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    Methods for etching a less reactive material in the presence of a more reactive material
    129.
    发明授权
    Methods for etching a less reactive material in the presence of a more reactive material 失效
    在更多反应性材料存在下蚀刻较少反应性材料的方法

    公开(公告)号：US5304284A

    公开(公告)日：1994-04-19

    申请号：US785445

    申请日：1991-10-18

    申请人： Rangarajan Jagannathan ,  Sampath Purushothaman ,  Scott A. Sikorski

    发明人： Rangarajan Jagannathan ,  Sampath Purushothaman ,  Scott A. Sikorski

    IPC分类号： C23F1/44 ,  C01B7/19 ,  C23F1/10 ,  H01L21/306 ,  H01L21/3213 ,  H01L21/00

    CPC分类号： C01B7/196 ,  C01B7/191 ,  C23F1/10 ,  H01L21/32136

    摘要： A method is described for providing a body of first material and a body of second material in a chemical environment wherein the first material contains first constituents having a lower and higher oxidation state and wherein the second material contains constituents having an oxidation state of energy greater than lower oxidation state of the first constituent. The environment is further provided with first cations energetically disposed for receiving electrons from the first constituents but not energetically disposed for receiving electrons from the second constituents. Electrons transfer from the first constituents to the first cations which are transformed thereby into second cations of lower oxidation state resulting in first body releasing into the environment third cations which are cations of the first (lower) oxidation state of the first constituent. The environment is further provided with an agent which consumes the second and third cations thereby permitting release into the environment additional ones of the third cations resulting in the first body being preferably etched with respect to the second body. The method is useful to etch copper in the presence of more highly reactive materials such as chrome, lead, tin, titanium, aluminum, iron, cobalt, and galvanically more active gold and nickel. The method is useful for forming structures containing copper having an overlying layer of the more highly reactive material without the requirement of the use of a resist material.

    摘要翻译： 描述了一种用于在化学环境中提供第一材料体和第二材料体的方法，其中所述第一材料包含具有较低和较高氧化态的第一组分，并且其中所述第二材料含有能量的氧化态大于 较低的第一成分的氧化态。 所述环境还具有能量地设置用于接收来自所述第一成分的电子的第一阳离子，但未被能量地设置以接收来自所述第二组分的电子。 电子从第一组分转移到第一阳离子，由此将其转化为较低氧化态的第二阳离子，导致第一体体向第一组分的第一（较低）氧化态的阳离子释放出第三阳离子。 环境还具有消耗第二和第三阳离子从而允许释放到环境中的试剂，优选地，相对于第二体蚀刻第一体的另外的第三阳离子。 该方法可用于在更高反应性的材料如铬，铅，锡，钛，铝，铁，钴和电流更活泼的金和镍的存在下蚀刻铜。 该方法可用于形成含有具有更高反应性材料的上层的铜的结构，而不需要使用抗蚀剂材料。