公开(公告)号：US08749073B2

公开(公告)日：2014-06-10

申请号：US13154565

申请日：2011-06-07

申请人： Junichi Nakamura ,  Kentaro Kaneko ,  Shunichiro Matsumoto

发明人： Junichi Nakamura ,  Kentaro Kaneko ,  Shunichiro Matsumoto

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19101 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/308

摘要： A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of the structure and exposed to the surface of the outermost insulating layer, and a recessed portion formed at a place corresponding to a mounting area for the electronic component. The recessed portion is formed in the outermost insulating layer at an area between the pads to which electrode terminals of the electronic component to be mounted are to be connected, respectively.

摘要翻译： 布线基板包括多个布线层层叠有绝缘层的结构，多个用于安装电子部件的焊盘，该焊盘形成在该结构的一个表面侧上的最外侧的绝缘层上并暴露于 最外层绝缘层的表面和形成在与电子部件的安装区域对应的位置的凹部。 凹陷部分分别形成在要连接的电子部件的电极端子的焊盘之间的区域中的最外层绝缘层中。

公开(公告)号：US20110304016A1

公开(公告)日：2011-12-15

申请号：US13154565

申请日：2011-06-07

申请人： Junichi NAKAMURA ,  Kentaro Kaneko ,  Shunichiro Matsumoto

发明人： Junichi NAKAMURA ,  Kentaro Kaneko ,  Shunichiro Matsumoto

IPC分类号： H01L29/02 ,  H01L23/48 ,  H01L21/28

CPC分类号： H01L23/13 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19101 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/308

摘要： A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of the structure and exposed to the surface of the outermost insulating layer, and a recessed portion formed at a place corresponding to a mounting area for the electronic component. The recessed portion is formed in the outermost insulating layer at an area between the pads to which electrode terminals of the electronic component to be mounted are to be connected, respectively.

摘要翻译： 布线基板包括多个布线层层叠有绝缘层的结构，多个用于安装电子部件的焊盘，该焊盘形成在该结构的一个表面侧上的最外侧的绝缘层上并暴露于 最外层绝缘层的表面和形成在与电子部件的安装区域对应的位置的凹部。 凹陷部分分别形成在要连接的电子部件的电极端子的焊盘之间的区域中的最外层绝缘层中。

公开(公告)号：US08163746B2

公开(公告)日：2012-04-24

申请号：US12297275

申请日：2007-04-19

申请人： Keizo Sugasawa ,  Kenichi Kawaguchi ,  Takaho Matsuzawa ,  Ryushi Seo ,  Hironori Harada ,  Akira Suga ,  Tomoaki Abe ,  Hidenori Azami ,  Shunichiro Matsumoto ,  Takashi Shin ,  Masayuki Tanahashi ,  Toru Watanabe

发明人： Keizo Sugasawa ,  Kenichi Kawaguchi ,  Takaho Matsuzawa ,  Ryushi Seo ,  Hironori Harada ,  Akira Suga ,  Tomoaki Abe ,  Hidenori Azami ,  Shunichiro Matsumoto ,  Takashi Shin ,  Masayuki Tanahashi ,  Toru Watanabe

IPC分类号： A61K31/5355 ,  A61K31/496 ,  A61K31/451 ,  A61K31/4535 ,  A61K31/426 ,  C07D413/14 ,  C07D211/32 ,  C07D211/46 ,  C07D277/24

CPC分类号： C07D277/56 ,  C07D263/34 ,  C07D263/48 ,  C07D413/04 ,  C07D413/12 ,  C07D413/14 ,  C07D417/04 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D471/10 ,  C07D487/08 ,  C07D491/08

摘要： Provided is an agent for treating or preventing urinary frequency, urinary urgency and urinary, incontinence which are associated with overactive bladder, a lower urinary tract disease such as interstitial cystitis and chronic prostatitis accompanied by lower urinary tract pain, and various diseases accompanied by pain. A novel azolecarboxamide derivative in which an azole ring such as thioazole or oxazole is bonded to a benzene ring, pyridine ring or pyrimidine ring through carboxamide was confirmed to have a potent trkA receptor-inhibitory activity and found to be an agent for treating or preventing lower urinary tract disease and various diseases accompanied by pain, which is excellent in efficacy and safety, and thus the present invention was accomplished.

摘要翻译： 提供治疗或预防与膀胱过度活动相关的尿频，尿急和尿失禁的药物，诸如间质性膀胱炎的下尿路疾病和伴有下尿路疼痛的慢性前列腺炎以及伴有疼痛的各种疾病。 通过甲酰胺将唑环或吡唑环或吡啶环或吡啶环与吡唑或恶唑等唑类结合的新型偶氮甲酰胺衍生物被证实具有强的trkA受体抑制活性，被发现是用于治疗或预防较低 泌尿道疾病，伴有疼痛的各种疾病，其功效和安全性优异，从而完成了本发明。

公开(公告)号：US07960562B2

公开(公告)日：2011-06-14

申请号：US11887384

申请日：2006-03-30

申请人： Masaaki Hirano ,  Isao Kinoyama ,  Shunichiro Matsumoto ,  Eiji Kawaminami ,  Kei Ohnuki ,  Hirofumi Yamamoto ,  Kazuhiko Osoda ,  Tatsuhisa Takahashi ,  Takashi Shin ,  Takanori Koike ,  Itsuro Shimada ,  Hiroyuki Hisamichi ,  Toshiyuki Kusayama

发明人： Masaaki Hirano ,  Isao Kinoyama ,  Shunichiro Matsumoto ,  Eiji Kawaminami ,  Kei Ohnuki ,  Hirofumi Yamamoto ,  Kazuhiko Osoda ,  Tatsuhisa Takahashi ,  Takashi Shin ,  Takanori Koike ,  Itsuro Shimada ,  Hiroyuki Hisamichi ,  Toshiyuki Kusayama

IPC分类号： A61K31/4184 ,  C07D235/12

CPC分类号： C07D235/12 ,  C07D401/06 ,  C07D401/12 ,  C07D403/06 ,  C07D403/12 ,  C07D405/06 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D413/06 ,  C07D413/10 ,  C07D413/12 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14

摘要： It is intended to provide a compound useful as a GnRH receptor antagonist. The inventors further investigated propane-1,3-dione derivatives. As a result, they confirmed that a compound having a benzene ring or a thiophene ring substituted with a group represented by —SO2—R3 in a propane-1,3-dione derivative having 2-(1,3-dihydro-2H-benzimidazol-2-ylidene) has an excellent GnRH receptor antagonistic effect and accomplished the present invention. Because the compound of the present invention has a potent GnRH receptor antagonistic effect, it is useful for the treatment of sex hormone-dependent diseases, particularly GnRH-related diseases. Further, because the compound of the present invention has an excellent metabolic stability in human and few drug interactions, therefore it has preferable characteristics as a pharmaceutical used for the above-mentioned diseases.

摘要翻译： 旨在提供可用作GnRH受体拮抗剂的化合物。 本发明人进一步研究了丙烷-1,3-二酮衍生物。 结果证实，在具有2-（1,3-二氢-2H-苯并咪唑）的丙烷-1,3-二酮衍生物中具有被-SO 2 -R 3表示的基团取代的苯环或噻吩环的化合物 -2-亚基）具有优异的GnRH受体拮抗作用，完成了本发明。 因为本发明的化合物具有强的GnRH受体拮抗作用，因此可用于治疗性激素依赖性疾病，特别是GnRH相关疾病。 此外，由于本发明的化合物在人体中具有优异的代谢稳定性，药物相互作用少，因此作为上述疾病的药物具有优选的特性。

公开(公告)号：US5098649A

公开(公告)日：1992-03-24

申请号：US543376

申请日：1990-06-26

申请人： Shunichiro Matsumoto ,  Tsutomu Inui ,  Rokuo Ichiyasu ,  Yoshitaka Chiba

发明人： Shunichiro Matsumoto ,  Tsutomu Inui ,  Rokuo Ichiyasu ,  Yoshitaka Chiba

IPC分类号： B22F3/00 ,  B22F9/08 ,  C22C1/04 ,  C23C14/34 ,  G11B5/851 ,  G11B11/105 ,  H01F1/055 ,  H01F41/18

CPC分类号： H01F41/183 ,  C22C1/0441 ,  C23C14/3414 ,  G11B11/10589 ,  G11B5/851 ,  H01F1/0551

摘要： A rare earth metal-iron group metal target for a magneto-optical disk is produced by mixing power (a) produced by the rapid quenching treatment of an alloy composed of at least one rare earth metal and at least one iron group metal in a composition range which permits the formation of an eutectic structure, with powder (b) from at least one iron group metal in an amount necessary for meeting the composition requirements of the target; and subjecting the resulting mixture to pressure sintering in vacuum or in an inert gas atmosphere at a temperature lower than a liquid phase-appearing temperature of the mixture to produce a rare earth metal-iron group metal intermetallic bonding layer betwen the particles.

公开(公告)号：US07709519B2

公开(公告)日：2010-05-04

申请号：US10588485

申请日：2005-06-02

申请人： Masaaki Hirano ,  Eiji Kawaminami ,  Isao Kinoyama ,  Shunichiro Matsumoto ,  Kei Ohnuki ,  Kazuyoshi Obitsu ,  Toshiyuki Kusayama

发明人： Masaaki Hirano ,  Eiji Kawaminami ,  Isao Kinoyama ,  Shunichiro Matsumoto ,  Kei Ohnuki ,  Kazuyoshi Obitsu ,  Toshiyuki Kusayama

IPC分类号： A01N43/52

CPC分类号： C07D401/06

摘要： Compounds useful as GnRH receptor antagonists are provided. The present inventors have further examined propane-1,3-dione derivatives and confirmed as a result that a propane-1,3-dione having 2-(1,3-dihydro-2H-benzimidazol-2-ylidene), or a compound which has benzene or thiophene ring substituted with a group derived from 1-hydroxymethyl, shows excellent availability, in addition to its excellent GnRH receptor antagonism, thereby accomplishing the invention. Since the compound of the invention shows excellent availability, in addition to its strong GnRH receptor antagonism, it can be expected that it exerts superior drug effect in the living body, and it is useful for the treatment of sex hormone dependent diseases such as prostate cancer, breast cancer, endometriosis, uterine leiomyoma, benign prostatic hypertrophy and the like. In addition, since the compound of the invention is excellent in metabolic stability in human and also is less in drug interaction, it has more desirable properties as a medicament to be used for the aforementioned diseases.

摘要翻译： 提供了可用作GnRH受体拮抗剂的化合物。 本发明人进一步研究了丙-1,3-二酮衍生物，结果确认了具有2-（1,3-二氢-2H-苯并咪唑-2-亚基）的丙-1,3-二酮或化合物 其具有被衍生自1-羟甲基的基团取代的苯或噻吩环，除了其优异的GnRH受体拮抗作用外，显示出优异的可利用性，从而完成本发明。 由于本发明的化合物显示出优异的可利用性，除了其强的GnRH受体拮抗作用外，可以预期其在生物体中具有优异的药物作用，并且可用于治疗性激素依赖性疾病如前列腺癌 ，乳腺癌，子宫内膜异位症，子宫平滑肌瘤，良性前列腺肥大等。 此外，由于本发明的化合物在人体中的代谢稳定性优异，药物相互作用也较少，因此作为上述疾病的药物具有更优选的特性。

公开(公告)号：US20090284943A1

公开(公告)日：2009-11-19

申请号：US12464307

申请日：2009-05-12

申请人： Toshihisa YODA ,  Shunichiro Matsumoto ,  Masako Sato

发明人： Toshihisa YODA ,  Shunichiro Matsumoto ,  Masako Sato

IPC分类号： H05K7/02 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K1/113 ,  H01L23/498 ,  H01L23/49816 ,  H01L2224/16237 ,  H05K3/4644 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155

摘要： In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.

摘要翻译： 在布线板中，交替层叠多个布线层和多​​个绝缘层。 布线层通过形成在绝缘层中的通孔彼此电连接。 布线基板包括：连接焊盘，其设置在布线层中的位于最外布线层的内侧的一个布线层上; 以及外部连接端子，其设置在连接焊盘上，并且从布线板的表面突出。 外部连接端子穿过最外面的布线层。

公开(公告)号：US20080042258A1

公开(公告)日：2008-02-21

申请号：US11892927

申请日：2007-08-28

申请人： Kazuhiko Ooi ,  Tadashi Kodaira ,  Eisaku Watari ,  Jyunichi Nakamura ,  Shunichiro Matsumoto

发明人： Kazuhiko Ooi ,  Tadashi Kodaira ,  Eisaku Watari ,  Jyunichi Nakamura ,  Shunichiro Matsumoto

IPC分类号： H01L23/12 ,  H01L23/48

CPC分类号： H05K3/4688 ,  H01L23/145 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674

摘要： To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.

摘要翻译： 为了防止或减轻用于安装半导体元件的半导体元件和半导体封装之间的接合部分中的应力的发生，使得即使安装具有低强度的半导体元件也不会发生裂纹。 半导体器件的封装形成为包括多个导电层和绝缘树脂层的多层的叠层，所述多个导电层和绝缘树脂层彼此交替层叠，并且在层叠体的一个表面上具有用于安装半导体元件的部分。 至少包括用于安装半导体元件的部分和其周边的层压体的绝缘树脂层的整个区域或某些区域由通过浸渍液晶聚合物的织物而获得的预浸料 绝缘树脂。

公开(公告)号：US20100155114A1

公开(公告)日：2010-06-24

申请号：US12659080

申请日：2010-02-24

申请人： Kazuhiko Ooi ,  Tadashi Kodaira ,  Eisaku Watari ,  Jyunichi Nakamura ,  Shunichiro Matsumoto

发明人： Kazuhiko Ooi ,  Tadashi Kodaira ,  Eisaku Watari ,  Jyunichi Nakamura ,  Shunichiro Matsumoto

IPC分类号： H05K1/03

CPC分类号： H05K3/4688 ,  H01L23/145 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674

摘要： To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.

摘要翻译： 为了防止或减轻用于安装半导体元件的半导体元件和半导体封装之间的接合部分中的应力的发生，使得即使安装具有低强度的半导体元件也不会发生裂纹。 半导体器件的封装形成为包括多个导电层和绝缘树脂层的多层的叠层，所述多个导电层和绝缘树脂层彼此交替层叠，并且在层叠体的一个表面上具有用于安装半导体元件的部分。 至少包括用于安装半导体元件的部分和其周边的层压体的绝缘树脂层的整个区域或某些区域由通过浸渍液晶聚合物的织物而获得的预浸料 绝缘树脂。

公开(公告)号：US07164198B2

公开(公告)日：2007-01-16

申请号：US10649745

申请日：2003-08-28

申请人： Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

发明人： Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

IPC分类号： H01L23/48 ,  H05K3/46 ,  H05K3/34 ,  H05K1/00 ,  H10L23/12

CPC分类号： H05K3/0061 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2203/1536

摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

摘要翻译： 一种用于半导体器件的多层衬底，其具有由多组导体层和绝缘层形成的多层衬底本体，并且具有用于安装半导体元件的面和用于外部连接端子的另一面，用于安装的面 半导体器件设置有衬底，衬底通过该焊盘连接到要安装在其上的半导体元件，并且用于外部连接端子的面设置有衬底，衬底通过该衬垫连接到外部电路，其中加强板是 分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。