公开(公告)号：US20130119322A1

公开(公告)日：2013-05-16

申请号：US13737300

申请日：2013-01-09

Applicant: Eiichi Ide ,  Toshiaki Morita ,  Yusuke Yasuda ,  Hiroshi Hozoji

Inventor： Eiichi Ide ,  Toshiaki Morita ,  Yusuke Yasuda ,  Hiroshi Hozoji

IPC: H01B1/02

CPC classification number: H01B1/02 ,  B22F7/04 ,  H01B1/08 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/27334 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8484 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/2076 ,  H05K1/097 ,  H05K3/321 ,  H05K2201/0224 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 μm as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 μm and the silver oxide particles.

Abstract translation: 提供一种导电烧结层形成组合物和导电烧结层形成方法，其可以通过烧结具有有机物质的金属纳米颗粒的烧结来加速烧结或接合的过程，从而降低加热温度并缩短加热时间。 形成导电烧结层的组合物可以通过利用颗粒可以通过将氧化银与涂覆有机物质的金属颗粒混合并且与烧结相比具有1nm至5μm的颗粒尺寸而在低温下烧结的现象获得 物质。 本发明的导电性烧结层形成用组合物的特征在于，其含有表面被有机物质覆盖，粒径为1nm〜5μm的金属粒子和氧化银粒子。

公开(公告)号：US08421247B2

公开(公告)日：2013-04-16

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  B32B5/16 ,  C09K5/00 ,  C22C5/06

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: A connecting material that includes metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy and a mean particle size between 0.1 μm and 50 μm; and especially a connecting material that includes metallic particles that have been subjected to treatment for removal of a surface oxide film and subjected to surface treatment with a surface protective material, so as to provide a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C.; as well as a semiconductor device employing the connecting material to bond a semiconductor element to a support member.

Abstract translation: 一种连接材料，其包含通过X射线光电子能谱测定的氧状态比小于15％的金属颗粒，平均粒径为0.1μm至50μm; 特别是包含金属粒子的连接材料，该金属粒子已被处理去除表面氧化膜并用表面保护材料进行表面处理，从而即使在连接时也提供具有高导热系数的连接材料 在高达200℃的固化温度下，不施加负载，并且即使当固化产物在260℃下被加热时也具有足够的粘合强度; 以及使用连接材料将半导体元件结合到支撑构件的半导体器件。

公开(公告)号：US20120220072A1

公开(公告)日：2012-08-30

申请号：US13311276

申请日：2011-12-05

Applicant: Dong Hoon KIM ,  Sung Il Oh ,  Sung Koo Kang ,  Byung Ho Jun ,  Young Ah Song ,  Seong Jin Kim ,  Byoung Jin Chun

Inventor： Dong Hoon KIM ,  Sung Il Oh ,  Sung Koo Kang ,  Byung Ho Jun ,  Young Ah Song ,  Seong Jin Kim ,  Byoung Jin Chun

IPC: H01L31/18 ,  H01L21/283 ,  H05K3/12 ,  B05D3/02 ,  H01B1/22 ,  B05D5/12

CPC classification number: H01B1/22 ,  H01L31/022425 ,  H05K1/095 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/122 ,  Y02E10/50

Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.

Abstract translation: 提供了可以在较低温度下煅烧的铜纳米糊剂。 铜纳米糊包括：添加量为0.1〜30重量份的粘合剂; 添加量不超过10重量份的添加剂; 铜粒子的添加量为1〜95重量份，其中，铜粒子的粒径为150nm以下，铜粒子的表面被覆盖材料覆盖。

公开(公告)号：US08206614B2

公开(公告)日：2012-06-26

申请号：US12356490

申请日：2009-01-20

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/06

CPC classification number: H01B3/006 ,  B82Y10/00 ,  H01B1/24 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0738 ,  Y10T428/2991

Abstract: A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.

Abstract translation: 一种电压可切换电介质材料，其包含通过机械或机械化学键合方法单独形成的多组分颗粒的浓度，所述机械或机械化学键合方法将半导体或导电型主体颗粒与多个绝缘，导电或半导电的客体颗粒结合。

公开(公告)号：US20110318478A1

公开(公告)日：2011-12-29

申请号：US13168465

申请日：2011-06-24

Applicant: Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

Inventor： Sachin Parashar ,  Siuli Sarkar ,  Oscar Khaselev ,  Brian G. Lewis ,  Michael T. Marczi ,  Bawa Singh ,  Nitin Desai ,  Michael Liberatore

IPC: B05D5/12 ,  C07F1/10 ,  B05D3/12 ,  B05D1/02 ,  H01B1/22 ,  B22F9/00 ,  B82Y30/00

CPC classification number: C09D11/03 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B82Y30/00 ,  C01P2002/84 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/08 ,  C08K9/04 ,  C09D7/62 ,  C09D7/67 ,  C09D11/00 ,  C09D11/38 ,  C23C24/08 ,  C23C26/00 ,  H01B1/02 ,  H01L51/0022 ,  H05K1/097 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Abstract translation: 提供颗粒和颗粒膜。 在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置的颗粒的工业规模合成。

公开(公告)号：US08012379B2

公开(公告)日：2011-09-06

申请号：US12870275

申请日：2010-08-27

Applicant: Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

Inventor： Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

IPC: H01B1/02 ,  B05D7/00

CPC classification number: H05K1/095 ,  C08G59/66 ,  C08G59/687 ,  C08K5/37 ,  C09J163/00 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0224 ,  H05K2203/122

Abstract: A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

Abstract translation: 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。

公开(公告)号：US20110204125A1

公开(公告)日：2011-08-25

申请号：US13099394

申请日：2011-05-03

Applicant: Yusuke YASUDA ,  Toshiaki MORITA ,  Eiichi IDE ,  Hiroshi HOZOJI ,  Toshiaki ISHII

Inventor： Yusuke YASUDA ,  Toshiaki MORITA ,  Eiichi IDE ,  Hiroshi HOZOJI ,  Toshiaki ISHII

IPC: B23K1/20

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US07981326B2

公开(公告)日：2011-07-19

申请号：US12522422

申请日：2008-01-08

Applicant: Kimitaka Sato ,  Taku Okano

Inventor： Kimitaka Sato ,  Taku Okano

IPC: H01B1/22

CPC classification number: B22F9/24 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0062 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/36 ,  C09D11/52 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0224 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A silver fine powder comprising silver particles with an average particle diameter of 20 nm or less and having an organic protective material on the surface thereof, wherein the proportion of the organic protective material present is 0.05 to 25% by mass based on the total mass of the silver particles and the organic protective material. An amine compound having a molecular weight of 100 to 1,000 is preferably used as the organic protective material, and that having one or more unsaturated bond in one molecule is particularly preferred. This silver fine powder has, for example, a crystallite diameter in (111) crystal plane of silver particle of 20 nm or less. The present invention further provides an ink comprising particles of the silver fine powder dispersed in an organic solvent in the silver concentration of 10% by mass or more, the ink having a viscosity of 50 mPa·s or less.

Abstract translation: 包含平均粒径为20nm以下的银颗粒并且在其表面上具有有机保护材料的银细粉末，其中存在的有机保护材料的比例为基于总重量的0.05〜25质量％ 银颗粒和有机保护材料。 优选使用分子量为100〜1000的胺化合物作为有机保护材料，特别优选在1分子中具有一个以上的不饱和键。 该银细粉末例如为银粒子（111）晶面的微晶直径为20nm以下。 本发明还提供了一种油墨，其包含分散在有机溶剂中的银粉末的银浓度为10质量％以上的油墨，该油墨的粘度为50mPa·s以下。

公开(公告)号：US07955411B2

公开(公告)日：2011-06-07

申请号：US11964827

申请日：2007-12-27

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B32B5/16 ,  B22F1/02

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20110101543A1

公开(公告)日：2011-05-05

申请号：US12990082

申请日：2009-04-28

Applicant: Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

Inventor： Hiroki Hayashi ,  Kaoru Konno ,  Ayako Taira

IPC: H01L23/488 ,  C09K5/00 ,  C22C5/06 ,  B32B5/16

CPC classification number: H05K3/321 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01L23/295 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83464 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K2201/0224 ,  H05K2203/1131 ,  Y10T428/2982 ,  H01L2924/00012 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2224/29101 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.

Abstract translation: 本发明提供了一种连接材料，其包括通过X射线光电子能谱法测量的氧状态比小于15％的金属颗粒，特别是包括已经经过去除表面氧化膜的处理的金属颗粒的连接材料， 为了提供具有高导热系数的连接材料的目的，即使在高达200℃的固化温度下接合而不施加负载，并且具有足够的接合强度 即使固化产物已经在260℃加热，以及使用它的半导体器件也是如此。