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公开(公告)号：US08610274B2
公开(公告)日：2013-12-17
申请号：US12881257
申请日：2010-09-14
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05647 , H01L2224/45147 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48847 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A die structure includes a die and a metallization layer disposed over the front side of the die. The metallization layer includes copper. At least a part of the metallization layer has a rough surface profile. The part with the rough surface profile includes a wire bonding region, to which a wire bonding structure is to be bonded.
摘要翻译： 模具结构包括模具和设置在模具的前侧上的金属化层。 金属化层包括铜。 金属化层的至少一部分具有粗糙的表面轮廓。 具有粗糙表面轮廓的部分包括引线接合区域，引线接合结构将被接合到该引线接合区域。
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公开(公告)号：US20120061835A1
公开(公告)日：2012-03-15
申请号：US12881257
申请日：2010-09-14
CPC分类号： H01L24/48 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05647 , H01L2224/45147 , H01L2224/48453 , H01L2224/48458 , H01L2224/48463 , H01L2224/4847 , H01L2224/48847 , H01L2224/85 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A die structure includes a die and a metallization layer disposed over the front side of the die. The metallization layer includes copper. At least a part of the metallization layer has a rough surface profile. The part with the rough surface profile includes a wire bonding region, to which a wire bonding structure is to be bonded.
摘要翻译： 模具结构包括模具和设置在模具的前侧上的金属化层。 金属化层包括铜。 金属化层的至少一部分具有粗糙的表面轮廓。 具有粗糙表面轮廓的部分包括引线接合区域，引线接合结构将被接合到该引线接合区域。
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3.发明授权Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package 有权嵌入式集成电路封装和制造嵌入式集成电路封装的方法公开(公告)号：US08648456B1
公开(公告)日：2014-02-11
申请号：US13551656
申请日：2012-07-18
IPC分类号： H01L23/48 , H01L23/495 , H01L21/00 , H01L21/78
CPC分类号： H01L23/49811 , H01L21/561 , H01L23/3121 , H01L23/3135 , H01L23/5389 , H01L24/06 , H01L24/19 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04105 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/83801 , H01L2224/8384 , H01L2224/92244 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2224/83 , H01L2224/82 , H01L2924/014 , H01L2924/00
摘要： A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at least one chip including a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one chip; a plurality of electrical interconnects formed through the encapsulation material, wherein each electrical interconnect is electrically connected to a chip contact pad; and a structure formed between the electrical interconnects of the embedded integrated circuit package, wherein the structure increases the creepage resistance between the electrical interconnects.
摘要翻译： 提供一种嵌入式集成电路封装，所述嵌入式集成电路封装包括：至少一个布置在芯片载体上的芯片，所述至少一个芯片包括多个芯片接触焊盘; 形成在所述芯片载体上并且至少部分地围绕所述至少一个芯片的封装材料; 通过所述封装材料形成的多个电互连，其中每个电互连电连接到芯片接触焊盘; 以及形成在嵌入式集成电路封装的电互连之间的结构，其中该结构增加了电互连之间的耐爬电阻性。
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4.发明申请Electric Device Package Comprising a Laminate and Method of Making an Electric Device Package Comprising a Laminate 有权包括层压板的电气设备包装和制造包括层压板的电气设备包装的方法公开(公告)号：US20140027892A1
公开(公告)日：2014-01-30
申请号：US13562177
申请日：2012-07-30
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49575 , H01L23/296 , H01L23/3107 , H01L23/3135 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L24/05 , H01L24/06 , H01L24/19 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/06181 , H01L2224/291 , H01L2224/29116 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/4103 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/4903 , H01L2224/73213 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/83801 , H01L2224/83805 , H01L2224/8381 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2924/00014 , H01L2924/01322 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/10335 , H01L2924/1203 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2924/0105 , H01L2924/01049 , H01L2224/48227 , H01L2924/00012 , H01L2224/37099
摘要： A system and method for manufacturing an electric device package are disclosed. An embodiment comprises comprising a first carrier contact, a first electric component, the first electric component having a first top surface and a first bottom surface, the first electric component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the carrier and an connection element comprising a second electric component and an interconnect element, the connection element having a connection element top surface and a connection element bottom surface, wherein the connection element bottom surface comprises a first connection element contact and a second connection element contact, and wherein the first connection element contact is connected to the first component contact and the second connection element contact is connected to the first carrier contact. The packaged device further comprises an encapsulant encapsulating the first electric component.
摘要翻译： 公开了一种用于制造电子器件封装的系统和方法。 一个实施例包括第一载体接触件，第一电气部件，第一电气部件，具有第一顶部表面和第一底部表面，第一电气部件包括设置在第一顶部表面上的第一部件触点，第一底部表面是 连接到所述载体和包括第二电气部件和互连元件的连接元件，所述连接元件具有连接元件顶表面和连接元件底表面，其中所述连接元件底表面包括第一连接元件触点和第二连接 元件接触，并且其中所述第一连接元件触点连接到所述第一元件触点，并且所述第二连接元件触点连接到所述第一载体触点。 封装装置还包括封装第一电气部件的密封剂。
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5.发明授权Electric device package comprising a laminate and method of making an electric device package comprising a laminate 有权包括层压体的电气设备包装和制造包括层压板的电子设备包装的方法公开(公告)号：US08692361B2
公开(公告)日：2014-04-08
申请号：US13562177
申请日：2012-07-30
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/296 , H01L23/3107 , H01L23/3135 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L24/05 , H01L24/06 , H01L24/19 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/06181 , H01L2224/291 , H01L2224/29116 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/4103 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/4903 , H01L2224/73213 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/83801 , H01L2224/83805 , H01L2224/8381 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2924/00014 , H01L2924/01322 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/10335 , H01L2924/1203 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2924/0105 , H01L2924/01049 , H01L2224/48227 , H01L2924/00012 , H01L2224/37099
摘要： A system and method for manufacturing an electric device package are disclosed. An embodiment comprises comprising a first carrier contact, a first electric component, the first electric component having a first top surface and a first bottom surface, the first electric component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the carrier and an connection element comprising a second electric component and an interconnect element, the connection element having a connection element top surface and a connection element bottom surface, wherein the connection element bottom surface comprises a first connection element contact and a second connection element contact, and wherein the first connection element contact is connected to the first component contact and the second connection element contact is connected to the first carrier contact. The packaged device further comprises an encapsulant encapsulating the first electric component.
摘要翻译： 公开了一种用于制造电子器件封装的系统和方法。 一个实施例包括第一载体接触件，第一电气部件，第一电气部件，具有第一顶部表面和第一底部表面，第一电气部件包括设置在第一顶部表面上的第一部件触点，第一底部表面是 连接到所述载体和包括第二电气部件和互连元件的连接元件，所述连接元件具有连接元件顶表面和连接元件底表面，其中所述连接元件底表面包括第一连接元件触点和第二连接 元件接触，并且其中所述第一连接元件触点连接到所述第一元件触点，并且所述第二连接元件触点连接到所述第一载体触点。 封装装置还包括封装第一电气部件的密封剂。
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6.发明申请EMBEDDED INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING AN EMBEDDED INTEGRATED CIRCUIT PACKAGE 有权嵌入式集成电路封装和制造嵌入式集成电路封装的方法公开(公告)号：US20140021638A1
公开(公告)日：2014-01-23
申请号：US13551656
申请日：2012-07-18
CPC分类号： H01L23/49811 , H01L21/561 , H01L23/3121 , H01L23/3135 , H01L23/5389 , H01L24/06 , H01L24/19 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04105 , H01L2224/06181 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/83801 , H01L2224/8384 , H01L2224/92244 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2224/83 , H01L2224/82 , H01L2924/014 , H01L2924/00
摘要： A embedded integrated circuit package is provided, the embedded integrated circuit package including: at least one chip arranged over a chip carrier, the at least one chip including a plurality of chip contact pads; encapsulation material formed over the chip carrier and at least partially surrounding the at least one chip; a plurality of electrical interconnects formed through the encapsulation material, wherein each electrical interconnect is electrically connected to a chip contact pad; and a structure formed between the electrical interconnects of the embedded integrated circuit package, wherein the structure increases the creepage resistance between the electrical interconnects.
摘要翻译： 提供一种嵌入式集成电路封装，所述嵌入式集成电路封装包括：至少一个布置在芯片载体上的芯片，所述至少一个芯片包括多个芯片接触焊盘; 形成在所述芯片载体上并且至少部分地围绕所述至少一个芯片的封装材料; 通过所述封装材料形成的多个电互连，其中每个电互连电连接到芯片接触焊盘; 以及形成在嵌入式集成电路封装的电互连之间的结构，其中该结构增加了电互连之间的耐爬电阻性。
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7.发明授权Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil 有权包含电感线圈的管芯装置和制造包含电感器线圈的管芯装置的方法公开(公告)号：US09159777B2
公开(公告)日：2015-10-13
申请号：US13087458
申请日：2011-04-15
申请人： Georg Meyer-Berg
发明人： Georg Meyer-Berg
IPC分类号： H01L23/48 , H01L49/02 , H01L23/522 , H01L23/64 , H01L23/00
CPC分类号： H01L28/10 , H01L23/5227 , H01L23/645 , H01L24/05 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2924/10253 , H01L2924/181 , H01L2924/19042 , H01L2924/19104 , H01L2924/00
摘要： In various embodiments, a die arrangement may be provided. The die arrangement may include a die, at least one bond pad, at least one redistribution trace electrically connecting the die with the at least one bond, and at least one inductor enclosing the at least one bond pad and the at least one redistribution trace.
摘要翻译： 在各种实施例中，可以提供管芯装置。 管芯装置可以包括管芯，至少一个接合焊盘，至少一个将管芯与至少一个接合部分电连接的再分布迹线以及至少一个电感器，其围绕至少一个接合焊盘和至少一个再分布迹线。
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8.发明授权Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package 有权芯片封装的制造方法，晶片级封装的制造方法，芯片封装以及晶片级封装公开(公告)号：US09111847B2
公开(公告)日：2015-08-18
申请号：US13523942
申请日：2012-06-15
申请人： Georg Meyer-Berg
发明人： Georg Meyer-Berg
CPC分类号： H01L23/49513 , H01L21/4821 , H01L21/561 , H01L23/3128 , H01L23/49541 , H01L23/49575 , H01L23/49582 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/32 , H01L24/82 , H01L25/0655 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/24155 , H01L2224/29082 , H01L2224/29139 , H01L2224/29144 , H01L2224/29155 , H01L2224/29164 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/82007 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/06 , H01L2924/0665 , H01L2924/07025 , H01L2924/07802 , H01L2924/12042 , H01L2924/1715 , H01L2924/17738 , H01L2924/17747 , H01L2924/1776 , H01L2924/17763 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00
摘要： A method for manufacturing a chip package is provided. The method includes forming a layer over a carrier; forming further carrier material over the layer; selectively removing one or more portions of the further carrier material thereby releasing one or more portions of the layer from the further carrier material; and adhering a chip including one or more contact pads to the carrier via the layer.
摘要翻译： 提供了一种制造芯片封装的方法。 该方法包括在载体上形成层; 在该层上形成另外的载体材料; 选择性地去除所述另外的载体材料的一个或多个部分，从而将所述层的一个或多个部分从所述另外的载体材料释放; 以及通过所述层将包括一个或多个接触焊盘的芯片粘附到所述载体。
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公开(公告)号：US20130087371A1
公开(公告)日：2013-04-11
申请号：US13270268
申请日：2011-10-11
申请人： Georg Meyer-Berg
发明人： Georg Meyer-Berg
CPC分类号： H01L24/03 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/03332 , H01L2224/03442 , H01L2224/03515 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/0529 , H01L2224/053 , H01L2224/05564 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/0579 , H01L2224/058 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/81011 , H01L2224/81191 , H01L2924/00014 , H01L2924/12044 , H01L2924/3512 , H05K3/3436 , H05K2201/10719 , Y10T29/49147 , H01L2924/00012 , H01L2924/014 , H01L2924/01026 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.
摘要翻译： 表面贴装封装连接器包括弹性导体，互连焊盘和导电层。 弹性导体具有顶面。 互连焊盘电耦合到弹性导体。 弹性导体的顶表面远离互连垫布置。 导电层位于弹性导体的顶表面上。 导电层提供增加的导电表面积并且还可以是可焊接表面。
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公开(公告)号：US20130069211A1
公开(公告)日：2013-03-21
申请号：US13407157
申请日：2012-02-28
申请人： Georg Meyer-Berg , Andreas Schloegl
发明人： Georg Meyer-Berg , Andreas Schloegl
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L21/568 , H01L23/3107 , H01L23/492 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L25/072 , H01L2224/29111 , H01L2224/32014 , H01L2224/37011 , H01L2224/40225 , H01L2224/73219 , H01L2224/73265 , H01L2224/83801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/01028 , H01L2924/01083 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.
摘要翻译： 一种包括半导体芯片和金属箔的器件。 一个实施例提供了一种包括半导体芯片的器件，该半导体芯片在第一面上具有第一电极，而在第二面上与第一面相反。 第一金属箔以导电方式连接到半导体芯片的第一电极。 第二金属箔以导电的方式连接到半导体芯片的第二电极。
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