公开(公告)号：US20040188836A1

公开(公告)日：2004-09-30

申请号：US10402101

申请日：2003-03-28

Applicant: Intel Corporation

Inventor： Chung C. Key ,  Leong Kum Foo ,  Pang Toh Tien

IPC: H01L023/48

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2224/10156 ,  H01L2224/81385 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K3/3436 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/0369 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a raised ring. The raised ring circumscribes the pad or surrounds an interior pad or land on the substrate.

Abstract translation: 球栅阵列器件包括衬底，还包括第一主表面和第二主表面。 衬垫阵列位于第一主表面或第二主表面之一上。 至少一些垫包括凸起的环。 凸环围绕衬垫或围绕衬垫或衬底上的衬垫。

公开(公告)号：US20040179373A1

公开(公告)日：2004-09-16

申请号：US10789088

申请日：2004-02-27

Inventor： Masayuki Tamai ,  Keiji Morimoto

IPC: F21V001/00

CPC classification number: H04N1/02815 ,  F21K9/00 ,  F21V23/003 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/3011 ,  H04N1/02865 ,  H04N2201/0404 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode light source unit has a printed circuit board mounting a light-emitting diode (LED) element on its surface. Between the LED element surface-mounted on the printed circuit board and a wiring land formed on the printed circuit board, there is surface-mounted a reflector for directing a beam emitted from the LED element toward an object to be illuminated, and the LED element and the wiring land are connected via a bonding wire.

Abstract translation: 发光二极管光源单元具有在其表面上安装发光二极管（LED）元件的印刷电路板。 在表面安装在印刷电路板上的LED元件和形成在印刷电路板上的布线区域之间，表面安装有用于将从LED元件发射的光束朝向被照明物体引导的反射器，并且LED元件 并且布线平台通过接合线连接。

公开(公告)号：US20040179359A1

公开(公告)日：2004-09-16

申请号：US10789003

申请日：2004-02-27

Inventor： Hiroshi Miyawaki ,  Masayuki Tamai ,  Ryohei Yamashita

IPC: F21V009/00

CPC classification number: H04N1/02815 ,  F21K9/00 ,  F21V23/003 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/3011 ,  H04N1/02865 ,  H04N2201/0404 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light source unit includes a substrate mounting a plurality of light emitting diodes (LED's) for irradiating beam to an object. The substrate is formed of a material having high heat conductivity and the unit includes a chip resistor mounted on the substrate and heat generation controller for heating the substrate with heat generated in the chip resistor upon supply of power to the chip resistor. The plural LED's are arranged in the form of an array on the substrate and a plurality of the chip resistors are arranged linearly along the array of LED's.

Abstract translation: 光源单元包括安装用于将光束照射到物体的多个发光二极管（LED）的基板。 基板由具有高导热性的材料形成，该单元包括安装在基板上的芯片电阻器和用于在向芯片电阻器供电时在芯片电阻器中产生的热量加热基板的发热控制器。 多个LED以阵列形式布置在基板上，并且多个芯片电阻器沿LED阵列线性布置。

公开(公告)号：US20040118595A1

公开(公告)日：2004-06-24

申请号：US10731390

申请日：2003-12-08

Inventor： Jeffrey D. Flammer ,  Robert Forcier

IPC: H05K001/14

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09536 ,  H05K2201/09745 ,  H05K2203/1572 ,  H05K2203/302 ,  Y10T29/49126

Abstract: A rigid-flex circuit board system that can be manufactured using less expensive and more reliable rigid circuit board methods and equipment, and can maintain rigidity and dimensional stability until the time when it is first desired to flex.

Abstract translation: 可以使用更便宜和更可靠的刚性电路板方法和设备制造的刚性 - 柔性电路板系统，并且可以保持刚性和尺寸稳定性，直到首次需要弯曲时为止。

公开(公告)号：US06647620B1

公开(公告)日：2003-11-18

申请号：US09680473

申请日：2000-10-06

Applicant: Tongbi Jiang ,  Alan G. Wood

Inventor： Tongbi Jiang ,  Alan G. Wood

IPC: H05K330

CPC classification number: H01L24/81 ,  H01L23/4985 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/53122 ,  Y10T29/53343 ,  Y10T29/53348 ,  Y10T29/53352 ,  H01L2924/00

Abstract: A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is sized and configured to receive a conductive connecting structure. The elastomeric material has a gap at the seat to allow electrical connection of the conductive connecting structure with a semiconductor die.

Abstract translation: 描述了一种中心键倒装芯片器件载体及其制造和使用方法。 该方法包括在衬底上的至少一个迹线中形成具有切口部分的座，并在衬底上提供弹性体材料。 座椅的尺寸和构造适于接纳导电连接结构。 弹性体材料在座处具有间隙，以允许导电连接结构与半导体管芯的电连接。

公开(公告)号：US06633488B1

公开(公告)日：2003-10-14

申请号：US09452060

申请日：1999-11-30

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H05K714

CPC classification number: H05K3/0061 ,  H05K7/1461 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A printed circuit board unit comprising a printed circuit board and a correction member. The correction member contacts the printed circuit board at a pair of contact points and support points arranged between the contact points. The support points are defined at a position withdrawing from a plane including the contact points. Screws serve to urge the printed circuit board against the correction member. The correction member is adapted to generate an intentional warp or bend. Such warp serves to correct or modify the curvature of the front surface of the printed circuit board. The front surface of the printed circuit board can be maintained flat.

Abstract translation: 一种印刷电路板单元，包括印刷电路板和校正构件。 校正构件在布置在接触点之间的一对接触点和支撑点处接触印刷电路板。 支撑点被限定在从包括接触点的平面退出的位置处。 螺丝用于将印刷电路板推向校正构件。 校正构件适于产生有意的翘曲或弯曲。 这种翘曲用于校正或改变印刷电路板的前表面的曲率。 印刷电路板的前表面可以保持平坦。

公开(公告)号：US06624512B2

公开(公告)日：2003-09-23

申请号：US10157981

申请日：2002-05-31

Applicant: Hitoshi Kurusu

Inventor： Hitoshi Kurusu

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/544 ,  H01L29/0657 ,  H01L2223/54473 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/30105 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10674 ,  H05K2203/0455 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor integrated circuit device and a printed wired board which self-align to each other in an exact and precise manner. The semiconductor integrated circuit device has conductive bumps. The printed wired board has conductive recessed members at positions corresponding to the conductive bumps. Each of the conductive bumps is fitted into the corresponding conductive recessed member so that the printed wired board is aligned with the semiconductor integrated circuit device.

Abstract translation: 半导体集成电路器件和印刷线路板，其精确和精确地彼此自对准。 半导体集成电路器件具有导电凸块。 印刷布线板在与导电凸块相对应的位置处具有导电凹槽。 每个导电凸块装配到相应的导电凹进部件中，使得印刷的布线板与半导体集成电路器件对准。

公开(公告)号：US06590286B2

公开(公告)日：2003-07-08

申请号：US09983127

申请日：2001-10-23

Applicant: Makio Okada ,  Yasushi Kasatani ,  Tomoaki Hashimoto

Inventor： Makio Okada ,  Yasushi Kasatani ,  Tomoaki Hashimoto

IPC: H01L2348

CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/0949 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/0465 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05147

Abstract: A land grid array semiconductor device provides greater positioning accuracy for an external electrode with respect to a mounting substrate. External electrodes are arranged on one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. Each external electrode pad includes a first pad layer having a cylindrical shape and a second pad layer covering the surface of the first pad layer and having a conical shape.

Abstract translation: 陆地阵列半导体器件相对于安装基板为外部电极提供更大的定位精度。 外部电极以区域阵列布置在基板的一个表面上。 外部电极包括外部电极焊盘和外部电极互连。 每个外部电极焊盘包括具有圆柱形状的第一焊盘层和覆盖第一焊盘层的表面并且具有圆锥形状的第二焊盘层。

公开(公告)号：US06585903B1

公开(公告)日：2003-07-01

申请号：US09655985

申请日：2000-09-06

Applicant: Robert Edward Belke, Jr. ,  Vivek A. Jairazbhoy ,  Thomas B. Krautheim ,  William F. Quitty, Jr.

Inventor： Robert Edward Belke, Jr. ,  Vivek A. Jairazbhoy ,  Thomas B. Krautheim ,  William F. Quitty, Jr.

IPC: C23F100

CPC classification number: H05K3/44 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/09854 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.

Abstract translation: 多层电子电路板设计10具有选择性地形成的孔或空腔26，其通过使第一绝缘层与多层电子电路板10的第一导电层的一部分分离而具有改善的焊料润湿特性，其允许 用于与部分或全部各种部件容纳表面之间进行通信，以及形成的多层电路板10的部分，其选择性地允许包含在这些部分和表面内部和/或之上的部件互连。

公开(公告)号：US06583517B1

公开(公告)日：2003-06-24

申请号：US10119491

申请日：2002-04-09

Applicant: Miguel A. Jimarez

Inventor： Miguel A. Jimarez

IPC: H01L2348

CPC classification number: H01L24/16 ,  H01L23/488 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/09745 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/01011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and structure to electrically and mechanically join a first a first electrically conductive pad on a first substrate to a second electrically conductive pad on a second substrate using a solder joint that includes a low-melt solder alloy composition. The second electrically conductive pad has a geometry that compels a gap size of a gap between the first substrate and the second substrate to exceed a distance between the first substrate and a surface of the second pad.

Abstract translation: 一种使用包括低熔点焊料合金组合物的焊点将第一基板上的第一第一导电焊盘电连接到第二基板上的第二导电焊盘的方法和结构。 第二导电焊盘具有几何形状，其强迫第一基板和第二基板之间的间隙的间隙尺寸超过第一基板和第二垫的表面之间的距离。