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    Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
    3.
    发明授权
    Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit 有权

    公开(公告)号：US11189537B2

    公开(公告)日：2021-11-30

    申请号：US13425589

    申请日：2012-03-21

    申请人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

    发明人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

    IPC分类号： H01L23/051 ,  H01L21/56 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

    摘要： A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.