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公开(公告)号：US20120155055A1
公开(公告)日：2012-06-21
申请号：US13157722
申请日：2011-06-10
申请人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
发明人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
CPC分类号： H01L24/81 , B23K1/0016 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/13016 , H01L2224/13017 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/8138 , H01L2224/81801 , H01L2224/8185 , H01L2224/831 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K1/113 , H05K3/341 , H05K3/4007 , H05K2201/0195 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00014
摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.
摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。
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公开(公告)号：US09137903B2
公开(公告)日：2015-09-15
申请号：US13157722
申请日：2011-06-10
申请人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
发明人： Teck-Gyu Kang , Wei-Shun Wang , Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
CPC分类号： H01L24/81 , B23K1/0016 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/73 , H01L2224/13016 , H01L2224/13017 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/8138 , H01L2224/81801 , H01L2224/8185 , H01L2224/831 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K1/113 , H05K3/341 , H05K3/4007 , H05K2201/0195 , Y10T29/49126 , Y10T29/4913 , H01L2924/00 , H01L2924/00014
摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.
摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。
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3.发明授权公开(公告)号：US08618659B2
公开(公告)日：2013-12-31
申请号：US13462158
申请日：2012-05-02
申请人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/48
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译： 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。
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公开(公告)号：US20120280386A1
公开(公告)日：2012-11-08
申请号：US13462158
申请日：2012-05-02
申请人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
发明人： Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号： H01L23/498 , H01L21/56 , H01L21/50 , H01L23/48
CPC分类号： H01L21/4885 , H01L21/565 , H01L23/13 , H01L23/3121 , H01L23/49517 , H01L23/49811 , H01L23/5389 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/06565 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L2924/00013 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.
摘要翻译： 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。
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公开(公告)号：US08299626B2
公开(公告)日：2012-10-30
申请号：US11894036
申请日：2007-08-16
申请人： Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
发明人： Ilyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
IPC分类号： H01L21/50
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。
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公开(公告)号：US20090045524A1
公开(公告)日：2009-02-19
申请号：US11894036
申请日：2007-08-16
申请人： IIyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
发明人： IIyas Mohammed , Belgacem Haba , Sean Moran , Wei-Shun Wang , Ellis Chau , Christopher Wade
CPC分类号： H01L23/48 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L2224/06135 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15312 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.
摘要翻译： 微电子封装包括具有导电特征的下单元衬底和顶表面和底表面的下单元。 下部单元包括一个或多个下部单元芯片，其跨过下部单元基板的顶表面电连接到下部单元基板的导电特征。 微电子封装还包括上部单元，其包括具有导电特征的上部单元基板，顶部和底部表面以及在该顶部和底部表面之间延伸的孔。 上部单元还包括一个或多个上部单元芯片，其覆盖在上部单元基板的顶表面上，并且通过在孔内延伸的连接电连接到上部单元基板的导电特征。 上部单元可以包括覆盖上部单元和一个或多个上部单元芯片的连接的上部单元密封剂。
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公开(公告)号：US20130093087A1
公开(公告)日：2013-04-18
申请号：US13404408
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
IPC分类号： H01L23/498
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 90° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
摘要翻译： 微电子封装可以包括引线键合，其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和90°之间的角度设置的外部边缘表面，并且远离基部远离，例如相反，并且远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分开，其中引线键合的未封装部分由引线键的部分限定， 被封装层覆盖的未包封部分包括引线的端部。
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公开(公告)号：US20130095610A1
公开(公告)日：2013-04-18
申请号：US13404458
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
摘要翻译： 微电子封装可以包括引线键合，其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和92°之间的角度设置的外部边缘表面，并且远离基部远离，例如相反，并远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分开，其中引线键合的未封装部分由引线键的部分限定， 被封装层覆盖的未包封部分包括引线的端部。
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公开(公告)号：US09105483B2
公开(公告)日：2015-08-11
申请号：US13404408
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L25/10 , H01L25/00 , H01L23/495 , H01L21/48 , H01L23/367 , H01L23/433 , H01L21/56 , H01L25/065 , H05K3/34
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 90° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
摘要翻译： 微电子封装可以包括引线键合，其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和90°之间的角度设置的外部边缘表面，并且远离基部远离，例如相反，并且远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分开，其中引线键合的未封装部分由引线键的部分限定， 被封装层覆盖的未包封部分包括引线的端部。
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公开(公告)号：US08836136B2
公开(公告)日：2014-09-16
申请号：US13405108
申请日：2012-02-24
申请人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang , Zhijun Zhao
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.
摘要翻译： 微电子封装可以包括引线键合，其具有结合到衬底上的相应导电元件的底部并且与基底相对的端部。 从衬底延伸的电介质封装层覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分离，其中引线键合的未封装部分由未被覆盖的引线键的部分限定 通过封装层。 未封装的部分可以布置在具有最小间距的图案的位置处，该最小间距大于相邻引线键的基部之间的第一最小间距。
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