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12 条记录 (耗时 0.022 秒)

    Apparatus with a cap and cover assembly, an electron gun with a cap assembly, and a method of using a tube
    1.
    发明授权
    Apparatus with a cap and cover assembly, an electron gun with a cap assembly, and a method of using a tube 失效
    具有盖和盖组件的装置，具有盖组件的电子枪以及使用管的方法

    公开(公告)号：US06911770B2

    公开(公告)日：2005-06-28

    申请号：US09683683

    申请日：2002-02-01

    申请人： Randolph D. Schueller ,  Duane T. Smith

    发明人： Randolph D. Schueller ,  Duane T. Smith

    IPC分类号： H01J3/38 ,  H01J9/00 ,  H01J29/86 ,  H01J29/48

    CPC分类号： H01J3/38 ,  H01J9/00 ,  H01J29/86 ,  H01J2209/26

    摘要： A cap can comprise an aperture, and an attenuator may block the aperture during at least one point in time. In one embodiment, the attenuator can include a cover that may be displaced by a spring. In another embodiment, such as an electron gun, may comprise a support cap with an aperture, a displaceable cover that may cover the aperture, and a spring. A material attached to the spring and acting as a fuse may release the spring and expose the aperture after an electrical current blows the “fuse”. In yet another embodiment, a method for using a tube may comprise evacuating the tube while a cover covers an aperture in the support cap of a electron gun that is at least partially in the tube and moving the cover to expose the aperture after the tube is sealed.

    摘要翻译： 盖可以包括孔，并且衰减器可以在至少一个时间点期间阻挡孔。 在一个实施例中，衰减器可以包括可以被弹簧置换的盖。 在另一个实施例中，例如电子枪，可以包括具有孔的支撑帽，可覆盖孔的位移盖和弹簧。 附着在弹簧上作为保险丝的材料可能在电流吹动“保险丝”之后释放弹簧并露出孔。 在另一个实施例中，使用管的方法可以包括抽空管，同时盖覆盖至少部分在管中的电子枪的支撑帽中的孔，并且在管是管之后移动盖以暴露孔 密封。

    Package structure for mounting a field emitting device in an electron gun
    2.
    发明授权
    Package structure for mounting a field emitting device in an electron gun 失效
    用于在电子枪中安装场致发射器件的封装结构

    公开(公告)号：US06840834B2

    公开(公告)日：2005-01-11

    申请号：US10269172

    申请日：2002-10-11

    申请人： Randolph D. Schueller ,  Kent R. Kalar ,  Anthony A. Kloba

    发明人： Randolph D. Schueller ,  Kent R. Kalar ,  Anthony A. Kloba

    IPC分类号： H01J9/18 ,  H01J3/02 ,  H01J29/04 ,  H01J29/48 ,  H01J9/12

    CPC分类号： H01J3/021 ,  H01J29/481 ,  H01J29/485 ,  H01J2201/304

    摘要： Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.

    摘要翻译： 提供了一种能够将场发射阴极安装到电子枪中的封装结构的装置和方法。 非导电衬底具有阴极，并且阴极通过衬底与引脚电连接。 其他引脚电连接到与阴极集成的电极。 三个阴极可以安装在管芯标记区域上以形成适用于彩色CRT的电子枪。 实现了发射器阵列与电子枪和其它电极（例如聚焦透镜）中的孔的准确对准。 单个包装设计可用于许多喷枪尺寸。 在施工期间将发射器阵列组装和附接到电子枪可以降低施工成本。

    Gated electron field emitter having an interlayer
    6.
    发明授权
    Gated electron field emitter having an interlayer 有权
    具有中间层的门电子场发射体

    公开(公告)号：US06664721B1

    公开(公告)日：2003-12-16

    申请号：US09684107

    申请日：2000-10-06

    申请人： Keith D. Jamison ,  Donald E. Patterson ,  Charlie Hong ,  Randolph D. Schueller ,  David F. Hebert ,  Richard L. Woodin

    发明人： Keith D. Jamison ,  Donald E. Patterson ,  Charlie Hong ,  Randolph D. Schueller ,  David F. Hebert ,  Richard L. Woodin

    IPC分类号： H01J102

    CPC分类号： H01J9/025 ,  H01J3/022

    摘要： A field emitter (10) having improved electron emission properties is provided. Electron-emitting microtip protrusions (14) in an emitter layer (12) are separated from a dielectric layer (18) by an interlayer (16) that prevents substantial mixing of the dielectric (16) and the emitter layer (12) during growth of the dielectric layer (18). A conductive gate electrode layer (20) is deposited on the dielectric layer (18). For carbon-based emitters, aluminum is one of several suitable interlayers between the carbon layer and a silicon dioxide dielectric layer.

    摘要翻译： 提供了具有改善的电子发射特性的场致发射体（10）。 在发射极层（12）中的电子发射微尖端突起（14）通过中间层（16）与电介质层（18）分离，其阻止了电介质（16）和发射极层（12）在生长期间的实质性混合 介电层（18）。 导电栅电极层（20）沉积在电介质层（18）上。 对于碳基发射体，铝是碳层和二氧化硅介电层之间的几种合适的中间层之一。

    Multi-metal layer circuit
    7.
    发明授权
    Multi-metal layer circuit 失效
    多金属层电路

    公开(公告)号：US06507118B1

    公开(公告)日：2003-01-14

    申请号：US09617530

    申请日：2000-07-14

    申请人： Randolph D. Schueller

    发明人： Randolph D. Schueller

    IPC分类号： H01L2348

    CPC分类号： H01L23/49827 ,  H01L23/49833 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect surface accessible from a first side of the dielectric core and a second interconnect surface accessible from a second side of the dielectric core. A conductive element is attached to the first interconnect surface of each contact member. A flip chip semiconductor die includes an array of bond pads on a mounting surface thereof. Each bonding pad of the semiconductor die is substantially aligned with a respective one of the first interconnect surfaces of the interposer circuit. Each bonding pad is electrically connected to the corresponding conductive element. The electronic device defines a perimeter edge that circumscribes the array of bonding pads and the array of contact members of the interposer circuit. A solder ball is attached to the second interconnect surface of each contact member. A printed circuit substrate includes an array of solder ball pads on a surface thereof. Each one of the solder ball pads is substantially aligned with a respective one of the second interconnect surfaces. Each one of the solder ball pads is electrically connected to the corresponding solder ball.

    摘要翻译： 印刷电路组件包括插入器电路，该插入器电路具有与其连接的接触构件阵列的柔性介质芯。 每个接触构件包括可从电介质芯的第一侧接近的第一互连表面和可从电介质芯的第二侧接近的第二互连表面。 导电元件附接到每个接触构件的第一互连表面。 倒装芯片半导体管芯包括在其安装表面上的接合焊盘的阵列。 半导体管芯的每个焊盘基本上与插入器电路的第一互连表面中的相应一个对准。 每个接合焊盘电连接到相应的导电元件。 电子设备限定外接接合焊盘阵列和插入器电路的接触部件阵列的周边边缘。 焊球连接到每个接触构件的第二互连表面。 印刷电路基板包括其表面上的焊球垫阵列。 每个焊球垫基本上与第二互连表面中的相应一个对准。 每个焊球垫与相应的焊球电连接。