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公开(公告)号:CN105097752A
公开(公告)日:2015-11-25
申请号:CN201410790717.0
申请日:2014-12-18
申请人: 联发科技股份有限公司
IPC分类号: H01L23/492 , H01L23/49 , H01L23/50
CPC分类号: H01L25/0655 , H01L23/49575 , H01L23/50 , H01L23/5221 , H01L23/528 , H01L23/5381 , H01L23/5386 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/0612 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48137 , H01L2224/48138 , H01L2224/48139 , H01L2224/48227 , H01L2224/48465 , H01L2224/48479 , H01L2224/4903 , H01L2224/4909 , H01L2224/4911 , H01L2224/4912 , H01L2224/4917 , H01L2224/49171 , H01L2224/4945 , H01L2224/73265 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/92247 , H01L2924/00014 , H01L2924/00012 , H01L2224/05599 , H01L2924/00015 , H01L2924/00 , H01L2224/4554
摘要: 本发明提供一种半导体封装结构,包含基底;第一裸芯片,安装在基底,包含布置于第一排的具有第一焊盘面积的多个第一焊盘;以及布置于第二排的具有第二焊盘面积的多个第二焊盘;以及第二裸芯片,安装于基底,包含具有第一焊盘面积的多个第三焊盘,以及具有第二焊盘面积的多个第四焊盘,交替布置于第三排;第一接合导线,具有两个端,分别耦合到第一焊盘的一个和第四焊盘的一个;以及第二接合导线,具有两个端,分别耦合到第三焊盘的一个和第二焊盘的一个。通过上述技术方案,可以减少焊盘间距和焊盘占据面积从而有效地减少芯片大小。
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公开(公告)号:CN101490832A
公开(公告)日:2009-07-22
申请号:CN200780026988.7
申请日:2007-06-29
申请人: 埃普科斯股份有限公司
IPC分类号: H01L21/603 , H01L21/607 , H01L23/485 , H01L23/31 , H01L23/14 , H01L23/15
CPC分类号: H01L24/85 , H01L23/3121 , H01L23/3171 , H01L23/49822 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05644 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/4945 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85201 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15798 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要: 提出一种用于电的器件的模块,其中在多层的衬底上设有集成的线路,且在所述衬底上设有可键合的连接面,在上方将器件芯片粘贴到所述衬底上,所述器件芯片的向上的表面具有键合垫,所述器件芯片通过键合引线与所述衬底接触。在此这些键合引线如下布线,即它们分别通过焊球键合到连接面上,且通过楔形部直接键合到键合垫上。
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公开(公告)号:CN101114628A
公开(公告)日:2008-01-30
申请号:CN200710001452.1
申请日:2007-01-08
申请人: 富士通株式会社
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L23/3128 , H01L23/4952 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/4813 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48482 , H01L2224/48487 , H01L2224/48499 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/4899 , H01L2224/48992 , H01L2224/4911 , H01L2224/49112 , H01L2224/4917 , H01L2224/49426 , H01L2224/49429 , H01L2224/4945 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85205 , H01L2224/85206 , H01L2224/85951 , H01L2224/85986 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/30105 , H01L2224/85181 , H01L2924/0665 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2224/48455 , H01L2224/4554
摘要: 本发明提供一种小且高性能的半导体器件及该半导体器件的有效制造方法,在该半导体器件中防止了相邻导线的接触,从而提高了设计线路配置图的灵活性。本发明的半导体器件包括:基板10,其表面上设置有电极21A;以及第一半导体元件11A,包括设置在其表面上的电极22,并且该第一半导体元件11A由该基板10支撑,其中,第一导线41通过第一凸块31连接到该基板10和该第一半导体元件11A的上方的所述电极中的至少一个电极(即电极21和电极22中的至少一个),并且第二导线42通过第二凸块32连接到第一导线41的焊接部分。
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公开(公告)号:CN1197156C
公开(公告)日:2005-04-13
申请号:CN01135776.2
申请日:2001-10-17
申请人: 三菱电机株式会社
发明人: 道井一成
CPC分类号: H01L24/49 , H01L23/3121 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/32145 , H01L2224/32245 , H01L2224/32257 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48599 , H01L2224/49171 , H01L2224/4945 , H01L2224/73265 , H01L2224/85148 , H01L2224/85191 , H01L2224/85205 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/48227 , H01L2924/00015 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要: 在一种半导体设备中,层叠半导体芯片由具有其上被安排焊盘的主面和背面的半导体芯片构成,将上层半导体芯片的背面固定到下层半导体芯片的主面上,呈阶梯状错位,使焊盘不重叠,层叠半导体芯片的背面被固定到提供压料垫沉埋的引导框架到压料垫一个面。在层叠半导体芯片上的焊盘和相应的内部引线被用反向金属线焊接通过金属线连接,内部引线,层叠半导体芯片,金属线,接合材料,和压料垫的五个主要的面被用密封材料覆盖,从密封材料的外部面露出压料垫的背面。
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公开(公告)号:CN1137173A
公开(公告)日:1996-12-04
申请号:CN96104519.1
申请日:1996-04-10
申请人: 富士通株式会社
IPC分类号: H01L21/60
CPC分类号: H01L24/85 , B23K20/004 , B23K2101/40 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4945 , H01L2224/78301 , H01L2224/78302 , H01L2224/85009 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01013 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/48227 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399
摘要: 一种丝焊方法,包括:第一焊接工序,用来在金属丝中形成第一球形部分并把第一球形部分焊到第一被连接件上;球形部分形成工序,用来引导金属丝离开其被焊到内引线上的位置从而形成一预定的环,以及第二焊接工序,用于在金属丝的预定位置中形成第二球形部分;以及第二焊接工序;用于把第二球形部分焊接到作为第二被连接件的半导体元件的焊盘上。
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公开(公告)号:CN101675518B
公开(公告)日:2012-12-05
申请号:CN200780052927.8
申请日:2007-05-10
申请人: 飞思卡尔半导体公司
IPC分类号: H01L23/50 , H01L23/498
CPC分类号: H01L23/49816 , H01L23/3128 , H01L23/4951 , H01L23/49833 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48471 , H01L2224/49175 , H01L2224/49433 , H01L2224/4945 , H01L2224/85191 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要: 形成了一种封装组件(30),诸如球栅阵列封装,其通过使用置于集成电路管芯(52)上并且接合至BGA载体基板(42)中和内部管芯区域中形成的多个接合焊盘(45)的被包封的构图的引线框导体(59),跨集成电路管芯(52)的内部区域分送功率,由此将该内部管芯区域电耦合至外部提供的参考电压。
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公开(公告)号:CN101675518A
公开(公告)日:2010-03-17
申请号:CN200780052927.8
申请日:2007-05-10
申请人: 飞思卡尔半导体公司
IPC分类号: H01L23/50 , H01L23/498
CPC分类号: H01L23/49816 , H01L23/3128 , H01L23/4951 , H01L23/49833 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/91 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48471 , H01L2224/49175 , H01L2224/49433 , H01L2224/4945 , H01L2224/85191 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/4554
摘要: 形成了一种封装组件(30),诸如球栅阵列封装,其通过使用置于集成电路管芯(52)上并且接合至BGA载体基板(42)中和内部管芯区域中形成的多个接合焊盘(45)的被包封的构图的引线框导体(59),跨集成电路管芯(52)的内部区域分送功率,由此将该内部管芯区域电耦合至外部提供的参考电压。
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公开(公告)号:CN101378051A
公开(公告)日:2009-03-04
申请号:CN200810212644.1
申请日:2008-08-27
申请人: 富士通株式会社
发明人: 西村隆雄
IPC分类号: H01L25/00 , H01L23/488 , H01L23/13 , H01L21/50 , H01L21/60
CPC分类号: H01L25/0657 , H01L21/565 , H01L23/3128 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/75 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/06136 , H01L2224/1134 , H01L2224/1308 , H01L2224/13144 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/4943 , H01L2224/4945 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/81203 , H01L2224/81801 , H01L2224/83099 , H01L2224/8314 , H01L2224/83191 , H01L2224/83192 , H01L2224/83444 , H01L2224/83455 , H01L2224/8385 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85191 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10161 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/30107 , H01L2224/85186 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/0695 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要: 本发明公开一种半导体器件及其制造方法,该半导体器件包括:支撑基底,上面放置电极端子;中间部件,安装在所述支撑基底上;半导体元件,所述半导体元件的一部分由所述中间部件支撑,并放置在所述支撑基底上;以及凸起形部件,与所述半导体元件的电极端子相对应,并放置在所述支撑基底上或者放置在所述中间部件上;其中,所述半导体元件的电极端子与所述支撑基底的电极端子通过接合导线相连接。利用本发明,在采用导线接合工艺的情况下,抑制了半导体元件的弯曲,能够防止对半导体元件的损坏。
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公开(公告)号:CN101123230A
公开(公告)日:2008-02-13
申请号:CN200710045546.9
申请日:2007-09-03
申请人: 葵和精密电子(上海)有限公司
IPC分类号: H01L23/48 , H01L23/482 , H01L23/488
CPC分类号: H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/0603 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48482 , H01L2224/48499 , H01L2224/48599 , H01L2224/49107 , H01L2224/49111 , H01L2224/4945 , H01L2224/73265 , H01L2224/85051 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/01082 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/20752 , H01L2924/20755 , H01L2224/78 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要: 本发明涉及一种半导体器件的内引线结构,包括用来电连接引线框架与装载在所述引线框架上芯片的内引线,其特征在于,在所述芯片的表面对应与所述内引线连接处焊接有桥接结构,所述桥接结构为金属介质,具体的,为金球或金合金球。半导体器件的内引线结构通过所述的桥接结构使内引线与所述芯片形成电连接,彻底解决了完全使用其它金属材料如铜作为内引线的工艺上的缺陷,提高了生产效率及产品的可靠性,同时比使用金线作为半导体器件的内引线大大节省了成本。
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公开(公告)号:CN1917199A
公开(公告)日:2007-02-21
申请号:CN200610114969.7
申请日:2006-08-14
申请人: 半导体元件工业有限责任公司
发明人: 弗朗西斯·J·卡尔尼 , 迈克尔·J·瑟登
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L24/97 , H01L23/3121 , H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/10165 , H01L2224/1134 , H01L2224/32245 , H01L2224/33181 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40091 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4813 , H01L2224/48247 , H01L2224/48463 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/4945 , H01L2224/73219 , H01L2224/73221 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2224/85191 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2224/85 , H01L2224/84 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要: 一种半导体部件,其具有一个位置可适变的锁定结构,和一种使用丝线接合工具制造该半导体部件的方法。提供一个导电支持基片,其具有标记部分、丝线部分和连接杆。半导体芯片与该导电支持基片的标记部分耦连。导电固定结构将半导体芯片与丝线部分耦连。在导电基片上形成一个或多个位置可适变的锁定结构,使得它们从基片上方延伸。选择地,可以在导电固定结构、半导体芯片、连接杆、其它电路元件或其组合上形成位置可适变的锁定结构。该位置可适变的锁定结构可以是接合丝线、丝线接合柱等。用密封剂密封该半导体芯片、导电基片、导电固定结构和位置可适变的锁定结构。
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