公开(公告)号：US07682962B2

公开(公告)日：2010-03-23

申请号：US11743636

申请日：2007-05-02

Applicant: David R. Hembree

Inventor： David R. Hembree

IPC: H01L21/44

CPC classification number: H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.

Abstract translation: 用于通过导线互连制造半导体部件的方法包括提供具有电路侧，背面和通孔的基板的步骤。 该方法还包括以下步骤：将导线穿过通孔，在背面的导线上形成接触，在电路侧的导线上形成接合接触，然后将线从接合接触件断开。 通线互连包括通孔中的导线，背侧的触点和电路侧的接合触点。 背面的触点和电路侧的接合触点允许多个部件与相邻部件之间的电连接层叠。 用于执行该方法的系统包括具有通孔的基板和具有接合毛细管的引线接合器，所述接合毛细管被配置为使线穿过通孔，并形成接触和接合接触。 半导体部件可用于形成用于电接合或测试其它半导体部件的芯片级部件，晶片级部件，堆叠部件或互连部件。

公开(公告)号：US07674983B2

公开(公告)日：2010-03-09

申请号：US12185894

申请日：2008-08-05

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H01B17/16

CPC classification number: H05K13/06 ,  H05K3/222 ,  H05K3/301 ,  H05K7/12 ,  H05K2201/10287 ,  H05K2201/10606

Abstract: A wire holder includes a synthetic resin component that includes a clamp portion for holding at least one wire and a metal component that includes at least one lead portion mounted on a circuit board. The synthetic resin component includes a groove-shaped fitting groove portion. The metal component includes at least one fitting portion that fits the fitting groove portion and is connected to the lead portion. The fitting groove portion includes at least one first opening portion which allows the at least one lead portion to project in a predetermined direction when the at least one fitting portion fits the fitting groove portion. At least one of end portions in an extension direction of a groove of the fitting groove portion is opened as a second opening portion which allows one of the at least one lead portion to project along the extension direction of the groove of the fitting groove portion.

Abstract translation: 线保持器包括合成树脂部件，该合成树脂部件包括用于保持至少一根线的夹持部和包括安装在电路板上的至少一个引线部的金属部件。 合成树脂组件包括槽形配合槽部分。 金属部件包括至少一个装配部分，该装配部分适配于装配槽部分并连接到引导部分。 装配槽部分包括至少一个第一开口部分，当至少一个装配部分配合到装配槽部分时，允许至少一个引导部分在预定方向上突出。 装配槽部分的槽的延伸方向的端部中的至少一个作为第二开口部被打开，该第二开口部允许至少一个引线部中的一个引导部沿着装配槽部的槽的延伸方向突出。

公开(公告)号：US07652367B2

公开(公告)日：2010-01-26

申请号：US11959557

申请日：2007-12-19

Applicant: Kyung-Lae Jang ,  Kwon-Young Roh

Inventor： Kyung-Lae Jang ,  Kwon-Young Roh

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85365 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/325 ,  H05K2201/10287 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.

Abstract translation: 封装的半导体封装包括塔式封装，堆叠在下封装上的上封装，组合到塔式封装的上部中的任一个和上封装的下部的插头线，以及组合到任何 下部封装的上部中的一个和上部封装的下部。 插头线插入插座线，以电连接上下包装。

公开(公告)号：US07645262B2

公开(公告)日：2010-01-12

申请号：US11517859

申请日：2006-09-07

Applicant: Robert J. Greenberg ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Jerry Ok

IPC: A61M5/00

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07639160B2

公开(公告)日：2009-12-29

申请号：US10581383

申请日：2004-12-01

Applicant: Salvatore Sabina ,  Giovanni Canepa

Inventor： Salvatore Sabina ,  Giovanni Canepa

IPC: G08G1/01

CPC classification number: B61L3/126 ,  H05K1/14 ,  H05K1/148 ,  H05K1/165 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/1327 ,  Y10T29/49002

Abstract: A railway beacon having a casing (3) supporting an electronic circuit (4), which receives an electromagnetic enabling signal from a vehicle travelling along a railway line, and generates a coded response signal (telegram) transmitted to the vehicle. The casing (3) is formed in one piece from insulating material, and has at least one sunken seat (12a) housing the electronic circuit (4), which is embedded in a layer of insulating silicone resin (40) poured and set inside the sunken seat.

Abstract translation: 一种具有支撑电子电路（4）的壳体（3）的铁路信标灯，其接收来自沿着铁路线行进的车辆的电磁使能信号，并生成发送到车辆的编码应答信号（电报）。 壳体（3）由绝缘材料形成为一体，并且具有容纳电子电路（4）的至少一个下沉座（12a），该凹座位于嵌入在绝缘硅树脂（40）内的层 沉没的座位

公开(公告)号：US07638885B2

公开(公告)日：2009-12-29

申请号：US12037203

申请日：2008-02-26

Applicant: Hoi-Jun Yoo ,  Yongsang Kim ,  Hyejung Kim

Inventor： Hoi-Jun Yoo ,  Yongsang Kim ,  Hyejung Kim

IPC: H01L23/49 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L23/14 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/038 ,  H05K3/143 ,  H05K3/326 ,  H05K2201/029 ,  H05K2201/10287 ,  H05K2203/0221 ,  H01L2224/83851 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved.

Abstract translation: 提供了一种织物类型的半导体器件封装。 该织物类型的半导体器件封装包括织物类型的印刷电路板，其包括织物和通过在织物上图形化导电材料形成的引线单元，半导体器件包括结合到织物型印刷电路板的引线单元的电极单元， 以及用于密封织物型印刷电路板和半导体器件的模制单元。 在根据本发明的织物类型的半导体器件封装中，使用由织物形成的织物型印刷电路板，以使外来物质的感觉最小化。 可以容易地安装织物类型的半导体器件封装。 可以提高织物型半导体器件封装的生产率。

公开(公告)号：US07619355B2

公开(公告)日：2009-11-17

申请号：US11766147

申请日：2007-06-21

Applicant: Masafumi Moriya ,  Kazuya Ishiwata

Inventor： Masafumi Moriya ,  Kazuya Ishiwata

IPC: H01J1/62 ,  H01J9/00

CPC classification number: H05K3/4685 ,  H01J17/04 ,  H01J29/04 ,  H05K3/107 ,  H05K2201/09245 ,  H05K2201/10287 ,  H05K2203/0315 ,  Y10T29/49162

Abstract: To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.

Abstract translation: 提供一种电子源，包括：布线板，其具有：具有在其表面上的沟槽的衬底; 导电线，其包含沿着所述凹槽中的所述凹槽布置的金属; 以及布置在穿过导线的导线上方的布线; 以及布置在所述布线板上并电连接到所述导线和所述布线的电子发射器件; 其中所述线具有在其表面上的所述金属线中包含的金属的氧化物层。

公开(公告)号：US20090190790A1

公开(公告)日：2009-07-30

申请号：US12356628

申请日：2009-01-21

Applicant: Susumu Yamagami

Inventor： Susumu Yamagami

IPC: H04R1/02 ,  H04N5/50 ,  H04N5/63 ,  H05K1/18

CPC classification number: H05K1/141 ,  H04N5/642 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10083 ,  H05K2201/10287

Abstract: A speaker device includes a speaker and a connecting component. The speaker has a pair of input terminals spaced apart with a first predetermined distance therebetween. The connecting component electrically couples the speaker to a printed circuit board. The connecting component has a relay-use printed circuit board and a pair of lead wires. The relay-use printed circuit includes a pair of sub-board portions and a separation portion. The sub-board portions have a pair of terminal holes. The input terminals of the speaker are disposed through the terminal holes, respectively. The separation portion is disposed between the sub-board portions to couple the sub-board portions with a second predetermined distance between the terminal holes of the sub-board portions, and selectively separate the sub-board portions when the first predetermined distance between the input terminals of the speaker is different from the second predetermined distance between the terminal holes of the sub-board portions.

Abstract translation: 扬声器装置包括扬声器和连接部件。 扬声器具有一对输入端子，其间隔开第一预定距离。 连接部件将扬声器电耦合到印刷电路板。 连接部件具有继电器用印刷电路板和一对引线。 继电器用印刷电路包括一对子板部分和分离部分。 子板部分具有一对端子孔。 扬声器的输入端分别设置在端子孔中。 分离部分设置在子板部分之间，以在子板部分的端子孔之间以第二预定距离耦合子板部分，并且当输入之间的第一预定距离时，选择性地分离子板部分 扬声器的端子与子板部分的端子孔之间的第二预定距离不同。

公开(公告)号：US20090151150A1

公开(公告)日：2009-06-18

申请号：US12193941

申请日：2008-08-19

Applicant: Stephane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

Inventor： Stephane Ayala ,  Lionel Carre ,  Jari-Pascal Curty

IPC: H05K3/00 ,  H01P11/00

CPC classification number: G06K19/07749 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/103 ,  H05K3/321 ,  H05K2201/10287 ,  H05K2201/10727 ,  H01L2924/00

Abstract: A method for manufacturing a dual interface card includes at least the following step: collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess depositing a conductive adhesive onto the contact pads positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive executing one single lamination step of the sheets with the module in order to: laminate the multiple layers together in order to form the card body embed the dual interface module in the recess and achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.

Abstract translation: 一种用于制造双接口卡的方法至少包括以下步骤：将多个卡片支撑片材一个放置到另一个上，这些片材中的一些显示孔，以便形成适于接收双接口模块的凹部，其中一个片材 支撑具有固体金属接触垫的天线，其在凹部中至少部分地可自由接近，将导电粘合剂沉积到接触垫上，将接口焊盘定位在凹槽中，使得模块的焊盘与执行一个单一层压步骤的导电粘合剂接触 具有模块的片材为了：将多个层压在一起以形成卡体，将双界面模块嵌入凹槽中，并实现各向同性导电粘合剂的固化和天线与双界面之间的永久电接触 模块。

公开(公告)号：US20090145648A1

公开(公告)日：2009-06-11

申请号：US12323672

申请日：2008-11-26

Applicant: Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

Inventor： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

IPC: H05K1/18 ,  H01R12/06 ,  B23K37/00

CPC classification number: B23K20/004 ,  B23K1/0016 ,  B23K2101/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/111 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/10287 ,  H01L2924/00012

Abstract: A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern.

Abstract translation: 多层布线板的结构是：一组电子部件安装捕获垫设置在其一个表面上; 形成在其最上层的第一布线层包括布置在与设置有焊盘的表面相同的表面上的第一连接部分和与第一连接部分间隔开的第二连接部分; 所述焊盘和所述第一连接部分通过导线电连接，并且所述导线设置在层压在所述第一布线层上的第一绝缘层中; 并且第一连接部分通过第一布线图形线性地或弯曲地连接到第二连接部分。