公开(公告)号：US20080110546A1

公开(公告)日：2008-05-15

申请号：US11892638

申请日：2007-08-24

申请人： Shoko Omizo ,  Atsushi Yoshimura ,  Mitsuhiro Nakao ,  Junya Sagara ,  Masayuki Dohi ,  Tatsuhiko Shirakawa

发明人： Shoko Omizo ,  Atsushi Yoshimura ,  Mitsuhiro Nakao ,  Junya Sagara ,  Masayuki Dohi ,  Tatsuhiko Shirakawa

IPC分类号： B32B38/10 ,  B32B37/14 ,  B32B38/18 ,  B32B38/00 ,  B32B41/00

CPC分类号： H01L21/67132 ,  B32B2038/1891 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T156/16

摘要： An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

摘要翻译： 一种半导体器件的制造装置，包括：夹头; 对准阶段 和送纸机构。 夹头构造成吸附半导体芯片的表面。 该表面位于与结合靶接合的接合面的相反侧。 接合表面设置有膜状粘合剂层。 夹头包括用于加热粘合剂层的加热器。 对准台被配置为支撑半导体芯片并校正半导体芯片的位置。 片材进给机构构造成将释放片材供给到对准台上。

公开(公告)号：US07849897B2

公开(公告)日：2010-12-14

申请号：US11892638

申请日：2007-08-24

申请人： Shoko Omizo ,  Atsushi Yoshimura ,  Mitsuhiro Nakao ,  Junya Sagara ,  Masayuki Dohi ,  Tatsuhiko Shirakawa

发明人： Shoko Omizo ,  Atsushi Yoshimura ,  Mitsuhiro Nakao ,  Junya Sagara ,  Masayuki Dohi ,  Tatsuhiko Shirakawa

IPC分类号： B32B41/00

CPC分类号： H01L21/67132 ,  B32B2038/1891 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T156/16

摘要： An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

摘要翻译： 一种半导体器件的制造装置，包括：夹头; 对准阶段 和送纸机构。 夹头构造成吸附半导体芯片的表面。 该表面位于与结合靶接合的接合面的相反侧。 接合表面设置有膜状粘合剂层。 夹头包括用于加热粘合剂层的加热器。 对准台被配置为支撑半导体芯片并校正半导体芯片的位置。 片材进给机构构造成将释放片材供给到对准台上。

公开(公告)号：US08231046B2

公开(公告)日：2012-07-31

申请号：US12564276

申请日：2009-09-22

申请人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

发明人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

IPC分类号： B23K20/00 ,  B23K31/12

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.

摘要翻译： 引线接合方法包括在第一接合点和第二接合点处按顺序接合线; 在所述第二接合点上升起所述电线插入的毛细管; 通过在毛细管达到规定高度的时候关闭设置在毛细管上方的夹持器来切断线; 并测量在切割线时在线上产生的负载。

公开(公告)号：US20080099532A1

公开(公告)日：2008-05-01

申请号：US11867307

申请日：2007-10-04

申请人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

发明人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

IPC分类号： B23K1/06 ,  B23K3/00

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding apparatus comprising: a capillary configured to have inserted therethrough a wire; a damper provided above the capillary and able to clamp hold the wire; and a load sensor configured to measure load incurred on the wire.

摘要翻译： 一种引线接合装置，包括：毛细管，其被配置为插入其中; 设置在毛细管上方的阻尼器，能够夹紧电线; 以及负载传感器，其被配置为测量在所述电线上产生的负载。

公开(公告)号：US20100181367A1

公开(公告)日：2010-07-22

申请号：US12564276

申请日：2009-09-22

申请人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

发明人： Mitsuhiro Nakao ,  Junya Sagara ,  Katsuhiro Ishida ,  Noboru Okane

IPC分类号： B23K31/12 ,  B23K20/00

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire

摘要翻译： 引线接合方法包括在第一接合点和第二接合点处按顺序接合线; 在所述第二接合点上升起所述电线插入的毛细管; 通过在毛细管达到规定高度的时候关闭设置在毛细管上方的夹持器来切断线; 并测量在切割线时在线上产生的负载

公开(公告)号：US20120193784A1

公开(公告)日：2012-08-02

申请号：US13353535

申请日：2012-01-19

申请人： Norihiro Togasaki ,  Mitsuhiro Nakao ,  Yosuke Morita

发明人： Norihiro Togasaki ,  Mitsuhiro Nakao ,  Yosuke Morita

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48824 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01046

摘要： Provided is a method for joining a bonding wire, the method including wedge-joining a bonding wire which has a core whose main component is a non-noble metal and a noble metal layer covering the core to a bump formed on an electrode of a semiconductor element via the noble metal layer.

摘要翻译： 提供了一种接合线的方法，该方法包括将具有主成分为非贵金属的芯和覆盖芯的贵金属层的接合线楔形接合到形成在半导体的电极上的凸块 元素通过贵金属层。

公开(公告)号：US08043148B2

公开(公告)日：2011-10-25

申请号：US11989999

申请日：2008-01-16

申请人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Tetsuo Tominaga ,  Mitsuhiro Nakao ,  Hajime Izumi ,  Jun Ito ,  Satoshi Kominami

发明人： Tsuyoshi Eguchi ,  Atsushi Suzuki ,  Tetsuo Tominaga ,  Mitsuhiro Nakao ,  Hajime Izumi ,  Jun Ito ,  Satoshi Kominami

IPC分类号： F24F13/14 ,  F24F13/10 ,  F24F13/04

CPC分类号： B60H1/00671 ,  B60H2001/006 ,  B60H2001/00714 ,  F24F13/1406

摘要： A damper is provided to suppress the abnormal noise or air noise at the small opening of the damper. The damper includes a wall surface which forms an air flow passage, a stationary portion which extends from the wall surface to the center of a flow passage, and a rotating portion rotatably disposed in the flow passage, having one end in contact with a portion of the stationary portion at a downstream side of an air flow through the flow passage. A curved wall portion as a convex curved surface protruding to the center of the flow passage is formed on a position of the wall surface on which the air flow passing between the one end and the stationary portion impinges.

摘要翻译： 提供阻尼器以抑制阻尼器小开口处的异常噪声或空气噪声。 阻尼器包括形成空气流动通道的壁表面，从壁表面延伸到流动通道的中心的静止部分和可旋转地设置在流动通道中的旋转部分，其一端与一部分 通过流路的空气流的下游侧的静止部分。 在通过一端与静止部之间的空气流碰撞的壁面的位置上形成作为突出于流路中心的凸曲面的弯曲壁部。

公开(公告)号：US07675183B2

公开(公告)日：2010-03-09

申请号：US12081818

申请日：2008-04-22

申请人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

发明人： Hiroshi Toyoda ,  Mitsuhiro Nakao ,  Masahiko Hasunuma ,  Hisashi Kaneko ,  Atsuko Sakata ,  Toshiaki Komukai

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/76846 ,  H01L21/76834 ,  H01L21/76849 ,  H01L21/76858 ,  H01L21/76886 ,  H01L21/76888 ,  H01L22/32 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05017 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05093 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05546 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05567 ,  H01L2224/05605 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/0562 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48611 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48711 ,  H01L2224/48716 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48799 ,  H01L2224/48805 ,  H01L2224/48811 ,  H01L2224/48813 ,  H01L2224/48816 ,  H01L2224/4882 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/85375 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2224/05609 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2224/48713 ,  H01L2224/48705 ,  H01L2224/4872 ,  H01L2224/48605 ,  H01L2224/48613 ,  H01L2224/4862 ,  H01L2924/00015

摘要： A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.

摘要翻译： 一种半导体器件，其由形成在半导体衬底上的铜布线层构成，该电极层与铜布线层电连接并具有合金，所述焊接电极层含有铜和氧化倾向高于铜的金属 形成为延伸到底表面，并且具有延伸到焊盘电极层的开口的绝缘保护膜。

公开(公告)号：US08826666B2

公开(公告)日：2014-09-09

申请号：US13882655

申请日：2012-03-30

申请人： Shuhei Kajimura ,  Keijiro Saito ,  Satoshi Takiguchi ,  Mitsuhiro Nakao ,  Koichi Nishida ,  Shinji Akamatsu ,  Sosuke Nakamura ,  Masaki Mitani

发明人： Shuhei Kajimura ,  Keijiro Saito ,  Satoshi Takiguchi ,  Mitsuhiro Nakao ,  Koichi Nishida ,  Shinji Akamatsu ,  Sosuke Nakamura ,  Masaki Mitani

IPC分类号： F02C1/00 ,  F23R3/34 ,  F23R3/28 ,  F23D14/24 ,  F23R3/14

CPC分类号： F23R3/28 ,  F23C2900/07021 ,  F23D14/24 ,  F23D2900/00014 ,  F23D2900/00016 ,  F23R3/14 ,  F23R3/283 ,  F23R3/343

摘要： A pilot nozzle, a gas turbine combustor and a gas turbine are provided with a nozzle main body having a fuel passage, a cover ring arranged at an outside of a front end-outer peripheral portion of the nozzle main body at a predetermined interval to form an inner air passage and capable of injecting air toward a front side of the nozzle main body, a plurality of nozzle tips that includes a fuel injection nozzle attached to a front end portion of the cover ring at a predetermined interval in a circumferential direction to communicate with the fuel passage and is able to inject fuel toward an outside of injection air from the inner air passage, and a swirling force application unit that applies a swirling force to air injected through the inner air passage.

摘要翻译： 引燃喷嘴，燃气轮机燃烧器和燃气轮机设置有具有燃料通道的喷嘴主体，以预定间隔布置在喷嘴主体的前端部外周部分的外侧的盖环，以形成 内部空气通道并且能够朝向喷嘴主体的前侧喷射空气;多个喷嘴头，其包括燃料喷嘴，喷嘴以周向方向以预定间隔安装到盖环的前端部，以便连通 并且能够从内部空气通道向喷射空气的外部喷射燃料;以及旋转力施加单元，其通过内部空气通道喷射的空气施加旋转力。

公开(公告)号：US20140041389A1

公开(公告)日：2014-02-13

申请号：US13882655

申请日：2012-03-30

申请人： Shuhei Kajimura ,  Keijiro Saito ,  Satoshi Takiguchi ,  Mitsuhiro Nakao ,  Koichi Nishida ,  Shinji Akamatsu ,  Sosuke Nakamura ,  Masaki Mitani

发明人： Shuhei Kajimura ,  Keijiro Saito ,  Satoshi Takiguchi ,  Mitsuhiro Nakao ,  Koichi Nishida ,  Shinji Akamatsu ,  Sosuke Nakamura ,  Masaki Mitani

IPC分类号： F23R3/28

CPC分类号： F23R3/28 ,  F23C2900/07021 ,  F23D14/24 ,  F23D2900/00014 ,  F23D2900/00016 ,  F23R3/14 ,  F23R3/283 ,  F23R3/343

摘要： A pilot nozzle, a gas turbine combustor and a gas turbine are provided with a nozzle main body having a fuel passage, a cover ring arranged at an outside of a front end-outer peripheral portion of the nozzle main body at a predetermined interval to form an inner air passage and capable of injecting air toward a front side of the nozzle main body, a plurality of nozzle tips that includes a fuel injection nozzle attached to a front end portion of the cover ring at a predetermined interval in a circumferential direction to communicate with the fuel passage and is able to inject fuel toward an outside of injection air from the inner air passage, and a swirling force application unit that applies a swirling force to air injected through the inner air passage.

摘要翻译： 引燃喷嘴，燃气轮机燃烧器和燃气轮机设置有具有燃料通道的喷嘴主体，以预定间隔布置在喷嘴主体的前端部外周部分的外侧的盖环，以形成 内部空气通道并且能够朝向喷嘴主体的前侧喷射空气;多个喷嘴头，其包括燃料喷嘴，喷嘴以周向方向以预定间隔安装到盖环的前端部，以便连通 并且能够从内部空气通道向喷射空气的外部喷射燃料;以及旋转力施加单元，其通过内部空气通道喷射的空气施加旋转力。