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31.
公开(公告)号:US20130115735A1
公开(公告)日:2013-05-09
申请号:US13289719
申请日:2011-11-04
申请人: Meng-Tse Chen , Hsiu-Jen Lin , Chun-Cheng Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
发明人: Meng-Tse Chen , Hsiu-Jen Lin , Chun-Cheng Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号: H01L24/97 , B29C33/68 , B29C43/18 , H01L21/563 , H01L21/566 , H01L2224/16225 , H01L2924/01322 , H01L2924/181 , H01L2924/00
摘要: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.
摘要翻译: 用于成型模制底部填料的方法和装置。 公开了一种方法,其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中,同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度,以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。
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公开(公告)号:US20130102112A1
公开(公告)日:2013-04-25
申请号:US13280163
申请日:2011-10-24
申请人: Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
发明人: Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号: H01L24/75 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L24/97 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75272 , H01L2224/75314 , H01L2224/75704 , H01L2224/7598 , H01L2224/81191 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2224/94 , H01L2224/97 , H01L2924/00012 , H01L2924/00014 , H01L2224/81 , H01L2924/014
摘要: A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.
摘要翻译: 一种方法包括将第一包装部件装载在凹形船上,以及将第二包装部件放置在第一包装部件上。 负载夹具放置在第二包装部件上,其中负载夹具由凹形舟皿的温度可变的间隔件支撑。 执行回流步骤以将第二包装部件粘合到第一包装部件。 在回流步骤的升温步骤期间,温度可变的间隔件响应于温度升高而软化,并且软化的温度可变间隔件的高度减小,直到负载夹具被刚性间隔件 凹船。
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公开(公告)号:US20140054764A1
公开(公告)日:2014-02-27
申请号:US13594544
申请日:2012-08-24
申请人: Wen-Hsiung Lu , Ming-Da Cheng , Yi-Wen Wu , Yu-Peng Tsai , Chia-Wei Tu , Chung-Shi Liu
发明人: Wen-Hsiung Lu , Ming-Da Cheng , Yi-Wen Wu , Yu-Peng Tsai , Chia-Wei Tu , Chung-Shi Liu
IPC分类号: H01L23/498 , H01L21/768
CPC分类号: H01L21/56 , H01L21/566 , H01L23/293 , H01L23/3171 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0391 , H01L2224/0401 , H01L2224/05005 , H01L2224/05022 , H01L2224/05027 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05541 , H01L2224/05556 , H01L2224/05558 , H01L2224/05567 , H01L2224/05572 , H01L2224/05611 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10126 , H01L2224/11831 , H01L2224/1191 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/04953 , H01L2924/04941 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2924/206 , H01L2224/05552 , H01L2924/00
摘要: A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.
摘要翻译: 半导体封装包括半导体衬底,覆盖半导体衬底的接触焊盘,覆盖接触焊盘的互连层,形成在接触焊盘和互连层之间的钝化层,覆盖在互连层上的凸起以及覆盖在该互连层上的保护层 互连层和钝化层并覆盖凸块的下部。 保护层包括弯曲表面区域。
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公开(公告)号:US20130328190A1
公开(公告)日:2013-12-12
申请号:US13492285
申请日:2012-06-08
申请人: Yi-Wen Wu , Ming-Che Ho , Wen-Hsiung Lu , Chia-Wei Tu , Chung-Shi Liu
发明人: Yi-Wen Wu , Ming-Che Ho , Wen-Hsiung Lu , Chia-Wei Tu , Chung-Shi Liu
IPC分类号: H01L23/498 , H01L21/768
CPC分类号: H01L24/06 , H01L23/3114 , H01L23/3192 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02331 , H01L2224/02351 , H01L2224/02375 , H01L2224/02381 , H01L2224/03828 , H01L2224/0401 , H01L2224/05548 , H01L2224/05551 , H01L2224/05557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/06051 , H01L2224/10145 , H01L2224/11334 , H01L2224/13021 , H01L2224/13024 , H01L2224/13027 , H01L2224/131 , H01L2224/13111 , H01L2924/00014 , H01L2924/01322 , H01L2924/01023 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need.
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公开(公告)号:US09449933B2
公开(公告)日:2016-09-20
申请号:US13434256
申请日:2012-03-29
申请人: Chang-Chia Huang , Tsung-Shu Lin , Ming-Da Cheng , Wen-Hsiung Lu , Bor-Rung Su
发明人: Chang-Chia Huang , Tsung-Shu Lin , Ming-Da Cheng , Wen-Hsiung Lu , Bor-Rung Su
IPC分类号: H01L21/768 , H01L23/482 , H01L23/00 , H01L23/498
CPC分类号: H01L24/16 , H01L21/28 , H01L21/302 , H01L21/565 , H01L21/76895 , H01L23/48 , H01L23/4824 , H01L23/498 , H01L23/538 , H01L24/03 , H01L24/04 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16238 , H01L2224/81191 , H01L2224/81815 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , H01L2924/00012 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace.
摘要翻译: 一种装置包括第一和第二包装部件。 金属迹线设置在第一包装部件的表面上。 金属迹线具有长度方向。 第二包装部件包括金属支柱,其中第二包装部件设置在第一包装部件上。 焊接区域将金属柱粘合到金属迹线,其中焊料区域接触金属迹线的顶表面。
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公开(公告)号:US20120049346A1
公开(公告)日:2012-03-01
申请号:US12871565
申请日:2010-08-30
申请人: Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
发明人: Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
IPC分类号: H01L23/498 , H01L21/768
CPC分类号: H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
摘要: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
摘要翻译: 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱,在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形,矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。
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公开(公告)号:US08823166B2
公开(公告)日:2014-09-02
申请号:US12871565
申请日:2010-08-30
申请人: Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
发明人: Cheng-Chung Lin , Chung-Shi Liu , Meng-Wei Chou , Kuo Cheng Lin , Wen-Hsiung Lu , Chien Ling Hwang , Ying-Jui Huang , De-Yuan Lu
CPC分类号: H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
摘要: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
摘要翻译: 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱,在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形,矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。
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公开(公告)号:US09196532B2
公开(公告)日:2015-11-24
申请号:US13529179
申请日:2012-06-21
申请人: Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
发明人: Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
IPC分类号: H01L21/78 , H01L23/522 , H01L23/31 , H01L23/00
CPC分类号: H01L23/3135 , H01L21/78 , H01L23/3107 , H01L23/3157 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/15 , H01L2224/02331 , H01L2224/02377 , H01L2224/0401 , H01L2224/0502 , H01L2224/05022 , H01L2224/05099 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05186 , H01L2224/05548 , H01L2224/05567 , H01L2224/05573 , H01L2224/05582 , H01L2224/05599 , H01L2224/05647 , H01L2224/13022 , H01L2224/13024 , H01L2224/13111 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/14 , H01L2224/03 , H01L2224/05 , H01L2924/04941 , H01L2924/04953 , H01L2224/05552
摘要: A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.
摘要翻译: 一种方法包括在晶片的衬底上形成电连接器,并模制聚合物层,至少一部分电连接器模制在聚合物层中。 执行第一锯切步骤以在聚合物层中形成沟槽。 在第一锯切步骤之后,执行第二锯切步骤以将晶片看成多个模具。
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39.
公开(公告)号:US09385076B2
公开(公告)日:2016-07-05
申请号:US13313677
申请日:2011-12-07
申请人: Hsien-Wei Chen , Yi-Wen Wu , Wen-Hsiung Lu
发明人: Hsien-Wei Chen , Yi-Wen Wu , Wen-Hsiung Lu
IPC分类号: H01L23/498 , H01L21/60 , H01L23/00 , H01L23/31
CPC分类号: H01L23/49838 , H01L23/3192 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02125 , H01L2224/02165 , H01L2224/0401 , H01L2224/05008 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05548 , H01L2224/05552 , H01L2224/05567 , H01L2224/05569 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13022 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2924/15788 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2924/01082 , H01L2924/01046 , H01L2924/01079 , H01L2924/01047 , H01L2924/00 , H01L2224/1319
摘要: A semiconductor device includes a post-passivation interconnect (PPI) structure having a landing pad region. A polymer layer is formed on the PPI structure and patterned with a first opening and a second opening to expose portions of the landing pad region. The second opening is a ring-shaped opening surrounding the first opening. A bump structure is formed on the polymer layer to electrically connect the landing pad region through the first opening and the second opening.
摘要翻译: 半导体器件包括具有着陆焊盘区域的后钝化互连(PPI)结构。 聚合物层形成在PPI结构上并用第一开口和第二开口图案化以暴露着陆焊盘区域的部分。 第二开口是围绕第一开口的环形开口。 在聚合物层上形成凸起结构,以通过第一开口和第二开口电连接着陆垫区域。
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公开(公告)号:US20130341800A1
公开(公告)日:2013-12-26
申请号:US13529179
申请日:2012-06-21
申请人: Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
发明人: Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
IPC分类号: H01L21/78 , H01L23/522
CPC分类号: H01L23/3135 , H01L21/78 , H01L23/3107 , H01L23/3157 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/15 , H01L2224/02331 , H01L2224/02377 , H01L2224/0401 , H01L2224/0502 , H01L2224/05022 , H01L2224/05099 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05186 , H01L2224/05548 , H01L2224/05567 , H01L2224/05573 , H01L2224/05582 , H01L2224/05599 , H01L2224/05647 , H01L2224/13022 , H01L2224/13024 , H01L2224/13111 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/14 , H01L2224/03 , H01L2224/05 , H01L2924/04941 , H01L2924/04953 , H01L2224/05552
摘要: A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.
摘要翻译: 一种方法包括在晶片的衬底上形成电连接器,并模制聚合物层,至少一部分电连接器模制在聚合物层中。 执行第一锯切步骤以在聚合物层中形成沟槽。 在第一锯切步骤之后,执行第二锯切步骤以将晶片看成多个模具。
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