, in which there are screw holes. The chip is welded to an insulation plate, which is attached to the support block. The anode metal plate and the cathode metal plate are, respectively, welded with an anode insulation plate and a cathode insulation plate, which are welded on the step of the support block. The cathode of the chip is connected with a metal connecting plate. The metal connecting plate is connected to the anode metal plate and the cathode metal plate. The insulation plate and the anode metal plate are bonded using a gold wire in press-welding.

    摘要翻译: 大功率半导体激光器包括支撑块,阳极金属板,阴极金属板和芯片。 支撑块具有台阶,并且支撑块的两端具有凸起,其中存在螺钉孔。 该芯片焊接到一个连接到支撑块上的绝缘板上。 阳极金属板和阴极金属板分别焊接有阳极绝缘板和阴极绝缘板,焊接在支撑块的台阶上。 芯片的阴极与金属连接板连接。 金属连接板连接到阳极金属板和阴极金属板。 绝缘板和阳极金属板在压焊中使用金线接合。

    SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM
    85.
    发明申请
    SEMICONDUCTOR LASER ASSEMBLY AND PACKAGING SYSTEM 有权
    半导体激光器组装和封装系统

    公开(公告)号:US20110122905A1

    公开(公告)日:2011-05-26

    申请号:US12623886

    申请日:2009-11-23

    IPC分类号: H01S3/04 H01S3/00 B23P11/00

    摘要: A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

    摘要翻译: 用于半自动对准组装和封装半导体激光器的系统允许减少高功率密度系统的时间,成本和测试费用。 诸如修改的TO-can(晶体管轮廓罐)的激光器封装安装系统具有增加从主动激光器到热交换器或其他散热器的热传递的修改。 预制热交换器组件安装激光器封装和一个或多个透镜。 将风扇组件直接安装到包装件上进一步最小化组装步骤。 组件可以通过计时和其它分度装置在组装期间被物理和光学对准,使得整个系统通过组装过程自对准和聚焦,而不需要后装配调整。 该系统可以降低成本,从而使得能够以低成本,大批量生产(例如消费品)使用高功率半导体激光器。

    Method for assembling array-type semiconductor laser device
    87.
    发明授权
    Method for assembling array-type semiconductor laser device 有权
    阵列式半导体激光器件的组装方法

    公开(公告)号:US07888146B2

    公开(公告)日:2011-02-15

    申请号:US12219133

    申请日:2008-07-16

    IPC分类号: H01L21/00

    摘要: According to an aspect of the present invention, there is provided a method for assembling a semiconductor laser device, including: preparing a laser chip including: a substrate; stripe waveguides that are formed on the substrate and that each includes a gain producing area and a window area; electrodes formed on the stripe waveguides; an insulating layer formed on the electrodes; a metal layer formed on the insulating layer; projections arranged at an interval in the window areas; and joining structures connected to the electrodes and formed in the window areas; preparing a submount including: a first solder; second solders arranged at the interval; and submount electrodes connected to the second solders; contacting the laser chip to the submount by fitting the projections with respect to the second solders; and heating the submount and the laser chip.

    摘要翻译: 根据本发明的一个方面,提供了一种用于组装半导体激光器件的方法,包括:准备包括:衬底的激光器芯片; 条形波导,其形成在基板上,并且每个包括增益产生区域和窗口区域; 在条形波导上形成的电极; 形成在电极上的绝缘层; 形成在所述绝缘层上的金属层; 在窗口区域间隔布置的突起; 以及连接到电极并形成在窗口区域中的接合结构; 准备一个底座,包括:第一个焊锡; 第二次焊接间隔排列; 和连接到第二焊料的底座电极; 通过将所述突起相对于所述第二焊料接合来将所述激光芯片接触所述基座; 并加热底座和激光芯片。

    Semiconductor laser element and manufacturing method thereof
    90.
    发明授权
    Semiconductor laser element and manufacturing method thereof 失效
    半导体激光元件及其制造方法

    公开(公告)号:US07843983B2

    公开(公告)日:2010-11-30

    申请号:US10592943

    申请日:2005-03-16

    摘要: In an element wherein a plurality of ridges (16, 36) are arranged in parallel, supports (17, 37) are formed to sandwich each of the ridges (16, 36). More specifically, on an outer side of the ridge (16) in the element, the first support (17a) is formed, and on an inner side in the element, the second support (17b) is formed. On an outer side of the ridge (36) in the element, the first support (37a) is formed, and on an inner side in the element, the second support (37b) is formed. Thus, even when a resist is applied on an element surface and spin-coating is performed at the time of manufacturing the element, the resist on the inner side than the ridges (16, 36) in the element can be prevented from flowing into a groove between the ridges to a certain extent by means of the second supports (17b, 37b), and a resist film thickness on the inner sides of the ridges (16, 36) in the element can be prevented from being considerably small compared with that on the outer sides in the element.

    摘要翻译: 在其中平行布置多个脊(16,36)的元件中,形成支撑件(17,37)以夹住每个脊(16,36)。 更具体地,在元件中的脊部(16)的外侧上形成有第一支撑件(17a),并且在元件的内侧形成有第二支撑件(17b)。 在元件中的脊(36)的外侧上形成有第一支撑件(37a),并且在元件的内侧形成有第二支撑件(37b)。 因此,即使当在元件表面上施加抗蚀剂并且在制造元件时进行旋转涂覆时,可以防止在内部的内侧的抗蚀剂比元件中的脊(16,36)流入 通过第二支撑件(17b,37b)在一定程度上的脊之间的沟槽以及元件中的脊(16,36)的内侧上的抗蚀剂膜厚度可以被防止与该元件的脊部(16,36)的内侧相比小得多 在元素的外侧。