摘要:
A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.
摘要:
A technique for nanodevice is provided. A reservoir is filled with an ionic fluid. A membrane separates the reservoir, and the membrane includes electrode layers separated by insulating layers in which the electrode layers have an organic coating. A nanopore is formed through the membrane, and the organic coating on the electrode layers forms transient bonds to a base of a molecule in the nanopore. When a first voltage is applied to the electrode layers a tunneling current is generated by the base in the nanopore, and the tunneling current travels through the transient bonds formed to the base to be measured as a current signature for distinguishing the base.
摘要:
The invention is an article of manufacture, comprising an identifying marker disposed in a pharmaceutical product. The pharmaceutical product may be selected from the group consisting of a pharmaceutical liquid, a pill, a tablet, a caplet, and a capsule. The identifying marker may be a hydroscopic medium having an indicia imprinted thereon or within, where the marker expands volumetrically when contacted with a liquid.
摘要:
A method for forming a space transformer (and a space transformer formed by the method) having a first plate and a second plate, the plates being separated by a frame, and electrical connectors for providing electrical connections between electrical contacts which are relatively closely spaced on the first plate and relatively more widely spaced on the second plate. The method comprises attaching first ends of wires to first electrically conductive regions on the first plate; forming insulating layers over the wires; forming electrically conductive coverings over the insulating layers; and connecting second ends of the wires to second electrically conductive regions on the second plate.
摘要:
A method for testing integrated circuit chips with probe wires on flat solder bumps and IC chips that are equipped with flat solder bumps are disclosed. In the method, an IC chip that has a multiplicity of bond pads and a multiplicity of flat solder bumps are first provided in which each of the solder bumps has a height less than ½ of its diameter on the multiplicity of bond pads. The probe wires can thus be easily used to contact the increased target area on the solder bumps for establishing electrical connection with a test circuit. The probe can further be conducted easily with all the Z height of the bumps are substantially equal. The height of the solder bumps may be suitably controlled by either a planarization process in which soft solder bumps are compressed by a planar surface, or solder bumps are formed in an in-situ mold by either a MSS or an electroplating process for forming solder bumps in the shape of short cylinders. When the MSS method is used for planting the bumps, solder bumps are transferred onto the wafer surface in a substantially flattened hemi-spherical shape.
摘要:
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
摘要:
An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.
摘要:
A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.
摘要:
Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
摘要:
This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.
摘要翻译:本发明涉及一种陶瓷模块以及通过多层陶瓷模块10的表面18的选择性磨损来形成突出的,直立的导电销的方法。喷砂装置40邻近表面18设置,用于引导 研磨颗粒42抵靠表面。 颗粒42撞击金属导体20和22以及层14的陶瓷材料。由于与延性金属导体相比,陶瓷材料相对硬且脆,研磨颗粒42以更快的速度磨掉陶瓷层14 导体20和22的韧性金属材料的比率。磨料颗粒42可以由任何合适的研磨剂,例如Al 2 O 3,SiC或WC组成。 模块可以在喷砂装置的喷嘴下方旋转,喷嘴在被磨损的表面上线性平移。