公开(公告)号：US09974182B2

公开(公告)日：2018-05-15

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09705216B2

公开(公告)日：2017-07-11

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan Weale ,  Julian Peter Mayes

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R13/658 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US09668344B2

公开(公告)日：2017-05-30

申请号：US14878891

申请日：2015-10-08

Applicant: SK hynix Inc.

Inventor： Won Duck Jung ,  Jong Ho Lee ,  Joo Hyun Kang ,  Chong Ho Cho ,  In Chul Hwang

IPC: H05K7/00 ,  H05K7/12 ,  H05K1/11 ,  H01L27/115 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L27/115 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/145 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/09209 ,  H05K2201/10159 ,  H05K2201/10287 ,  H05K2201/10613 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099

Abstract: A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.

公开(公告)号：US09485850B2

公开(公告)日：2016-11-01

申请号：US13951603

申请日：2013-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuteru Fukumoto

IPC: H05K1/02 ,  H01L21/64 ,  H05K3/34 ,  H01L23/34

CPC classification number: H05K1/0201 ,  H01L21/64 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/3447 ,  H05K2201/10522 ,  H05K2201/10757 ,  H01L2924/00

Abstract: A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.

Abstract translation: 电路装置包括具有引线端子和热检测元件的热检测元件，包括引线端子的发热电子部件和包括布线图案，孔和焊盘的基板，热检测部件和发热电子 部件通过其引线端子与基板电连接，其中热检测部件的引线端子弯曲成U形或大致U形的构造，使得弯曲引线端子部分地与发热电子 并且发热电子部件被夹在导热端子的部分和热检测部件的热检测元件之间。

公开(公告)号：US20160316564A1

公开(公告)日：2016-10-27

申请号：US15097018

申请日：2016-04-12

Applicant: Braun GmbH

Inventor： Christian ELLSAESSER

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/184 ,  H05K1/115 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/1009 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2203/046 ,  H05K2203/1173

Abstract: A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

Abstract translation: 具有至少一个用于将特殊电气部件焊接到印刷电路板的焊接销的电动机，蓄电池或电子组件的特殊电气部件。 焊接销具有连接端，其包括在焊接销的自由端处的前部部分和与前部部分相邻的第一部分。 前部的宽度小于第一部分的宽度。 一种印刷电路板组件和包括至少一个特殊电气部件的电气装置。

公开(公告)号：US20160316559A1

公开(公告)日：2016-10-27

申请号：US14878891

申请日：2015-10-08

Applicant: SK hynix Inc.

Inventor： Won Duck JUNG ,  Jong Ho LEE ,  Joo Hyun KANG ,  Chong Ho CHO ,  In Chul HWANG

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L27/115 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81897 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/145 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/09209 ,  H05K2201/10159 ,  H05K2201/10287 ,  H05K2201/10613 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099

Abstract: A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.

Abstract translation: 半导体封装可以包括第一衬底，其包括设置在第一衬底的表面上的第一连接部分和包括设置在第二衬底的表面上的第二连接部分的第二衬底。 第二基板可以设置在第一基板上，第二连接部分面向第一连接部分。 可以提供第一连接环部分以包括连接到第一连接部分的端部。 可以提供第二连接环部分以包括连接到第二连接部分的一端和与第一连接环部分组合的另一端。

公开(公告)号：US09332655B2

公开(公告)日：2016-05-03

申请号：US14138673

申请日：2013-12-23

Applicant: Hiroyuki Basho ,  Katsuhiko Maeda ,  Masashi Suzuki ,  Yuugo Matsuura

Inventor： Hiroyuki Basho ,  Katsuhiko Maeda ,  Masashi Suzuki ,  Yuugo Matsuura

IPC: H01R9/00 ,  H05K3/34 ,  H05K3/30 ,  B41J2/47

CPC classification number: H05K3/3447 ,  B41J2/473 ,  H05K3/308 ,  H05K2201/09072 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10757 ,  H05K2203/0195 ,  Y10T29/49142

Abstract: An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing the electronic circuit on which the electronic component is mounted on the substrate are described. The electronic component has a plurality of lead pins to be electrically connected to wirings on the substrate. The substrate is formed with a hole having a larger dimension than a maximum distance between at least two lead pins of the lead pins. The lead pins are inserted into the hole from sides of tips of the lead pins while being bent at a plurality of bending portions, and fixed to the substrate by a solder.

Abstract translation: 具有安装在基板上的电子部件的电子电路，具有该电子电路的光源装置以及将电子部件安装在基板上的电子电路的制造方法。 电子部件具有多个引脚以与基板上的布线电连接。 衬底形成有具有比引脚引脚的至少两个引脚之间的最大距离更大的尺寸的孔。 引脚在多个弯曲部分弯曲的同时从引脚的尖端的侧面插入孔中，并通过焊料固定到基板。

公开(公告)号：US20160043028A1

公开(公告)日：2016-02-11

申请号：US14819755

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Hirotoshi USUI

IPC: H01L23/498 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/49861 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/467 ,  H01L23/49555 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10469 ,  H05K2201/10757 ,  H05K2201/10795 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract translation: 封装在衬底中的衬底包括具有能够接触外部的表面的裸露焊盘; 布置在与所述裸露焊盘的表面相对的表面上的半导体芯片; 用于模制半导体芯片的模塑树脂; 以及从模制树脂的侧表面延伸并具有加工形状的前端部的引线框架。 引线框架的前端部被切割成具有相对于封装的顶表面由引线框架的延伸的直线形成的锐角的切割角。

公开(公告)号：US20150373860A1

公开(公告)日：2015-12-24

申请号：US14688443

申请日：2015-04-16

Applicant: DELTA ELECTRONICS (Chen Zhou) CO., LTD.

Inventor： Wangjun HE ,  Jung-jui WANG ,  Shaofeng YU

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K1/181 ,  H04Q1/00 ,  H05K1/14 ,  H05K3/366 ,  H05K2201/047 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  Y10T29/49119

Abstract: An electric connector, a plug-in module thereof and a production method of the plug-in module are provided. The plug-in module comprises a base, an input unit, an output unit and an output end. The base comprises a top plate, a bottom plate and one connection plate. A plurality of input terminals and a plurality of intermediate terminals are fixed to the base. The input unit comprises one input circuit board provided vertically to the base and electrically coupled to an end portion of the input terminals. At least one channel are provided on the input circuit board. Each channel comprises a transformer electrically coupled to the input circuit board. The output unit comprises an output circuit board horizontally provided to the base and electrically coupled to the input circuit board via the intermediate terminals. The output end are fixed to and electrically coupled to the output circuit board.

Abstract translation: 提供电连接器，插件模块和插件模块的制造方法。 插件模块包括基座，输入单元，输出单元和输出端。 基座包括顶板，底板和一个连接板。 多个输入端子和多个中间端子固定到基座。 输入单元包括垂直于基座设置并电耦合到输入端的端部的一个输入电路板。 在输入电路板上至少提供一个通道。 每个通道包括电耦合到输入电路板的变压器。 该输出单元包括一个输出电路板，该输出电路板水平地设置在基座上，并通过中间端子电连接到输入电路板。 输出端固定到电耦合到输出电路板。

公开(公告)号：US20150271922A1

公开(公告)日：2015-09-24

申请号：US14428008

申请日：2012-11-13

Applicant: Ryohei Kawabata ,  Yuichiro Takarabe

Inventor： Ryohei Kawabata ,  Yuichiro Takarabe

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/18 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10969

Abstract: A printed circuit board mounted with a power module having both a plurality of lead terminals for soldering and at least one screw terminal for screwing includes a through hole which receives the lead terminal and is soldered to the lead terminal, and an electrode section provided with a screw hole fastened to the screw terminal via a screw. A groove is formed between the electrode section and the through hole so as to intersect with two common tangents each connecting, to an outer periphery of a land of the through hole, an outer periphery of a contact area of the electrode section which is in contact with a head bearing surface of a screw or a washer.

Abstract translation: 安装有具有用于焊接的多个引线端子和用于螺纹连接的至少一个螺钉端子的功率模块的印刷电路板包括：接纳引线端子并被焊接到引线端子的通孔;以及电极部， 螺丝孔通过螺钉固定在螺丝端子上。 在电极部分和通孔之间形成一个沟槽，以便与两个共同的切线相交，所述两个共同的切线连接到通孔的焊盘的外围，与接触的电极部分的接触区域的外周 具有螺钉或垫圈的头部轴承表面。