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    BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS
    331.
    发明申请
    BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS 有权
    BGA结构在高应力区域使用CTF BALLS

    公开(公告)号：US20140092572A1

    公开(公告)日：2014-04-03

    申请号：US13631683

    申请日：2012-09-28

    Applicant: MD Altaf Hossain ,  Scott A. Gilbert

    Inventor： MD Altaf Hossain ,  Scott A. Gilbert

    IPC: H05K1/11 ,  H05K13/00

    CPC classification number: H05K3/3436 ,  B23K31/02 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3478 ,  H05K2201/09745 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

    Abstract translation: 公开了一种在阵列的高应力区域具有较大焊球的BGA结构。 较大的焊球具有较高的焊点可靠性（SJR），因此可被指定为关键功能（CTF），因此高应力区域中较大的焊球在电路板和安装在其上的封装之间承载输入/输出信号。 通过将封装基板，电路板或封装基板和电路板两者中的每个球凹入来容纳较大的焊球。 另外，公开了一种用于安装具有不同平均直径的多个焊球的球附着方法。

    Flex-rigid wiring board and method for manufacturing the same
    334.
    发明授权
    Flex-rigid wiring board and method for manufacturing the same 有权
    挠性刚性接线板及其制造方法

    公开(公告)号：US08658904B2

    公开(公告)日：2014-02-25

    申请号：US12914064

    申请日：2010-10-28

    Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H05K1/03

    CPC classification number: H05K3/4691 ,  H05K1/025 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4053 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745

    Abstract: A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.

    Abstract translation: 一种挠性刚性布线板，包括柔性布线板，位于所述柔性板的一侧的第一绝缘层，并且具有穿过所述第一层的第一孔，所述第一层上的第二绝缘层和所述柔性板的端部 并且沿着第一孔的轴线穿过第二层的第二孔，在第二层的相对侧的第一层和柔性板的端部之上的第三绝缘层和穿过第三层的第三孔 沿着第一孔的轴线，具有在第一孔中的填充导体的第一结构，具有沿着第一结构的轴线的第二孔中的填充导体的第二结构，以及在第三孔中具有填充导体的第三结构 孔沿着第一结构的轴线。

    CONTACT SURFACE ARRANGED ON A CARRIER FOR CONNECTING TO A COUNTER CONTACT SURFACE ARRANGED ON A FURTHER CARRIER, AND DEVICE COMPRISING A CONTACT SURFACE AND A COUNTER CONTACT SURFACE CONNECTED THERETO
    335.
    发明申请
    CONTACT SURFACE ARRANGED ON A CARRIER FOR CONNECTING TO A COUNTER CONTACT SURFACE ARRANGED ON A FURTHER CARRIER, AND DEVICE COMPRISING A CONTACT SURFACE AND A COUNTER CONTACT SURFACE CONNECTED THERETO 有权
    接触表面安装在承载件上，用于连接到另一个承载件上的计数器接触表面，以及包含接触表面的设备和连接的计数器接触表面

    公开(公告)号：US20140048325A1

    公开(公告)日：2014-02-20

    申请号：US14113597

    申请日：2012-04-17

    Applicant: Angelika Schingale ,  Frank Baur

    Inventor： Angelika Schingale ,  Frank Baur

    IPC: H05K1/11

    CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H05K1/0272 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/09781 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The contact area includes at least one recess forming a drain channel for the adhesive, extending from one edge of the contact area to an opposing edge and having a width being less than an average diameter of the particles. Alternatively, the contact area includes boreholes extending from a main surface to an opposing main surface and having diameters being approximately equal to or smaller than the average diameter of the particles in at least one direction and a cavity is formed in the carrier beneath the contact area. Alternatively, integral moldings forming a turf structure are provided on the contact area and distances between the moldings are equal to or smaller than the average diameter of the particles in at least one direction.

    Abstract translation: 接触区域设置在载体上，用于使用含有导电颗粒的粘合剂连接到另一载体上的配合接触区域。 接触区域包括形成用于粘合剂的排出通道的至少一个凹部，从接触区域的一个边缘延伸到相对的边缘并且具有小于颗粒的平均直径的宽度。 或者，接触区域包括从主表面延伸到相对的主表面的钻孔，并且其直径在至少一个方向上大约等于或小于颗粒的平均直径，并且空腔形成在接触区域下方的载体中 。 或者，形成草皮结构的整体模制品设置在接触区域上，并且模制品之间的距离等于或小于颗粒在至少一个方向上的平均直径。

    WIRING SUBSTRATE
    336.
    发明申请
    WIRING SUBSTRATE 审中-公开
    接线基板

    公开(公告)号：US20140027170A1

    公开(公告)日：2014-01-30

    申请号：US14009856

    申请日：2012-01-06

    Applicant: Hitoshi Shimadu ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

    Inventor： Hitoshi Shimadu ,  Takehiko Sawada ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

    IPC: H05K1/02

    CPC classification number: H05K1/02 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/1031 ,  H05K2203/0195 ,  H05K2203/0323 ,  Y02P70/611

    Abstract: A wiring substrate (10, 40, 60, 80) includes a wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) and an insulating layer (11, 26, 48, 81) to which the wiring pattern is fixed. The insulating layer includes an edge. The wiring pattern (13, 21, 41, 43, 65, 83a, 83b, 83c) includes a joint portion (14, 44, 66) connected with the insulating layer (11, 26, 48, 81) and an extended portion (45, 45, 67, 85) that extends from the joint portion (14, 44, 66) and protrudes from the edge of the insulating layer (11, 26, 48, 81). The insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66) includes an outermost surface. A connection terminal (T, T1) is provided by bending the extended portion (45, 45, 67, 85) so that a part of the extended portion (45, 45, 67, 85) is protruded from the outermost surface of the insulating layer (11, 26, 48, 81) or the joint portion (14, 44, 66).

    Abstract translation: 布线基板（10,40,60,80）包括配线图案（13,21,41,43,65,83a，83b，83c）和绝缘层（11,26,48,81），布线基板 图案是固定的。 绝缘层包括边缘。 布线图案（13,21,41,43,65,83a，83b，83c）包括与绝缘层（11,26,48,81）连接的接合部（14,44,66）和延伸部 （14,44,66）延伸并且从绝缘层（11,26,48,81）的边缘突出。 绝缘层（11,26,48,81）或接头部分（14,44,66）包括最外表面。 连接端子（T，T1）通过弯曲延伸部分（45,45,67,85）而设置，使得延伸部分（45,45,67,85）的一部分从绝缘体的最外表面突出 层（11,26,48,81）或接头部分（14,44,66）。

    PRINTED WIRING BOARD AND SOLDERING METHOD
    337.
    发明申请
    PRINTED WIRING BOARD AND SOLDERING METHOD 审中-公开
    印刷线路板和焊接方法

    公开(公告)号：US20130327563A1

    公开(公告)日：2013-12-12

    申请号：US13908865

    申请日：2013-06-03

    Applicant: FUJITSU LIMITED

    Inventor： Takahiro KITAGAWA

    IPC: H05K13/04 ,  H05K1/18

    CPC classification number: H05K13/04 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/045 ,  H05K2203/046

    Abstract: There is provided a printed wiring board which includes a substrate, and a soldering portion disposed on the substrate, an electronic component being to be soldered to the solder portion. The soldering portion includes a first conductor to which a solder paste is applied, and a plurality of second conductors extends in a direction away from the first conductor, where the plurality of second conductors extend parallel to each other and linearly.

    Abstract translation: 提供一种印刷电路板，其包括基板和设置在基板上的焊接部分，要焊接到焊料部分的电子部件。 焊接部分包括施加焊膏的第一导体，并且多个第二导体沿远离第一导体的方向延伸，其中多个第二导体彼此平行延伸并线性延伸。

    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
    339.
    发明申请
    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 有权
    有线电路板及其制造方法

    公开(公告)号：US20130319748A1

    公开(公告)日：2013-12-05

    申请号：US13889839

    申请日：2013-05-08

    Applicant: NITTO DENKO CORPORATION

    Inventor： Jun ISHII ,  Saori KANEZAKI

    IPC: H05K1/02 ,  H05K3/42

    CPC classification number: H05K1/0298 ,  G11B5/484 ,  G11B5/4873 ,  H05K1/053 ,  H05K1/111 ,  H05K3/321 ,  H05K3/42 ,  H05K2201/09745 ,  H05K2201/10083 ,  Y02P70/611

    Abstract: A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

    Abstract translation: 布线电路板包括：绝缘层，形成有沿着布线电路板的厚度方向延伸穿过的开口;导电层，形成在绝缘层的厚度方向的一个表面上，并且包括单面端子部， 形成在绝缘层的厚度方向的另一个表面上的另一侧端子部分，当沿着厚度方向突出时设置成与开口和单侧端子部分重叠，并且用于连接到电子元件 通过导电粘合剂和填充该开口的导电部分，以在一侧端子部分和另一侧端子部分之间提供导电。

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