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公开(公告)号:CN104619799A
公开(公告)日:2015-05-13
申请号:CN201380048543.4
申请日:2013-09-17
申请人: 迪睿合电子材料有限公司
CPC分类号: H01L24/28 , B29C59/02 , B29C71/04 , B29C2035/0827 , B29C2059/028 , B29K2063/00 , B29L2009/003 , B29L2031/34 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/36 , B32B27/38 , B32B33/00 , B32B2255/205 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/202 , B32B2307/412 , B32B2307/706 , B32B2457/00 , B32B2457/202 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , G02F1/13452 , G02F1/13454 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27334 , H01L2224/29076 , H01L2224/2908 , H01L2224/29083 , H01L2224/2919 , H01L2224/29195 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/29394 , H01L2224/29395 , H01L2224/294 , H01L2224/29486 , H01L2224/29494 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/75301 , H01L2224/81488 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83488 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2224/83907 , H01L2924/01006 , H01L2924/01049 , H01L2924/0105 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H01L2924/07802 , H01L2924/07811 , H01L2924/351 , H01L2924/3511 , H01L2924/381 , Y10T156/1039 , Y10T428/24562 , H01L2924/00012 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2924/07025 , H01L2924/066 , H01L2924/06 , H01L2924/00014 , H01L2924/0615
摘要: 本发明目的在于在利用各向异性导电膜的连接中,谋求降低连接后的基板翘曲。各向异性导电膜(23)包括:第1绝缘性粘接剂层(30);第2绝缘性粘接剂层(31);以及被第1绝缘性粘接剂层(30)及第2绝缘性粘接剂层(31)挟持并在绝缘性粘接剂(33)含有导电性粒子(32)的含导电性粒子层(34),在含导电性粒子层(34)与第1绝缘性粘接剂层(30)之间含有气泡(41),含导电性粒子层(34)中,与第2绝缘性粘接剂层(31)相接的导电性粒子(32)的下部的硬化度低于其他部位的硬化度。
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公开(公告)号:CN104617055A
公开(公告)日:2015-05-13
申请号:CN201410755931.2
申请日:2014-09-03
申请人: 罗门哈斯电子材料有限公司
CPC分类号: H01L23/295 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2250/24 , B32B2264/10 , B32B2307/748 , B32B2457/00 , H01L21/563 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/29387 , H01L2224/29388 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/83207 , H01L2224/9211 , H01L2924/12042 , Y10T428/31504 , Y10T428/31551 , Y10T428/31721 , Y10T428/31725 , Y10T428/31786 , H01L2924/207 , H01L2924/206 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2224/81 , H01L2224/83
摘要: 用作为预施加的底部填充材料的底部填充结构包含具有第一聚合物区域和第二聚合物区域的聚合物层,其中,所述第二聚合物区域包含无机填料。包含芯片或模具和基片的电子组件使用这样的多层结构的预施加的底部填充来形成。
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公开(公告)号:CN102977798B
公开(公告)日:2015-04-29
申请号:CN201210425130.0
申请日:2008-08-29
申请人: 日立化成株式会社
IPC分类号: C09J4/00 , C09J4/02 , C09J9/02 , H01L23/488
CPC分类号: H05K3/323 , C09J4/00 , C09J9/02 , H01B1/24 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/2949 , H01L2224/32227 , H01L2224/8385 , H01L2224/83851 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K2201/0129 , H01L2924/00
摘要: 本发明提供粘接剂以及使用该粘接剂的连接结构体。本发明提供一种电路部件连接用粘接剂,其含有(a)热塑性树脂、(b)30℃以下为固体的自由基聚合性化合物、(c)自由基聚合引发剂、(d)在分子内具有至少一个以上磷酸基的乙烯系化合物、以及尿烷(甲基)丙烯酸酯低聚物,(b)30℃以下为固体的自由基聚合性化合物包含环氧基丙烯酸酯,(b)30℃以下为固体的自由基聚合性化合物的含量相对于100质量份的(a)热塑性树脂为5~100质量份。
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公开(公告)号:CN104513632A
公开(公告)日:2015-04-15
申请号:CN201410521172.3
申请日:2014-09-30
申请人: 三星SDI株式会社
IPC分类号: C09J7/00 , C09J163/00 , C09J171/12 , C09J11/04 , C09J9/02 , H01B5/14
CPC分类号: H01L24/29 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/2712 , H01L2224/29005 , H01L2224/29083 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32145 , H01L2224/32227 , H01L2224/83203 , H01L2224/83851 , H01L2924/0665 , H01L2924/15788 , H01L2924/20104 , H01L2924/20105 , H01L2924/2064 , H01L2924/20641 , H01L2924/30101 , H05K3/323 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0542 , H01L2924/0103 , H01L2924/0532 , H01L2924/01012 , H01L2924/05342 , H01L2924/0544 , H01L2924/01082 , H01L2924/053 , H01L2924/01083 , H01L2924/0536 , H01L2924/01042 , H01L2924/0535 , H01L2924/01023 , H01L2924/01041 , H01L2924/01073 , H01L2924/01074 , H01L2924/0543 , H01L2924/01049 , H01L2924/00014 , H01L2924/014 , H01L2924/01006
摘要: 本发明公开了一种各向异性导电膜和一种使用所述各向异性导电膜的半导体装置。所述各向异性导电膜具有三层结构,包含第一绝缘层、导电层和第二绝缘层,所述三层以此顺序依序堆叠。所述各向异性导电膜可通过调整所述各别层的流动性使得终端之间的空间可由所述绝缘层充分填充且可抑制导电粒子向所述空间中流出来防止终端之间短路并具有提高的连接可靠性。
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公开(公告)号:CN104508062A
公开(公告)日:2015-04-08
申请号:CN201380020499.6
申请日:2013-04-01
申请人: 迪睿合电子材料有限公司
IPC分类号: C09J7/00 , C09J9/02 , C09J11/06 , C09J129/14 , C09J201/00 , H01L21/60 , H01R11/01 , H05K3/32
CPC分类号: H01L24/83 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/92 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29444 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/83907 , H01L2224/9211 , H01L2924/15788 , H01R4/04 , H05K3/323 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要: 提供一种具有优异的低温固化性的电路连接材料和使用该电路连接材料的安装体的制备方法。制成第1粘接剂层与第2粘接剂层层叠的2层结构,所述第1粘接剂层含有聚乙烯醇缩醛树脂、阳离子聚合性树脂、阳离子聚合引发剂和导电性粒子,所述第2粘接剂层含有阳离子聚合性树脂和阳离子聚合引发剂。由此,在低温下进行压接的情况下也可得到导电性粒子的高捕捉效率,可改善低温固化性。
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公开(公告)号:CN103681374A
公开(公告)日:2014-03-26
申请号:CN201210352533.7
申请日:2012-09-20
申请人: 矽品精密工业股份有限公司
CPC分类号: H01L21/56 , H01L21/486 , H01L21/563 , H01L21/6836 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/83005 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2924/141 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/014
摘要: 一种封装件的制法,其包括:提供一具有相对的第一表面与第二表面的基板本体,该基板本体具有贯穿该第一表面与第二表面的多个导电通孔,且借其第二表面的一侧接置于一第一承载片上并使该第一承载片不翘曲;于该基板本体的第一表面上电性接置至少一第一半导体芯片;移除该第一承载片;以及将该基板本体的第二表面电性接置于一封装基板上。本发明能有效减少封装件的翘曲现象,且具有较高的良率、较低的制造成本及较佳的散热效果。
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公开(公告)号:CN103042320A
公开(公告)日:2013-04-17
申请号:CN201210504385.6
申请日:2012-09-29
申请人: 罗门哈斯电子材料有限公司
IPC分类号: B23K35/363 , B23K1/00
CPC分类号: B23K1/0016 , B23K1/203 , C08K5/09 , C08K5/17 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11334 , H01L2224/131 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29387 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81143 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H05K3/3436 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , C08L63/00 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要: 可固化助焊剂组合物和焊接方法。提供一种可固化助焊剂组合物,包括作为起始成分的:每分子具有至少两个环氧乙烷基团的树脂组分;羧酸;式I代表的助焊试剂,其中R1,R2,R3和R4独立地选自氢、取代的C1-80烷基、未取代的C1-80烷基、取代的C7-80芳烷基和未取代的C7-80芳烷基;并且R1,R2,R3和R4中的0到3个是氢;以及任选的固化剂。还提供一种使用可固化助焊剂组合物焊接电接触点的方法。
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公开(公告)号:CN102163563B
公开(公告)日:2013-03-27
申请号:CN201010624989.5
申请日:2010-11-23
申请人: 陶氏环球技术公司
CPC分类号: H01L21/563 , C08G59/027 , C09D163/00 , C09J163/00 , H01L23/293 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/1132 , H01L2224/11462 , H01L2224/11849 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13294 , H01L2224/133 , H01L2224/16227 , H01L2224/2929 , H01L2224/29387 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/8309 , H01L2224/83102 , H01L2224/83862 , H01L2224/92125 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2224/16225 , H01L2924/00 , H01L2924/0665 , H01L2924/014 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432
摘要: 公开了一种低粘度的、低至不含氯化物的包括二乙烯基苯二氧化物作为成分的环氧树脂制剂;其中该制剂可以用来生产毛细填充组合物。
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公开(公告)号:CN101848974A
公开(公告)日:2010-09-29
申请号:CN200880114602.2
申请日:2008-10-28
申请人: LG化学株式会社
IPC分类号: C09J163/00
CPC分类号: C09J163/00 , C08G59/621 , C08K3/36 , C08K5/0025 , C08K5/13 , C08K5/3445 , C09J7/35 , C09J7/385 , C09J133/068 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/94 , H01L2221/68327 , H01L2221/68336 , H01L2221/68377 , H01L2221/68381 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/32225 , H01L2224/83191 , H01L2224/83862 , H01L2224/94 , H01L2924/00014 , H01L2924/0615 , H01L2924/351 , H01L2924/3511 , Y10T428/287 , Y10T428/2891 , Y10T428/31515 , H01L2924/0665 , H01L2924/0635 , H01L2924/06 , H01L2224/27 , H01L2924/00012 , H01L2224/48 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本发明涉及一种用于半导体封装工艺的切割模片粘合膜和应用该切割模片粘合膜的半导体器件。设置该切割模片粘合膜,从而使晶片和模片粘合部分的粘合层之间的粘合力X与模片粘合部分和切割部分的粘性层之间的粘性力Y的比值X/Y为0.15-1,并且模片粘合部分的粘合层在常温下的储能模量为100-1000MPa。根据本发明的切割模片粘合膜在切割工艺中能减少毛刺的产生,由此制备的半导体器件具有优异的可靠性并且没有由于覆盖结合区的毛刺而因差的连接可靠性所导致的劣化。
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公开(公告)号:CN101523587A
公开(公告)日:2009-09-02
申请号:CN200780036750.2
申请日:2007-09-28
申请人: 日立化成工业株式会社
IPC分类号: H01L21/52 , C09J11/04 , C09J179/08
CPC分类号: H01L23/3114 , C08G18/10 , C08G18/2825 , C08G18/4854 , C08G73/10 , C08L79/08 , C09D179/08 , C09J175/12 , C09J179/08 , H01L23/13 , H01L23/49816 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83805 , H01L2224/83855 , H01L2224/83856 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , C08G18/346 , H01L2924/00014 , H01L2924/07025 , H01L2924/069 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/05381 , H01L2924/05341 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要: 本发明涉及一种晶片接合用树脂浆料,其含有由右通式(I)表示的聚氨酯酰亚胺树脂、热固性树脂、填料和印刷用溶剂。通式(I)中,R1表示包含芳香环或脂肪环的2价有机基团,R2表示分子量100~10,000的2价有机基团,R3表示包含4个以上碳原子的4价有机基团,n和m各自独立地表示1~100的整数。
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