公开(公告)号：US20100232129A1

公开(公告)日：2010-09-16

申请号：US12769930

申请日：2010-04-29

申请人： Belgacem Haba ,  Teck-Gyu Kang ,  Ilyas Mohammed ,  Ellis Chau

发明人： Belgacem Haba ,  Teck-Gyu Kang ,  Ilyas Mohammed ,  Ellis Chau

IPC分类号： H05K7/00

CPC分类号： H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.

摘要翻译： 制造微电子组件的方法包括提供具有衬底，覆盖衬底的微电子元件和从衬底的表面突出的至少两个导电元件的微电子封装，所述至少两个导电元件具有远离所述衬底的表面的表面 基质。 该方法包括压缩至少两个导电元件使其远端表面位于公共平面中，并且在压缩步骤之后，提供围绕至少两个导电元件的密封剂材料，用于支撑微电子封装并使得远端表面 所述至少两个导电元件在所述密封剂材料的外表面处保持可接近。

公开(公告)号：US20070148822A1

公开(公告)日：2007-06-28

申请号：US11318404

申请日：2005-12-23

申请人： Belgacem Haba ,  Teck-Gyu Kang ,  Ilyas Mohammed ,  Ellis Chau

发明人： Belgacem Haba ,  Teck-Gyu Kang ,  Ilyas Mohammed ,  Ellis Chau

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.

摘要翻译： 制造微电子组件的方法包括提供具有衬底，覆盖衬底的微电子元件和从衬底的表面突出的至少两个导电元件的微电子封装，所述至少两个导电元件具有远离所述衬底的表面的表面 基质。 该方法包括压缩至少两个导电元件使其远端表面位于公共平面中，并且在压缩步骤之后，提供围绕至少两个导电元件的密封剂材料，用于支撑微电子封装并使得远端表面 所述至少两个导电元件在所述密封剂材料的外表面处保持可接近。

公开(公告)号：US20120068338A1

公开(公告)日：2012-03-22

申请号：US12883821

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/52

CPC分类号： H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

摘要翻译： 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US09136197B2

公开(公告)日：2015-09-15

申请号：US13472081

申请日：2012-05-15

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06156 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.

摘要翻译： 微电子组件包括互连元件，导电平面，微电子器件，多个迹线以及第一和第二接合元件。 互连元件包括电介质元件，多个元件触点及其上的至少一个参考触点。 该微电子器件包括一个正面，其中设有触点暴露在该表面上。 导电平面覆盖微电子器件前表面的一部分。 覆盖导电平面表面的迹线与其绝缘，并与元件触点电连接。 迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分，使得对于迹线实现期望的阻抗。 第一接合元件将至少一个导电平面与至少一个参考触点电连接。 第二接合元件将器件触点与迹线电连接。

公开(公告)号：US08222725B2

公开(公告)日：2012-07-17

申请号：US12883811

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/00013

摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.

摘要翻译： 微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。

公开(公告)号：US20080185705A1

公开(公告)日：2008-08-07

申请号：US11895191

申请日：2007-08-23

申请人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

发明人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.

摘要翻译： 微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子 并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。 柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。 导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。

公开(公告)号：US08786083B2

公开(公告)日：2014-07-22

申请号：US12883821

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/52

CPC分类号： H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

摘要翻译： 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US20120313228A1

公开(公告)日：2012-12-13

申请号：US13472081

申请日：2012-05-15

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L25/07

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06156 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.

摘要翻译： 微电子组件包括互连元件，导电平面，微电子器件，多个迹线以及第一和第二接合元件。 互连元件包括电介质元件，多个元件触点及其上的至少一个参考触点。 该微电子器件包括一个正面，其中设有触点暴露在该表面上。 导电平面覆盖微电子器件前表面的一部分。 覆盖导电平面表面的迹线与其绝缘，并与元件触点电连接。 迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分，使得对于迹线实现期望的阻抗。 第一接合元件将至少一个导电平面与至少一个参考触点电连接。 第二接合元件将器件触点与迹线电连接。

公开(公告)号：US20120068365A1

公开(公告)日：2012-03-22

申请号：US12883811

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/49 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/00013

摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.

摘要翻译： 微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。

公开(公告)号：US20130095610A1

公开(公告)日：2013-04-18

申请号：US13404458

申请日：2012-02-24

申请人： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

发明人： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC分类号： H01L21/60 ,  H01L21/58 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.

摘要翻译： 微电子封装可以包括引线键合，其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和92°之间的角度设置的外部边缘表面，并且远离基部远离，例如相反，并远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分开，其中引线键合的未封装部分由引线键的部分限定， 被封装层覆盖的未包封部分包括引线的端部。