公开(公告)号：US09466559B2

公开(公告)日：2016-10-11

申请号：US13229887

申请日：2011-09-12

申请人： Hiromi Shigihara ,  Hiroshi Tsukamoto ,  Akira Yajima

发明人： Hiromi Shigihara ,  Hiroshi Tsukamoto ,  Akira Yajima

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/485 ,  H01L21/66

CPC分类号： H01L24/05 ,  H01L21/565 ,  H01L22/32 ,  H01L23/485 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/02205 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05173 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/0568 ,  H01L2224/06183 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4502 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/46 ,  H01L2224/4807 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48158 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/4868 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/4878 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4888 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/0665 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0002 ,  H01L2924/00015

摘要： In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate).

摘要翻译： 在用于车辆用途的半导体集成电路器件中，半导体芯片上的铝焊盘和外部器件通过使用金线的引线接合彼此耦合以便于安装。 然而，这样的半导体集成电路器件在相对较高的温度（约150℃）下长时间使用铝和金之间的相互作用导致连接故障。 半导体集成电路器件可以包括作为器件的一部分的半导体芯片，经由阻挡金属膜设置在半导体芯片上的铝基焊盘上的电解镀金表面膜（金基金属镀膜），以及 用于在电镀表面膜和设置在布线板（布线基板）上的外部引线之间互连的金接合线（金基接合线）。

公开(公告)号：US09031533B2

公开(公告)日：2015-05-12

申请号：US12131305

申请日：2008-06-02

申请人： Akira Yajima ,  Naotake Fujita

发明人： Akira Yajima ,  Naotake Fujita

IPC分类号： H04M1/66 ,  H04M1/02

CPC分类号： H04M1/66 ,  H04M1/0245 ,  H04M2250/12

摘要： In a mobile terminal having a security function, both convenience and security protection are realized so as to prevent a user from feeling bothersome. A mobile phone has an operation control unit which sets the operation of various functions of the mobile terminal to be unusable at any timing. When a used state determination unit determines that the mobile phone is not in an abnormal state and not left, the operation control unit controls operation of the various functions to maintain usable states.

摘要翻译： 在具有安全功能的移动终端中，实现了便利性和安全性保护，以防止用户感到麻烦。 移动电话具有操作控制单元，其在任何定时将移动终端的各种功能的操作设置为不可用。 当使用状态确定单元确定移动电话未处于异常状态而不是离开时，操作控制单元控制各种功能的操作以维持可用状态。

公开(公告)号：US08435868B2

公开(公告)日：2013-05-07

申请号：US12650537

申请日：2009-12-30

申请人： Hisao Shigihara ,  Hiromi Shigihara ,  Akira Yajima

发明人： Hisao Shigihara ,  Hiromi Shigihara ,  Akira Yajima

IPC分类号： H01L21/302

CPC分类号： H01L24/11 ,  H01L21/6836 ,  H01L23/544 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/02166 ,  H01L2224/0231 ,  H01L2224/0347 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48847 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： With a general wafer level package process, in order to prevent corrosion of an aluminum type pad electrode in a scribe region in a plating process, the pad electrode is covered with a pad protective resin film at the same layer as an organic type protective film in a product region. However, this makes it impossible to perform the probe test on the pad electrode in the scribe region after rewiring formation. The present invention provides a method for manufacturing a semiconductor integrated circuit device of a wafer level package system. The organic type protective films in the chip regions and the scribe region are mutually combined to form an integral film pattern. In a pelletization step, the surface layer portion including the organic type protective film at the central part of the scribe region is first removed by laser grooving, to form a large-width groove. Then, a dicing processing of the central part in this groove results in separation into the chip regions.

摘要翻译： 通过一般的晶片级封装工艺，为了防止电镀工艺中的划线区域中的铝型焊盘电极的腐蚀，焊盘电极被覆盖有与有机型保护膜同层的焊盘保护树脂膜 产品区域。 然而，这使得不可能在重新布线形成之后对划线区域中的焊盘电极执行探针测试。 本发明提供一种制造晶片级封装系统的半导体集成电路器件的方法。 芯片区域和划线区域中的有机型保护膜相互组合形成整体膜图案。 在造粒步骤中，首先通过激光切槽除去包括划线区域中央部分的有机型保护膜的表层部，形成大宽度槽。 然后，该凹槽中的中心部分的切割处理导致分离成芯片区域。

公开(公告)号：US20110304049A1

公开(公告)日：2011-12-15

申请号：US13160497

申请日：2011-06-14

申请人： Hiromi SHIGIHARA ,  Akira Yajima ,  Hisao Shigihara ,  Hiroshi Tsukamoto

发明人： Hiromi SHIGIHARA ,  Akira Yajima ,  Hisao Shigihara ,  Hiroshi Tsukamoto

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/53238 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05024 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0496 ,  H01L2924/10162 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45015 ,  H01L2924/207

摘要： To suppress peeling of an Au pad for external coupling provided in a rewiring containing Cu as a main component.On the surface of a rewiring including a two-layer film in which a first Ni film is laminated on the top of a Cu film, a pad to which a wire is coupled is formed. The pad includes a two-layer film in which an Au film is laminated on the top of a second Ni film and formed integrally so as to cover the top surface and the side surface of the rewiring. Due to this, the area of contact between the rewiring and the pad increases, and therefore, the pad becomes difficult to be peeled off from the rewiring.

摘要翻译： 为了抑制以Cu为主要成分的重新布线所提供的用于外部耦合的Au焊盘的剥离。 在包括在Cu膜的顶部上层叠有第一Ni膜的双层膜的再布线表面上形成连接有导线的焊盘。 焊盘包括双层膜，其中Au膜层压在第二Ni膜的顶部上并且整体形成以覆盖重新布线的顶表面和侧表面。 由此，重新布线和焊盘之间的接触面积增加，因此，焊盘难以从重新布线剥离。

公开(公告)号：US20100285389A1

公开(公告)日：2010-11-11

申请号：US12679004

申请日：2008-09-24

申请人： Akira Yajima ,  Yoshie Ozeki ,  Nobuyasu Negishi ,  Koichi Kawamura ,  Takashi Shimoyamada ,  Motoi Goto ,  Kenichi Takahashi ,  Naoki Iwamura

发明人： Akira Yajima ,  Yoshie Ozeki ,  Nobuyasu Negishi ,  Koichi Kawamura ,  Takashi Shimoyamada ,  Motoi Goto ,  Kenichi Takahashi ,  Naoki Iwamura

IPC分类号： H01M8/10

CPC分类号： H01M8/04186 ,  H01M8/04201 ,  H01M8/1009 ,  H01M8/1011 ,  H01M8/242 ,  H01M8/2475 ,  H01M2008/1095 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523

摘要： The present invention relates to a fuel cell including a plurality of unit membrane electrode assemblies having an electrolyte membrane sandwiched by fuel electrodes and air electrodes. In recent years, attempts have been made to use fuel cells as power sources of portable electronic devices, and if the fuel cell can be made compact, it becomes a remarkably advantageous power supply system for portable electronic devices. Generally, in the fuel cell, the plural unit membrane electrode assemblies are electrically connected in series, but the serial connection of the unit membrane electrode assemblies different in output has a problem such as the deterioration due to polarity reversal occurring in the unit membrane electrode assembly with a low output. The present invention solves the above problem by the structure in which the fuel cell includes: the membrane electrode assembly group in which the plural unit membrane electrode assemblies are arranged two-dimensionally so as to be a predetermined interval apart from each other in a circumferential direction around a given center point, with the same electrodes being set on the same side; and a fuel supply mechanism disposed on the fuel electrode side of the membrane electrode assembly group and supplying a fuel to the fuel electrodes.

摘要翻译： 本发明涉及一种燃料电池，其包括多个单元膜电极组件，其具有被燃料电极和空气电极夹在中间的电解质膜。 近年来，已经尝试使用燃料电池作为便携式电子设备的电源，并且如果能够使燃料电池小型化，则成为用于便携式电子设备的非常有利的电源系统。 通常，在燃料电池中，多个单位膜电极组件串联电连接，但输出不同的单位膜电极组件的串联连接存在由于单元膜电极组件中发生的极性反转引起的劣化的问题 产量低。 本发明通过燃料电池的结构来解决上述问题，所述结构包括：膜电极组件组，其中多个单元膜电极组件沿圆周方向彼此间隔地设置成预定间隔 围绕给定的中心点，同一电极设置在同一侧; 以及燃料供给机构，其设置在所述膜电极组件组的燃料电极侧，并向所述燃料电极供给燃料。

公开(公告)号：US20100181650A1

公开(公告)日：2010-07-22

申请号：US12650537

申请日：2009-12-30

申请人： Hisao SHIGIHARA ,  Hiromi Shigihara ,  Akira Yajima

发明人： Hisao SHIGIHARA ,  Hiromi Shigihara ,  Akira Yajima

IPC分类号： H01L23/544 ,  H01L21/302

CPC分类号： H01L24/11 ,  H01L21/6836 ,  H01L23/544 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/02166 ,  H01L2224/0231 ,  H01L2224/0347 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05083 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48847 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： With a general wafer level package process, in order to prevent corrosion of an aluminum type pad electrode in a scribe region in a plating process, the pad electrode is covered with a pad protective resin film at the same layer as an organic type protective film in a product region. However, this makes it impossible to perform the probe test on the pad electrode in the scribe region after rewiring formation. The present invention provides a method for manufacturing a semiconductor integrated circuit device of a wafer level package system. The organic type protective films in the chip regions and the scribe region are mutually combined to form an integral film pattern. In a pelletization step, the surface layer portion including the organic type protective film at the central part of the scribe region is first removed by laser grooving, to form a large-width groove. Then, a dicing processing of the central part in this groove results in separation into the chip regions.

摘要翻译： 通过一般的晶片级封装工艺，为了防止电镀工艺中的划线区域中的铝型焊盘电极的腐蚀，焊盘电极被覆盖有与有机型保护膜同层的焊盘保护树脂膜 产品区域。 然而，这使得不可能在重新布线形成之后对划线区域中的焊盘电极执行探针测试。 本发明提供一种制造晶片级封装系统的半导体集成电路器件的方法。 芯片区域和划线区域中的有机型保护膜相互组合形成整体膜图案。 在造粒步骤中，首先通过激光切槽除去包括划线区域中央部分的有机型保护膜的表层部，形成大宽度槽。 然后，该凹槽中的中心部分的切割处理导致分离成芯片区域。

公开(公告)号：US07638223B2

公开(公告)日：2009-12-29

申请号：US11836821

申请日：2007-08-10

申请人： Hirofumi Kan ,  Asako Satoh ,  Akira Yajima ,  Yumiko Takizawa ,  Hiroyuki Shiroki

发明人： Hirofumi Kan ,  Asako Satoh ,  Akira Yajima ,  Yumiko Takizawa ,  Hiroyuki Shiroki

IPC分类号： H01M4/00

CPC分类号： H01M8/1011 ,  H01M4/8605 ,  H01M4/92 ,  Y02E60/523

摘要： A fuel cell comprising a cathode catalyst layer, an anode catalyst layer including a conductive perfluoro-binder having a micellar structure formed by outwardly orienting hydrophobic (lipophilic) groups and inwardly orienting hydrophilic groups, and a proton conductive membrane provided between the cathode catalyst layer and the anode catalyst layer.

摘要翻译： 一种燃料电池，包括阴极催化剂层，包含具有通过向外取向疏水（亲脂基）基团和向内取向的亲水基团形成的胶束结构的导电全氟粘合剂的阳极催化剂层，以及设置在阴极催化剂层和 阳极催化剂层。

公开(公告)号：US06861344B2

公开(公告)日：2005-03-01

申请号：US10341447

申请日：2003-01-14

申请人： Akira Yajima ,  Kenichi Yamamoto ,  Hiromi Abe

发明人： Akira Yajima ,  Kenichi Yamamoto ,  Hiromi Abe

IPC分类号： H01L21/66 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/8247 ,  H01L23/00 ,  H01L23/12 ,  H01L23/52 ,  H01L27/10 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792 ,  H01L21/44 ,  H01L29/78 ,  H01L21/90 ,  H01L21/92

CPC分类号： H01L24/05 ,  H01L22/34 ,  H01L23/564 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/45 ,  H01L2224/02166 ,  H01L2224/02311 ,  H01L2224/03 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48644 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/29099

摘要： The corrosion of a pad portion on TEG is prevented, and the wettability of a solder and the shear strength after solder formation of a pad portion of an actual device are improved. A third layer wiring M3 on a chip area CA of a semiconductor wafer and a third layer wiring M3 on a scribe area SA are respectively comprised of a TiN film M3a, an Al alloy film M3b, and a TiN film M3c. A second pad portion PAD2 as the top of a rewiring 49 on the chip area CA is cleaned. Alternatively, an Au film 53a is formed thereon by an electroles splating method. Further, after the formation of the Au film 53a, a retention test is carried out. Thereafter, further, an Au film 53b is formed and a solder bump electrode 55 is formed. As a result, it is possible to prevent the corrosion of a first pad portion PAD1 of the third layer wiring M3 on the scribe area SA which is TEG due to a plating solution or the like by the TiN film M3c. Further, it is possible to improve the wettability of a solder and the shear strength after solder formation of the second pad portion PAD2 by the Au films 53a and 53b.

摘要翻译： 防止了TEG上的焊盘部分的腐蚀，并且提高了焊料的润湿性和实际装置的焊盘部分的焊料形成之后的剪切强度。 半导体晶片的芯片区域CA上的第三层布线M3和划刻区域SA上的第三层布线M3分别由TiN膜M3a，Al合金膜M3b和TiN膜M3c构成。 作为芯片区域CA上的重新布线49的顶部的第二焊盘部分PAD2被清洁。 或者，通过电石喷溅法在其上形成Au膜53a。 此外，在形成Au膜53a之后，进行保留试验。 此后，形成Au膜53b，形成焊料凸块电极55。 结果，可以防止由TiN膜M3c由于电镀液等导致的TEG的划线区域SA上的第三层布线M3的第一焊盘部分PAD1的腐蚀。 此外，可以通过Au膜53a和53b改善焊料的润湿性和第二焊盘部分PAD2的焊料形成之后的剪切强度。

公开(公告)号：US20100255389A1

公开(公告)日：2010-10-07

申请号：US12816515

申请日：2010-06-16

申请人： Akira Yajima ,  Asako Satoh ,  Hirofumi Kan ,  Risa Aoki ,  Yuichi Yoshida

发明人： Akira Yajima ,  Asako Satoh ,  Hirofumi Kan ,  Risa Aoki ,  Yuichi Yoshida

IPC分类号： H01M8/06

CPC分类号： H01M8/1009 ,  H01M8/04141 ,  H01M8/04186 ,  H01M8/04201 ,  H01M8/1011 ,  H01M2008/1095 ,  Y02E60/523

摘要： A fuel cell includes a membrane electrode assembly includes a fuel electrode, an air electrode and an electrolyte membrane interposed between the fuel electrode and the air electrode, a fuel supply mechanism disposed on the air electrode side of the membrane electrode assembly to supply fuel to the fuel electrode, and a humidification layer disposed on the air electrode side of the membrane electrode assembly to be impregnated with water produced in the air electrode. The humidification layer include a first humidification section disposed opposite to a high-temperature area of an air electrode and a second humidification section disposed opposite to a low-temperature area of the air electrode when generating electricity. The second humidification section is so configured that water vapor is released into air therefrom more easily than from the first humidification section in the membrane electrode assembly.

摘要翻译： 燃料电池包括膜电极组件，其包括燃料电极，空气电极和介于燃料电极和空气电极之间的电解质膜;燃料供给机构，设置在膜电极组件的空气电极侧，以将燃料供应到 燃料电极和设置在膜电极组件的空气极侧的加湿层，以浸渍在空气电极中产生的水。 加湿层包括与空气电极的高温区域相对设置的第一加湿部和在发电时与空气电极的低温区域相对设置的第二加湿部。 第二加湿部被配置为使得水蒸气比膜电极组件中的第一加湿部更容易地释放到空气中。

公开(公告)号：US20100104907A1

公开(公告)日：2010-04-29

申请号：US12650598

申请日：2009-12-31

申请人： Risa AOKI ,  Akira Yajima ,  Asako Satoh ,  Jun Momma ,  Yumiko Takizawa ,  Yuuichi Sato ,  Genta Oomichi ,  Hirofumi Kan ,  Nobuyasu Negishi ,  Mitsuru Furuichi ,  Yuichi Yoshida ,  Kiyoto Yoda ,  Hideo Oota

发明人： Risa AOKI ,  Akira Yajima ,  Asako Satoh ,  Jun Momma ,  Yumiko Takizawa ,  Yuuichi Sato ,  Genta Oomichi ,  Hirofumi Kan ,  Nobuyasu Negishi ,  Mitsuru Furuichi ,  Yuichi Yoshida ,  Kiyoto Yoda ,  Hideo Oota

IPC分类号： H01M8/04

CPC分类号： H01M8/04619 ,  H01M8/04119 ,  H01M8/04313 ,  H01M8/0432 ,  H01M8/04365 ,  H01M8/04388 ,  H01M8/04425 ,  H01M8/1011 ,  H01M16/006 ,  H01M2250/30 ,  H04M1/72544 ,  H04M2250/12 ,  H04W52/0296 ,  Y02B90/18 ,  Y02D70/00 ,  Y02E60/523

摘要： In an electronic device, state detection elements are arranged at various locations of a fuel cell system supplies an electric power to a phone unit, the state detection elements detect states of the fuel cell system at the locations. A cell state detection unit detects an operating state of the fuel cell from an output signal of each of the state detection elements. A determination unit determines an operating mode to prompt action to be taken for the operating state of the fuel cell detected by the cell state detection unit. A content of the operating mode is displayed with an image of a character or a fictitious creature based on a determination by the determination unit.

摘要翻译： 在电子设备中，状态检测元件布置在燃料电池系统的各个位置处，向电话单元供电，状态检测元件检测位置处的燃料电池系统的状态。 单元状态检测单元根据各状态检测元件的输出信号检测燃料电池的动作状态。 确定单元确定对由小区状态检测单元检测到的燃料电池的操作状态采取行动的操作模式。 基于确定单元的确定，操作模式的内容以字符或虚构生物的图像显示。