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公开(公告)号：US06739041B2
公开(公告)日：2004-05-25
申请号：US09815234
申请日：2001-03-22
IPC分类号： H05K320
CPC分类号： H05K3/462 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49117 , Y10T29/49128 , Y10T29/49153 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.
摘要翻译： 一种用于制造多层电子电路板82,168的方法10,90，包括在导电构件12,92上形成至少一个突起15,100的步骤，并且添加另外的材料34,56,58的导电层 ，104,114,138,140连接到构件12,92，同时在层82,168内选择性地延伸突起15,100，从而形成电路板82,168。形成的电路板的一部分可以按顺序蚀刻 以选择性地产生空气桥86或互连部分164。
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公开(公告)号：US06673723B2
公开(公告)日：2004-01-06
申请号：US09815226
申请日：2001-03-22
申请人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
发明人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
IPC分类号： H01L21302
CPC分类号： H05K3/44 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0361 , H05K2201/0397 , H05K2201/09509 , H05K2201/09554 , H05K2201/09609 , H05K2201/09881 , H05K2203/0369 , H05K2203/0733 , H05K2203/1184
摘要： A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.
摘要翻译： 制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。
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公开(公告)号：US06454878B1
公开(公告)日：2002-09-24
申请号：US09703553
申请日：2000-11-01
申请人： Achyuta Achari , Brenda Joyce Nation , Jay D Baker , Lakhi Nandlal Goenka , Mohan R. Paruchuri , Vladimir Stoica
发明人： Achyuta Achari , Brenda Joyce Nation , Jay D Baker , Lakhi Nandlal Goenka , Mohan R. Paruchuri , Vladimir Stoica
IPC分类号： C23C806
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
摘要： A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
摘要翻译： 一种用于形成包含使用包层磨的三金属材料组的方法。 当形成多组三金属材料时，通过氧化制备每组的外表面以防止每一组粘附到上述或下方。 氧化的替代物是在三金属材料的外表面上提供可除去的层。 或者可以在中间表面上使用粘合材料; 这种接合材料可以选自锡，镍，钛，铬，银和锌。
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公开(公告)号：US07111883B1
公开(公告)日：2006-09-26
申请号：US11352155
申请日：2006-02-10
IPC分类号： B60R7/04
CPC分类号： B60R11/00 , B60R7/04 , B60R11/02 , B60R2011/0007 , B60R2011/0085
摘要： A center console for a motor vehicle comprising a stationary housing mounted within the vehicle. The housing includes an open center defined between opposing ends and has a console body mounted within the open center of the housing. The console body is rotatable about a longitudinal axis running through the console body and is mounted such that an operator may remove the body from the frame. Also, at least two longitudinal side walls of the rotating body are visible within the open center and the console body may be rotated such that alternate side walls may be positioned in an uppermost position with respect to the center console. Thus, a user may exchange the console body for another and access multiple sides of the console body, regardless of which is in the uppermost position.
摘要翻译： 一种用于机动车辆的中控台，其包括安装在车辆内的固定壳体。 壳体包括限定在相对端之间的开放中心，并且具有安装在壳体的开放中心内的控制台主体。 控制台主体可以围绕运行通过控制台主体的纵向轴线旋转，并且被安装成使得操作者可以将该主体从框架上移除。 此外，旋转体的至少两个纵向侧壁在打开中心内是可见的，并且控制台主体可以旋转，使得交替的侧壁可以相对于中心控制台定位在最高位置。 因此，用户可以将控制台主体更换为另一个并且访问控制台主体的多个侧面，而不管哪个处于最高位置。
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5.发明授权公开(公告)号：US06274407B1
公开(公告)日：2001-08-14
申请号：US09619546
申请日：2000-07-19
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2924/01048 , H01L2924/01083 , H01L2924/0132 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.
摘要翻译： 用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙 尺寸。 在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合 并且随后固化粘结材料。
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公开(公告)号：US5755896A
公开(公告)日：1998-05-26
申请号：US753575
申请日：1996-11-26
CPC分类号： B23K35/262 , B23K35/264 , C22C12/00 , C22C13/02 , C22C30/04
摘要： Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.
摘要翻译： 包含37-53％锡，37-57％铋和6-10％铟的熔融组合物（重量百分数）（1），熔融温度在99-124℃之间，和（2）包含 48-58％锡，40-50％铋和2-5％铟，熔融温度在125-157℃之间。
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7.发明授权Method for fabricating connectors for interconnecting etched tri-metal circuit structures 失效制造用于互连蚀刻的三金属电路结构的连接器的方法公开(公告)号：US06658731B1
公开(公告)日：2003-12-09
申请号：US09703554
申请日：2000-11-01
IPC分类号： H05K302
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
摘要翻译： 在传统的ETM电路结构中，一个引脚连接器，其中从ETM基板蚀刻引脚，并且从ETM基板蚀刻配合腔以进行配合。 连接器利用减法ETM结构处理来定义几个引脚腔配置中的任何一个。 该引脚用作锚固件，其中在空腔中与焊料的冶金结合形成在ETM电路结构的铜表面上，以为连接提供良好的机械强度。 特别地示出和描述了四种不同的互连配置。
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公开(公告)号：US06395994B1
公开(公告)日：2002-05-28
申请号：US09495242
申请日：2000-01-31
IPC分类号： H05K103
CPC分类号： H01L24/45 , H01L21/4846 , H01L23/49861 , H01L23/5389 , H01L24/31 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4092 , H01L2924/013 , H01L2924/00013 , H01L2924/01033 , H01L2224/85399 , H01L2224/05599
摘要： A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
摘要翻译： 固定到印刷电路板的电路部件通常使用细线来完成从印刷电路到部件的电路。 该部件可以是其上具有一个或多个焊盘以用于接收线的集成电路。 用于制造该器件的器件和方法具有形成在PCB上的印刷电路，其中一个或多个导线沿印刷电路蚀刻。 蚀刻剂除去蚀刻的三金属的底层的一部分以及有时的中间层以及任何层压和粘合剂。 这形成了结合到组件的线迹的自由端。 不需要额外的电线。
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公开(公告)号：US06360939B1
公开(公告)日：2002-03-26
申请号：US09414207
申请日：1998-10-07
IPC分类号： B23K3102
CPC分类号： H05K3/3484 , B23K35/025 , B23K35/262 , H05K3/3442 , H05K3/3463 , H05K2201/0215 , H05K2201/0272
摘要： A method of manufacturing a lead-free electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 80-99% Sn and 1-20% Ag. The additive powder metal is selected from the metal group comprising Sn, Ni, Cu, Ag, and Bi and mixtures thereof.
摘要翻译： 一种制造无铅电焊膏的方法，其具有在焊接过程中不熔化的主要焊料粉末和添加金属粉末成分。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 初级粉末包含80-99％的Sn和1-20％的Ag。 添加剂粉末金属选自Sn，Ni，Cu，Ag和Bi及其混合物。
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公开(公告)号：US07152315B1
公开(公告)日：2006-12-26
申请号：US10826019
申请日：2004-04-17
申请人： Mohan R. Paruchuri
发明人： Mohan R. Paruchuri
IPC分类号： H05K3/20
CPC分类号： H05K3/44 , H05K3/4038 , H05K3/445 , H05K2201/0305 , H05K2201/0355 , H05K2201/0361 , H05K2201/0394 , H05K2201/0397 , H05K2201/09554 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A method 10, 80, 81 for making multi-layer electronic circuit boards 77, 137, 139 having metallized apertures 18, 20, 34, 40, 104, 106, 120.
摘要翻译： 一种用于制造具有金属化孔18,20,34,40,104,106,120的多层电子电路板77,137,139的方法10,80,81。
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