公开(公告)号：US07229295B2

公开(公告)日：2007-06-12

申请号：US11468752

申请日：2006-08-30

Applicant: Donald A. Ice ,  Stephen T. Nelson ,  Darin J. Douma

Inventor： Donald A. Ice ,  Stephen T. Nelson ,  Darin J. Douma

IPC: H05K1/00

CPC classification number: H05K3/3405 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4292 ,  H01R13/6315 ,  H05K1/0278 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2203/302

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract translation: 公开了一种具有多个光学子组件和印刷电路板的光收发器模块。 收发器模块包括用于将光学子组件连接到印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以建立光学子组件和印刷电路板之间的连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。

公开(公告)号：US20070047882A1

公开(公告)日：2007-03-01

申请号：US11537645

申请日：2006-09-30

Applicant: Donald Ice

Inventor： Donald Ice

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4245 ,  G02B6/4278 ,  G02B6/428 ,  H05K1/182 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10757 ,  Y10T29/49117 ,  Y10T29/49131 ,  Y10T29/49133

Abstract: An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract translation: 光学子组件与具有成形引线配置的光电封装件结合使用。 引线配置使得成形引线能够与限定在印刷电路板中的通孔通孔电连接，同时最小化空间要求并为引线提供应力消除。 在一个实施例中，公开了一种光学子组件，其包括包含光电子部件的头部以及可与光电子部件可操作地连通的多个导电引线。 每个引线包括从集管的表面延伸的直线部分，端部被定向成由印刷电路板中限定的通孔通道接收，以及插入在直线部分和端部之间的成形部分，并且具有 在第一平面中限定的至少一个弯曲。 光学子组件还包括具有多个空腔的夹具组件，每个腔体接收相应的引线之一。

公开(公告)号：US20070003195A1

公开(公告)日：2007-01-04

申请号：US11468752

申请日：2006-08-30

Applicant: Donald Ice ,  Stephen Nelson ,  Darin Douma

Inventor： Donald Ice ,  Stephen Nelson ,  Darin Douma

IPC: G02B6/36

CPC classification number: H05K3/3405 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4292 ,  H01R13/6315 ,  H05K1/0278 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2203/302

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Abstract translation: 公开了一种具有多个光学子组件和印刷电路板的光收发器模块。 收发器模块包括用于将光学子组件连接到印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以建立光学子组件和印刷电路板之间的连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。

公开(公告)号：US20060279300A1

公开(公告)日：2006-12-14

申请号：US11423808

申请日：2006-06-13

Applicant: Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

Inventor： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US07101197B2

公开(公告)日：2006-09-05

申请号：US10560602

申请日：2004-05-31

Applicant: Tsutomu Naito ,  Tatsuya Oka

Inventor： Tsutomu Naito ,  Tatsuya Oka

IPC: H01R12/00

CPC classification number: H01R12/523 ,  H01R9/22 ,  H01R12/585 ,  H05K1/144 ,  H05K3/308 ,  H05K7/026 ,  H05K2201/1059 ,  H05K2201/10757 ,  Y10S439/949

Abstract: In printed boards arranged in a vertical relationship, outer peripheral portions of an upper printed board are projected outward from outer peripheral portions of a lower printed board. Conductive bodies with terminal holes are arranged side by side on the upper and the lower printed boards along peripheral edges of the boards. Press-fit terminals are arranged in row arrangement along the outer peripheral portions of the printed boards. Each of the press-fit terminals is pressed from below into terminal holes of the two upper and lower printed boards with a long first vertical portion outside and a short second vertical portion inside. This results that a press-fit portion of the second vertical portion is pressed and brought into contact with a terminal hole in a conductive body on a peripheral edge of the lower printed board, a press-fit portion of the first vertical portion is pressed and brought into contact with a terminal hole in a conductive body on a peripheral edge of the upper printed board, and a horizontal portion is supported from below by a step-like portion projected from a printed board retaining case.

Abstract translation: 在以垂直关系布置的印刷电路板中，上印刷电路板的外周部分从下印刷电路板的外周部分向外突出。 具有端子孔的导电体沿着板的周边边缘并排布置在上部和下部印刷板上。 压配合端子沿着印刷电路板的外周部排成排排列。 每个压配端子从下方压入两个上下印刷电路板的端子孔，其中第一垂直部分具有长的第一垂直部分和内部的短的第二垂直部分。 这导致第二垂直部分的压配合部分被压下并与下印刷电路板的周缘上的导电体中的端子孔接触，第一垂直部分的压配合部分被按压，并且 与上印刷电路板的周边边缘上的导电体中的端子孔接触，并且从印刷板保持壳体突出的台阶部分从下方支撑水平部分。

公开(公告)号：US07086149B2

公开(公告)日：2006-08-08

申请号：US09846490

申请日：2001-04-30

Applicant: Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

IPC: H01R43/20

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05085 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20757 ,  H01L2224/05599

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调整范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

公开(公告)号：US20060137815A1

公开(公告)日：2006-06-29

申请号：US11355772

申请日：2006-02-16

Applicant: Masato Koike ,  Katsumi Fujimoto

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: B32B37/00 ,  B32B7/12

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的销连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US20060021792A1

公开(公告)日：2006-02-02

申请号：US10900668

申请日：2004-07-28

Applicant: Bruce Myers ,  Thomas Degenkolb

Inventor： Bruce Myers ,  Thomas Degenkolb

IPC: H05K1/18

CPC classification number: H05K3/3426 ,  H01G9/012 ,  H05K2201/10651 ,  H05K2201/10757 ,  Y02P70/613

Abstract: A surface mountable axial leaded component including a component body, a first component lead and a second component lead. The first component lead extends from a first end of the component body and a second component lead extends from a second end of the component body that is opposite the first end. A portion of the first and second component leads is formed in a loop and a diameter of the loop is at least equal to the diameter of the component body. The loop may be formed as a circular loop, an elliptical loop, a polygon loop, a square loop or rectangular loop, among other loop configurations. When formed as a circular loop, the loop may include a flat segment.

Abstract translation: 一种表面安装的轴向引线元件，包括元件主体，第一元件引线和第二元件引线。 第一部件引线从部件主体的第一端延伸，并且第二部件引线从与第一端相对的部件主体的第二端延伸。 第一和第二部件引线的一部分以环形成，并且环的直径至少等于部件主体的直径。 环可以形成为圆环，椭圆环，多边形环，矩形环或矩形环，以及其他环路配置。 当形成为圆形回路时，环路可以包括平坦段。

公开(公告)号：US20050252948A1

公开(公告)日：2005-11-17

申请号：US10963504

申请日：2004-10-14

Applicant: Atsushi Oohashi

Inventor： Atsushi Oohashi

IPC: H05K7/12 ,  B23K20/00 ,  B23K26/22 ,  B23K31/02 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K26/22 ,  B23K2101/36 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10757 ,  H01L2224/48 ,  H01L2924/00

Abstract: After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.

Abstract translation: 在导线的相应一端固定到印刷电路板上之后，导线弯曲，将印刷电路板带入壳体中，引线的另一端结合到壳体的端子。 由于在基板进入壳体之前处理引线，所以这消除了在引线的弯曲部分的形成和在壳体的狭窄空间内将引线固定到基板上的必要性，并且允许简化 粘接操作。 因此，提供了一种用于将引线与弯曲部分接合到基板的引线接合方法，这简化了接合操作。

公开(公告)号：US20050130497A1

公开(公告)日：2005-06-16

申请号：US10990380

申请日：2004-11-18

Applicant: Yoshihiro Asakura ,  Kenya Kamijo ,  Akihiro Nakanishi ,  Toshihiko Watanabe ,  Toru Aihara

Inventor： Yoshihiro Asakura ,  Kenya Kamijo ,  Akihiro Nakanishi ,  Toshihiko Watanabe ,  Toru Aihara

IPC: H01L21/60 ,  H01J1/00 ,  H01L23/495 ,  H01L23/498 ,  H01L25/10 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01L23/4985 ,  H01L25/105 ,  H01L25/16 ,  H01L2924/0002 ,  H05K2201/10681 ,  H05K2201/10757 ,  Y02P70/613 ,  H01L2924/00

Abstract: On a printed circuit board, there are mounted a pair of first leads, a first semiconductor device mounted on each of the first leads, a pair of second leads, and a second semiconductor device mounted on each of the second leads. A semiconductor device connecting terminal portion of each of the first leads extends to an outer side from the first semiconductor device, and one end of an intermediate slope portion of each of the first leads is bent to an inner side, whereby a substrate connecting terminal portion is structured. Accordingly, since an entire length of each of the first leads is elongated, a stress is absorbed dispersedly, and a tape carrier package is made compact.

Abstract translation: 在印刷电路板上安装有一对第一引线，安装在每个第一引线上的第一半导体器件，一对第二引线和安装在每个第二引线上的第二半导体器件。 连接各个第一引线的端子部的半导体装置从第一半导体装置的外侧延伸，并且每个第一引线的中间斜面部的一端弯曲到内侧，由此基板连接端子部 是结构化的 因此，由于每个第一引线的整个长度是细长的，所以应力被分散地吸收，并且带状载体封装被制成紧凑。